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Plastic leaded chip carrier

Figure 5. Plastic-leaded chip carrier with J-shaped leads. (Reproduced with permission from reference 28. Copyright 1985 Institute of Electrical and Electronics Engineers.)... Figure 5. Plastic-leaded chip carrier with J-shaped leads. (Reproduced with permission from reference 28. Copyright 1985 Institute of Electrical and Electronics Engineers.)...
The relatively small measurement effect limits the achievable resolution to about 0.5 °/s and requires the operation of the sensor in a vacuum. The sensor system is packaged in a PLCC(Plastic Leaded Chip Carrier)-housing (Fig. 7.2.16). [Pg.310]

Cerquad, a ceramic equivalent of plastic leaded chip carriers consisting of a glass sealed ceramic package with J leads and ultraviolet window capability. [Pg.859]

MQFP—Metal Quad Flatpack. Sometimes used to refer to a plastic metric quad flat pack (such as Harris Corporation, Harris sold its semiconductor operations, now known as Intersil Corp.). MQuad, designed by the Olin Corporation, a high thermal dissipation aluminum package available in plastic leaded chip carrier (PLCC) and QFP packages (with 28-300 leads, and clock speeds of 150 MHz) (see Fig. 8.137). [Pg.862]

Plastic leaded chip carrier [ (PLCC) also known as PLDCC or a quad pack by some manufacturers, up to 100 pin packages, commonly 0.050-in pin spacing. Depending on the number of pins, pin 1 is in different locations but is confirmed by a dot in the molding, and the progression of the pin count continues counterclockwise. The leads are J shaped and protrude from the package. These parts... [Pg.862]

Plastic leaded chip carrier (PLCC) Shown in Fig. 11.18, it is a mature SMT IC package and is the only package that has the leads bent back under the IC itself Planarity Lying in the same plane. A plane is defined by the exit of the leads from the body of the IC. A second plane is defined at the average of the lowest point aU leads are below the first plane. Nonplanarity is the maximum variation in mils or miUimeters of any lead of an SMD from the lowest point plane. [Pg.1314]

PLASTIC LEADED CHIP CARRIER (PLCC) A chip Carrier packaged in plastic, usually terminating in compliant leads (originally J style) on all four sides. [Pg.1615]

J-leaded PLCC 84 1.3 (50) Plastic leaded chip carriers... [Pg.679]

LEADED CHIP CARRIER A chip carrier (either plastic or ceramic) with compliant leads from terminations. [Pg.1614]

Chip carriers are square ceramic or plastic packages with leads on four... [Pg.453]

The number of dots that can be dispensed per unit of time also depends on viscosity. The use of low-viscosity adhesives increases the number of dots that can be dispensed. However, there is a tradeoff between the speed at which the adhesive can be dispensed and the speed of device placement. Most automated component-placement equipment operate faster than adhesive-dispensing equipment. A comparison of the effect of viscosity on dispensing and placement times is shown in Table 4.19 for an 86-lead plastic-encapsulated leadless chip carrier (PLCC). ... [Pg.184]

J leads, leads that are rolled under the body of the package in the shape of the letter J. They are typically used on plastic chip carrier packages. [Pg.861]

Leaded ceramic chip carrier (LDCC), leaded ceramic chip carrier packages include JEDEC types A, B, C, and D. Leaded type B parts are direct soldered to a substrate. Leaded type A parts can be socketed or direct soldered, and include sub-categories leaded ceramic, premolded plastic, and postmolded plastic (which are not designated as LDCC devices). [Pg.861]


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See also in sourсe #XX -- [ Pg.676 ]




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