Polyimide characteristics

Inherent viscosities (Tiinh) of the poly(amic acid)s were as low as 0.08-0.23, however, they formed flexible and tough films. In the IR spectra of nonaromatic polyimides, characteristic imide absorptions at 1767 cm"1 (asym C=0 str.) and 1699-1703 cm 1 (sym C=0 str.) were observed, and the absorptions of amic acid groups have practically disappeared. 

Polyimide. Polyimide is a biaxiaHy oriented high performance film that is tough, flexible, and temperature- and combustion-resistant. Its room temperature properties compare to poly(ethylene terephthalate), but it retains these good characteristics at temperatures above 400°C. Its electrical resistance is good and it is dimensionally stable. The principal detriment is fairly high moisture absorbance. The main uses are for electrical insulation, particularly where high temperatures are prevalent or ionizing radiation is a problem. The films may be coated to reduce water absorption and enhance... 

A number of thermally stable polymers have been synthesized, but in general the types of stmctures that impart thermal resistance also result in poor processing characteristics. Attempts to overcome this problem have largely been concentrated on the incorporation of flexible groups into the backbone or the attachment of stable pendent groups. Among the class of polymers claimed to be thermally stable only a few have achieved technological importance, some of which are polyamides, polyimides, polyquin oxalines, polyquinolines, and polybenzimidazoles. Of these, polyimides have been the most widely explored. 

Polyimide and Melamine. These are both low density, essentially open-ceU foams used as pipe insulations, particularly those involved with fluids operating at temperatures up to 530 K. Because these foams operate at higher temperatures and have improved flammabiHty characteristics compared to other foams, they are also used for some aircraft and marine appHcations. 

Printed circuit boards manufacture is aided by the use of KMnO. Alkaline permanganate solution is used to remove resin smeared on the interior hole wall of multilayered printed circuit boards. Additionally the hole wall is etched, resulting in a surface with excellent adhesion characteristics, for electrodeless copper (250). The alkaline permanganate etchback system containing >60 g/L KMnO and 40-80 g/L NaOH at 70—80°C, is effective for difunctional, tetrafiinctional, and polyimide resin substrates, where the level of etchback is direcdy proportional to the immersion time (10—20 min) (251). 

For reasons that are not fiiUy understood, PPSF exhibits generally improved compatibiUty characteristics over either PSF or PES in a number of systems. An example of this is blends of PPSF with polyaryletherketones (39,40). These blends form extremely finely dispersed systems with synergistic strength, impact, and environmental stress cracking resistance properties. Blends of PPSF with either PSF or PES are synergistic in the sense that they exhibit the super-toughness characteristic of PPSF at PSF or PES contents of up to 35 wt % (33,34). The miscibility of PPSF with a special class of polyimides has been discovered and documented (41). The miscibility profile of PPSF with high temperature (T > 230° C) polysulfones has been reported (42). 

Plastics. Almost all commercial plastics find some use both dry and lubricated for sliding at low speeds and light loads the most commonly used thermoplastics are nylon, acetal resins, and polytetrafluoroethylene (PTFE). Typical thermosetting resins for bearing appHcations are phenoHcs, polyesters, and polyimides. Table 8 compares the characteristics of plastic bearing materials with those of graphite, wood, and mbber which find use in somewhat similar appHcations. 

The polyimides have the characteristic functional group below and are thus closely related to the polyamides. However, the branched nature of the... 

The presence of the either linkages is sufficient to allow the material to be melt processed, whilst the polymer retains many of the desirable characteristics of polyimides. As a consequence the material has gained rapid acceptance as a high-temperature engineering thermoplastics material competitive with the poly-sulphones, poly(phenylene sulphides) and polyketones. They exhibit the following key characteristics ... 

Volksem W. Condensation Polyimides Synthesis, Solution Behavior, and Imidization Characteristics. VoL 117, pp, 111-164. 

Recent work has focused on a variety of thermoplastic elastomers and modified thermoplastic polyimides based on the aminopropyl end functionality present in suitably equilibrated polydimethylsiloxanes. Characteristic of these are the urea linked materials described in references 22-25. The chemistry is summarized in Scheme 7. A characteristic stress-strain curve and dynamic mechanical behavior for the urea linked systems in provided in Figures 3 and 4. It was of interest to note that the ultimate properties of the soluble, processible, urea linked copolymers were equivalent to some of the best silica reinforced, chemically crosslinked, silicone rubber... 

However, fluorocarbon compounds might be of considerable interest for LB-layer fabrication. Their dielectric and mechanical characteristics and thermal and chemical stability are not inferior to those of polyimides, and highly developed synthesis technology makes it possible to create systems with various predictable properties. Such films have been found to demonstrate a high degree of perfection and excellent dielectric characteristics.69,70... 

Aromatic polyimides are well known for their unusual array of favorable physical properties, including excellent thermal stability and excimer-laser processing characteristics. The polyimide structure possesses lower-energy transitions such as n —> n, n —> o, n —> n, and a — n (in order of increasing energy71). However, the w — n and o —> n transitions are forbidden by symmetry rules and related absorptions are significantly weaker than those for... 

Additional drawbacks to the use of polyimide insulators for the fabrication of multilevel structures include self- or auto-adhesion. It has been demonstrated that the interfacial strength of polyimide layers sequentially cast and cured depends on the interdiffusion between layers, which in turn depends on the cure time and temperature for both the first layer (Tj) and the combined first and second layers (T2) [3]. In this work, it was shown that unusually high diffusion distances ( 200 nm) were required to achieve bulk strength [3]. For T2 > Tj, the adhesion decreased with increasing T. However, for T2 < Tj and Tj 400 °C, the adhesion between the layers was poor irrespective of T2. Consequently, it is of interest to combine the desirable characteristics of polyimide with other materials in such a way as to produce a low stress, low dielectric constant, self-adhering material with the desirable processabiHty and mechanical properties of polyimide. 

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