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Chip-on-lead

Francis D, Jardine L. Lead-on-chip package extends the use of wire bonding and lead-frame technology. Chip Scale Rev. Jul./Aug. 1999. [Pg.33]

Polyimide adhesives are commercially available as electrically conductive or insulative pastes used for die attachment. They are also available as thermoplastic preforms for chip-on-lead and lead-on-chip attachments. [Pg.94]

Preforni/Tape bonding Chip-on-board, hybrid or MCM, single-chip (standard and lead-on-chip) Eliminates fluid dispensing, good thickness control Requires die-cut preforms or manual processing... [Pg.175]

Francis, D., and Jardinc, L., Lead-on-Chip Package Extends the Use of Wire Bonding and Leadframe Technology, ChipScale Review (Jul./Aug. 1999)... [Pg.36]

See other pages where Chip-on-lead is mentioned: [Pg.8]    [Pg.18]    [Pg.18]    [Pg.18]    [Pg.27]    [Pg.28]    [Pg.382]    [Pg.8]    [Pg.19]    [Pg.19]    [Pg.30]    [Pg.32]    [Pg.437]    [Pg.9]    [Pg.20]    [Pg.20]    [Pg.31]    [Pg.33]    [Pg.439]   
See also in sourсe #XX -- [ Pg.18 ]

See also in sourсe #XX -- [ Pg.8 ]



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