Planarization, in integrated circuit manufacturing

Chemical Mechanical Planarization in Integrated Circuit Manufacturing... 

Before the invention of the planar transistor, many photoresist processes were developed for the manufacture of circuit boards. Experience gained in this area was rapidly transferred to silicon processing, and much of the early work in integrated circuit lithography can be traced directly to circuit board manufacturing. 

The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. 

This chapter presents an overview of performance plastic polymers in commercial planar and 3-dimensional circuit board products, and describes in detail one approach (two-shot molding) developed as an integrated 3-D circuit manufacturing technology. The distinctions between conventional planar (2-dimensional) circuitry, based on thermoset laminates and "subtractive etching processes, and the enhanced design flexibility afforded by expanded interconnection capacity in three axes are discussed. Specific examples of 3-dimensional interconnect protoypes and products are described and pictured. 

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