Polyamide melting temperature

This type of adhesive is generally useful in the temperature range where the material is either leathery or mbbery, ie, between the glass-transition temperature and the melt temperature. Hot-melt adhesives are based on thermoplastic polymers that may be compounded or uncompounded ethylene—vinyl acetate copolymers, paraffin waxes, polypropylene, phenoxy resins, styrene—butadiene copolymers, ethylene—ethyl acrylate copolymers, and low, and low density polypropylene are used in the compounded state polyesters, polyamides, and polyurethanes are used in the mosdy uncompounded state. 

In the area of moleculady designed hot-melt adhesives, the most widely used resins are the polyamides (qv), formed upon reaction of a diamine and a dimer acid. Dimer acids (qv) are obtained from the Diels-Alder reaction of unsaturated fatty acids. Linoleic acid is an example. Judicious selection of diamine and diacid leads to a wide range of adhesive properties. Typical shear characteristics are in the range of thousands of kilopascals and are dependent upon temperature. Although hot-melt adhesives normally become quite brittle below the glass-transition temperature, these materials can often attain physical properties that approach those of a stmctural adhesive. These properties severely degrade as the material becomes Hquid above the melt temperature. 

Direct amidation is generally carried out ia the melt, although it can be done ia an iaert solvent starting from the dry salt (46). Because most aUphatic polyamides melt ia the range of 200—300°C and aromatic-containing polyamides at even higher temperatures, the reactants and products must be thermally stable to be polymerized via this method. 

Acidolysis, Aminolysis, and Alcoholysis. When heated, polyamides react with monofunctional acids, amines, or alcohols, especially above the melt temperature, to undergo rapid loss of molecular weight (58,59), eg, as in acidolysis (eq. 3) with acetic acid [64-19-7] or aminolysis (eq. 4) with an ahphatic amine ... 

Multiblock Copolymers. Replacement of conventional vulcanized mbber is the main appHcation for the polar polyurethane, polyester, and polyamide block copolymers. Like styrenic block copolymers, they can be molded or extmded using equipment designed for processing thermoplastics. Melt temperatures during processing are between 175 and 225°C, and predrying is requited scrap is reusable. They are mostiy used as essentially pure materials, although some work on blends with various thermoplastics such as plasticized and unplasticized PVC and also ABS and polycarbonate (14,18,67—69) has been reported. Plasticizers intended for use with PVC have also been blended with polyester block copolymers (67). 

This reaction is rapid and can, under anhydrous conditions, be carried out at mild temperatures (60-120°C). The type of leaving group has a strong effect on attainable molecular weights. The polyamide melt syndtesis with dimediyl tereph-thalate has however not been so successful, because N-methylation takes place at high temperatures. This N-methylation is due to die mediyl ester alkylation of die amines and not due to the presence of medianol.28 40 This N-mediylation reaction is significant at temperatures over 200°C. Widi odier esters, N-alkylation takes place to a much lower extent. 

With DMA the effect of temperature on the modulus can be studied. By increasing the temperature from -150 to 300°C, one encounters several transitions in PA (Fig. 3.1). There is a transition at about —120°C, the y-transition, which is due to the mobilization of methylene units. There is also a transition at —30°C, which is present in wetted aliphatic PA this is due to non-H-bonded amide units and is termed the /J-transition. At about 50°C the glass Uansition (Tg) (a-transition) of the aliphatic polyamides PA-6 and PA-6,6 occurs. At this Uansition, the modulus is lowered considerably. For partially aromatic PA, the Tg occurs above 100°C. The last transition is the flow temperature, at which temperature the material melts the flow temperature and the melt temperature, as measured by DSC, correspond well. The modulus is a measure of dimensional stability and increases with crystallinity and filler content (Fig. 3.12). 

Semicrystalline partial aromatic polyamides, 139 Semicrystalline polyesters, 45 Semicrystalline polymers, melting temperatures of, 33 Semirigid foams, 203 tests for, 244 Sensitization, 246... 

TDI isomers, 210 Tear strength tests, 242-243 TEDA. See Triethylene diamine (TEDA) Telechelic oligomers, 456, 457 copolymerization of, 453-454 Telechelics, from polybutadiene, 456-459 TEM technique, 163-164 Temperature, polyamide shear modulus and, 138. See also /3-transition temperature (7)>) Brill temperature Deblocking temperatures //-transition temperature (Ty) Glass transition temperature (7) ) Heat deflection temperature (HDT) Heat distortion temperature (HDT) High-temperature entries Low-temperature entries Melting temperature (Fm) Modulu s - temperature relationship Thermal entries Tensile strength, 3, 242 TEOS. See Tetraethoxysilane (TEOS)... 

Anionic polymerization of s-caprolactam is used to make cast or RIM polyamide-6. Using a premade lactam chain end and a metal catalyst, it proceeds rapidly at 100-160°C, well below the melting temperature of the polymer, Tm 220°C. The propagation differs from anionic propagation of most unsaturated monomers because the growth center at the chain end is not represented by an anionically activated group but by a neutral N-acy-lated lactam, and the anionically activated species is the incoming monomer (Table 2.26). 

In some cases semicrystalline thermoplastics have been used as modifiers (polyamides, polyesters). With these thermoplastics it is necessary to increase the temperature beyond the melting temperature to obtain a solution. 

At their melting temperature these powders can be dissolved in the epoxy monomers and they are able to react and participate in the cross-linking reaction through the amide groups (Lennon et al., 2000). For this reason, the cure cycle must be selected in order to keep the polyamide particles below their melting point (in the range 170°C or 220°C, depending on the type of polyamide used), and thus keep their initial shape and size. But in some cases a partial dissolution of the powder surface can improve the particle-polymer network interactions. 

Temperature plays a significant role for the coefficient of friction p as demonstrated in Fig. 2.66 for polyamide 66 and polyethylene. In the case of polyethylene, the friction first decreases with temperature. At 100°C, the friction increases because the polymer surface becomes tacky. The friction coefficient starts to drop as the melt temperature is approached. A similar behavior can be seen in the polyamide curve. 

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