Polyimide resins Kerimid

Kerimid. [Rhone Poulenc Plastiques Tech.] Polyimide resins. 

Additive Polyimides. Rhc ne-Poulenc s Kin el molding compound and Kerimid impregnating resin (115), Mitsubishi s BT Resins (116), and Toshiba s Imidaloy Resin (117) are based on bismaleimide (4) technology. Maleic anhydride reacts with a diamine to produce a diimide oligomer (7). Eurther reaction with additional diamine (Michael addition) yields polyaminohismaleimide prepolymer with terminal maleic anhydride double bonds. Cure is achieved by free-radical polymerization through the terminal double bonds. 

The historically-firet condensation polyimides have recently been complanented by a second class of resins - addition-type polyimides. KINEL conqpounds and KERIMID 601 laminating resin are menbers of this new family of polyimides. Ch ically they eure designated polyaminobismaleimides (PABMs) ... 

KINEL molding powders and KERIMID 601 leuninating resins dre based on a thermosetting polyimide, which cures without evolution of volatiles. KINEL compounds are transformed by compression, transfer, or extrusion molding into void-free parts, whose thermomechanical properties exceed those attainable from conventional thermoplastics or thermosets. 

OUgomers end-capped with maleimide rings, which are known as bismaleimide (BMI) resins, exhibit thermal stability intermediate between epoxies and polyimides. BMI systems are mainly used to fabricate structural composites capable of sustaining temperatures up to 230 °C. Specific versions, such as CYTEC FM 32 and Ciba-Geigy Kerimid 601, have been developed to prepare adhesive compositions. Figure 9.17 displays a typical constitutive unit of various couunercial BMI resins based on BMI 38, prepared from maleic anhydride 37 and 4,4 -methylenebisbenzeneamine (MDA) 34. 

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