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Leaded chip carriers

Figure 5. Plastic-leaded chip carrier with J-shaped leads. (Reproduced with permission from reference 28. Copyright 1985 Institute of Electrical and Electronics Engineers.)... Figure 5. Plastic-leaded chip carrier with J-shaped leads. (Reproduced with permission from reference 28. Copyright 1985 Institute of Electrical and Electronics Engineers.)...
Figure 3. Details of two types of leads for leaded chip carriers gull wing, above J-lead, below. (Reproduced with permission from Ref. 4. Copyright 1988 BPA [Technology and Management, Ltd.].)... Figure 3. Details of two types of leads for leaded chip carriers gull wing, above J-lead, below. (Reproduced with permission from Ref. 4. Copyright 1988 BPA [Technology and Management, Ltd.].)...
The relatively small measurement effect limits the achievable resolution to about 0.5 °/s and requires the operation of the sensor in a vacuum. The sensor system is packaged in a PLCC(Plastic Leaded Chip Carrier)-housing (Fig. 7.2.16). [Pg.310]

Cerquad, a ceramic equivalent of plastic leaded chip carriers consisting of a glass sealed ceramic package with J leads and ultraviolet window capability. [Pg.859]

Chip carrier (CC), a rectangular, or square, package with I/O connections on all four sides. Ceramic leaded chip carrier (CLDCC). [Pg.860]

MQFP—Metal Quad Flatpack. Sometimes used to refer to a plastic metric quad flat pack (such as Harris Corporation, Harris sold its semiconductor operations, now known as Intersil Corp.). MQuad, designed by the Olin Corporation, a high thermal dissipation aluminum package available in plastic leaded chip carrier (PLCC) and QFP packages (with 28-300 leads, and clock speeds of 150 MHz) (see Fig. 8.137). [Pg.862]

Plastic leaded chip carrier [ (PLCC) also known as PLDCC or a quad pack by some manufacturers, up to 100 pin packages, commonly 0.050-in pin spacing. Depending on the number of pins, pin 1 is in different locations but is confirmed by a dot in the molding, and the progression of the pin count continues counterclockwise. The leads are J shaped and protrude from the package. These parts... [Pg.862]

Plastic leaded chip carrier (PLCC) Shown in Fig. 11.18, it is a mature SMT IC package and is the only package that has the leads bent back under the IC itself Planarity Lying in the same plane. A plane is defined by the exit of the leads from the body of the IC. A second plane is defined at the average of the lowest point aU leads are below the first plane. Nonplanarity is the maximum variation in mils or miUimeters of any lead of an SMD from the lowest point plane. [Pg.1314]

CERAMIC LEADED CHIP CARRIER (CLCC) A chip Carrier made from ceramic (usually a 90-96% alumina or beryUia base) and with compUant leads for terminations. [Pg.1610]

LEADED CHIP CARRIER A chip carrier (either plastic or ceramic) with compliant leads from terminations. [Pg.1614]

PLASTIC LEADED CHIP CARRIER (PLCC) A chip Carrier packaged in plastic, usually terminating in compliant leads (originally J style) on all four sides. [Pg.1615]

J-leaded PLCC 84 1.3 (50) Plastic leaded chip carriers... [Pg.679]


See other pages where Leaded chip carriers is mentioned: [Pg.454]    [Pg.454]    [Pg.9]    [Pg.16]    [Pg.2490]    [Pg.854]    [Pg.855]    [Pg.855]    [Pg.861]    [Pg.1301]    [Pg.3]    [Pg.63]    [Pg.1610]    [Pg.528]    [Pg.304]    [Pg.30]    [Pg.676]    [Pg.683]    [Pg.718]   
See also in sourсe #XX -- [ Pg.2 , Pg.4 , Pg.5 ]




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