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Plasticizer deposition

There are many temporary protectives on the market and it would be impracticable to describe them individually. However, they may be classified according to the type of film formed, i.e. soft film, hard film and oil film the soft film may be further sub-divided into solvent-deposited thin film, hot-dip thick film, smearing and slushing types. All these types are removable with common petroleum solvents. There are also strippable types based on plastics (deposited by hot dipping or from solvents) or rubber latex (deposited from emulsions) these do not adhere to the metal surfaces and are removed by peeling. In addition there are volatile corrosion inhibitors (V.C.I.) consisting of substances, the vapour from which inhibits corrosion of ferrous metals. [Pg.756]

One other long-term condition that takes place with relatively low level DC fields in the presence of moisture is the migration of the metal of the conductor into the plastic. This was discovered to be a common thing in the past with silver conductors and phenolic insulators. The first instance of field failures were discovered in telephone equipment. The problem can occur with other metals with phenolic and also conceivably with other plastics that are moisture sensitive and can have a solvating action on the conductor metals that they contact. Most of these type plastics should be avoided inside hermetically sealed containers with movable contacts. Vapors released from the organic plastic deposit on the contacts to produce an insulation layer leading to contact failure. [Pg.228]

The new HPTLC Premium Purity Plate (Merck) is especially designed for demanding pharmacopoeia applications. It is carefully wrapped in a special plastic coated aluminum foil to prevent any plastic deposits from the wrapping material that could appear as an imknown extra zone when using medium-polar solvent systems such as toluene/ ethylacetate (95/5). These plates have no GLP-laser code. [Pg.25]

Electrophoretic Deposition n A direct-current process analogous to electroplating, used to coat electrically-conductive articles with plastics, deposited from aqueous lattices or dispersions. The cathode may be a noncorrodible metal such as stainless steel, generally serving as the container in which the process is performed. The DC potential is usually under 100 V. The deposited coatings are baked to remove residual water. Among available polymer lattices suitable for the process are PVC, polyvinylidene chloride, acrylics, nylons, polyesters, polytetrafluoroethylene, and polyethylene. [Pg.262]

Bromine is used in the manufacture of many important organic compounds including 1,2-dibromoethane (ethylene dibromide), added to petrol to prevent lead deposition which occurs by decomposition of the anti-knock —lead tetraethyl bromomethane (methyl bromide), a fumigating agent, and several compounds used to reduce flammability of polyester plastics and epoxide resins. Silver(I) bromide is used extensively in the photographic industry... [Pg.347]

Finally, in yet another variant, the sample liquid stream and the gas flow are brought together at a shaped nozzle into which the liquid flows (parallel-path nebulizer). Again, the intersection of liquid film and gas flow leads to the formation of an aerosol. Obstruction of the sample flow by formation of deposits is not a problem, and the devices are easily constructed from plastics, making them robust and cheap. [Pg.146]

The Fe, Co, and Ni deposits are extremely fine grained at high current density and pH. Electroless nickel, cobalt, and nickel—cobalt alloy plating from fluoroborate-containing baths yields a deposit of superior corrosion resistance, low stress, and excellent hardenabiUty (114). Lead is plated alone or ia combination with tin, iadium, and antimony (115). Sound iasulators are made as lead—plastic laminates by electrolyticaHy coating Pb from a fluoroborate bath to 0.5 mm on a copper-coated nylon or polypropylene film (116) (see Insulation, acoustic). Steel plates can be simultaneously electrocoated with lead and poly(tetrafluoroethylene) (117). Solder is plated ia solutioas containing Pb(Bp4)2 and Sn(Bp4)2 thus the lustrous solder-plated object is coated with a Pb—Sn alloy (118). [Pg.168]

Letterpress. This is the oldest printing process stiU in use. It continues to be replaced by newer printing processes. Printing is conducted from a raised image area of the printing plate. Inks in the printing process are transferred directly from a raised area to a substrate. The printing plates contain a thick layer of photopolymer (often a mixture with polymer such as poly(vinyl alcohol) deposited over a plastic or aluminum base. [Pg.249]

Flame spray metallising is widely used for the protection of metal against corrosion, especially for in situ protection of stmctural members. The principal metal used for spraying of plastics is sine. Aluminum and copper are also used. If the distance from the part is too great, the zinc solidifies before it touches the part and adhesion is extremely poor. If the molten zinc oxidizes, conductivity and adhesion are poor. If the distance is too short, the zinc is too hot and the plastic warps or degrades. These coatings are not as dense as electrically deposited coatings because of numerous pores, oxide inclusions, and discontinuities where particles have incompletely coalesced. [Pg.135]

Prior to deposition on a moving belt or screen, the molten polymer threads from a spinnerette must be attenuated to orient the molecular chains of the fibers in order to increase fiber strength and decrease extendibiUty. This is accompHshed by hauling the plastic fibers off immediately after they have exited the spinnerette. In practice this is done by accelerating the fibers either mechanically (18) or pneumatically (17,19,20). In most processes, the fibers are pneumatically accelerated in multiple filament bundles however, other arrangements have been described wherein a linearly aligned row(s) of individual filaments is pneumatically accelerated (21,22). [Pg.165]


See other pages where Plasticizer deposition is mentioned: [Pg.18]    [Pg.401]    [Pg.352]    [Pg.321]    [Pg.18]    [Pg.61]    [Pg.18]    [Pg.430]    [Pg.18]    [Pg.401]    [Pg.352]    [Pg.321]    [Pg.18]    [Pg.61]    [Pg.18]    [Pg.430]    [Pg.155]    [Pg.378]    [Pg.389]    [Pg.434]    [Pg.441]    [Pg.489]    [Pg.489]    [Pg.401]    [Pg.310]    [Pg.374]    [Pg.385]    [Pg.150]    [Pg.253]    [Pg.528]    [Pg.72]    [Pg.513]    [Pg.132]    [Pg.133]    [Pg.134]    [Pg.134]    [Pg.137]    [Pg.137]    [Pg.137]    [Pg.138]    [Pg.176]    [Pg.345]    [Pg.410]    [Pg.471]    [Pg.378]    [Pg.570]    [Pg.260]    [Pg.406]   
See also in sourсe #XX -- [ Pg.265 ]




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