Polyamide hot melt

Polyetherimide A wide variety of commercially available adhesives can be used in bonding polyetherimide to itself or to dissimilar materials. Among these are polyurethane [(cure at RT to 302°F (150°C)], RTV silicones, hot melts (polyamide types) curing at 401 C (205°C) and epoxies (non-amine type, two-part) (12). 

Hot-melt polyamide resins are obtained by the reaction of diamines with diacids. While in their simplest form polyamides are the reaction of a particular diamide with a particular diamine, most of the polyamides used in adhesive formulations are complex reaction products obtained by combining several diacids and diamines to obtain the particular properties required. The most common diacid used is a dibasic acid obtained by polymerizing oleic or linoleic acid or other unsaturated fatty acids. This acid can be represented as HOOC—R—COOH, where R is a hydrocarbon residue of 34 carbon atoms and of indeterminate configuration. Commercial forms of this dimeric diacid also contain preparations of products obtained by polymerization of three or more molecules of... 

Cyclohexanedimethanol dibenzoate adhesive modifier, hot-melt polyamides... 

Typical adhesives in each class are Liquids 1. Solvent—polyester, vinyl, phenolics acrylics, rubbers, epoxies, polyamide 2. Water—acrylics, rubber-casein 3. Anaerobics—cyanoacrylate 4. Mastics—rubbers, epoxies 5. Hot melts-polyamides, PE, PS, PVA 6. Film—epoxies, polyamide, phenolics 7. Pressure-sensitive—rubbers. 

Elastomeric (nitrile and urethane), hot-melt (polyamide and polyester), and reactive (epo, urethane, acrylic, and ( anoacrylate) adhesives have been used for bonding nylon. 

Hot melt Polyamide, polyester, polyolefin-type 0.001 Less than 0.005 Less than 0.2 Less than 0.05 Less than... 

In addition to the sources mentioned, special hot melt polyamides derived from dimer acid are available from Bostik Division of Emhart Corp., Terrell Industries, and Dexter Hysol. Some of these polymers are listed in Tables 5 and 6. 

This type of adhesive is generally useful in the temperature range where the material is either leathery or mbbery, ie, between the glass-transition temperature and the melt temperature. Hot-melt adhesives are based on thermoplastic polymers that may be compounded or uncompounded ethylene—vinyl acetate copolymers, paraffin waxes, polypropylene, phenoxy resins, styrene—butadiene copolymers, ethylene—ethyl acrylate copolymers, and low, and low density polypropylene are used in the compounded state polyesters, polyamides, and polyurethanes are used in the mosdy uncompounded state. 

In the area of moleculady designed hot-melt adhesives, the most widely used resins are the polyamides (qv), formed upon reaction of a diamine and a dimer acid. Dimer acids (qv) are obtained from the Diels-Alder reaction of unsaturated fatty acids. Linoleic acid is an example. Judicious selection of diamine and diacid leads to a wide range of adhesive properties. Typical shear characteristics are in the range of thousands of kilopascals and are dependent upon temperature. Although hot-melt adhesives normally become quite brittle below the glass-transition temperature, these materials can often attain physical properties that approach those of a stmctural adhesive. These properties severely degrade as the material becomes Hquid above the melt temperature. 

Polyamide Resins. Another class of polyamide resins, in addition to the Hquid resins used as epoxy hardeners, are the thermoplastic type, prepared generaHy by the condensation reaction of polyamines with polybasic fatty acids. These resins find use in certain hot-melt adhesives, coatings, and inks. Diamines, typicaHy EDA (233), are the principal amine reactant however, tri- and tetramines are sometimes used at low levels to achieve specific performance. 

In the adhesives area, thermoplastic, fatty polyamides are used in hot-melt and heat-seal adhesives for leather, paper, plastic and metal. Blends of EDA- and DETA-based polyamides are suggested for use in metal can seam sealants with improved toughness (234) pressure sensitive adhesives have been formulated with DETA-based polyamides (235) and anionic and cationic suspensoid adhesives are used as heat-seal coatings in paper converting (236). PIP and certain PIP derivatives are used with EDA in some appHcations (237). 

For very difficult to adhere bag substrates, such as poly-coated bags, or where extreme chemical resistance is needed, polyamide hot melts are used. These adhesives are very lightly formulated if at all. They provide soft adhesives with outstanding heat and chemical resistance, but at roughly double the price. 

Nylons 6/6 and 6 comprise more than 90% of the polyamide market. The two have similar properties but nylon 6 has a lower Tm (223°C). Small amounts of nylons 6/9, 6/10, 6/12, 11, 12, 12/12, and 4/6 are produced as specialty materials. Those with more methylene groups than nylons 6/6 and 6 have better moisture resistance, dimensional stability, and electrical properties, but the degree of crystallinity, Tm, and mechanical properties are lower. Specialty nylons made from dimerized fatty acids find applications as hot-melt adhesives, crosslinking agents for epoxy resins, and thermographic inks. 

The usefulness of piperazine and its derivatives for the preparation of polyamides has been known for some time, and it is one of the few disecondary diamines which can be employed to prepare high-melting polycondensates. Piperazine polyamides are especially useful as hot melt adhesives (68USP3377303), since they display unusually good adhesion to vinyl-based polymers such as poly(vinyl chloride). Piperazine is also the preferred diamine for the preparation of thermoplastic polyamides which exhibit the combined properties of low melt viscosity, high softening point and impact resistance at low temperatures (80USP4218351). 

More widely used in wood bonding are hot-melt adhesives based on polyamides. A polyamide is formed when a monomer carrying two amine groups (-NH2) is reacted with another carrying two carboxylic acid groups (-COOH). Each amine group, at either end of the molecule, can condense with a carboxylic acid group of the other monomer to form an amide link (-CONH-) with the elimination of a water molecule ... 

The polarity of polyamides that are used as thermoplastic, hot-melt adhesives can be varied by altering the proportion of hydrocarbon (-CH2-) and amide (-CONH-) groups in -CO(CH2),(CONH-(CH2)j,-NH-. They are more expensive than EVAc copolymers, but set more rapidly, and are preferred as edge veneer adhesives in the furniture industry. 

Polycarbonate Conventional adhesives recommended include epoxies, modified epoxies, polyurethanes, acrylics, RTV silicones, cyanoacrylates, one-part elastomers, some epoxy-polyamides, and hot melts (13). 

Naugard 445 is non-discoloring aromatic amine antioxidant that works synergistically with phosphites and phenolic antioxidants as a thermal stabilizer in polyolefins, styrenics, polyols, hot melt adhesives, lubricants, and polyamides. 

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