Physics-of-failure

The physics of failure of fluoropolymers on the microscale is caused by thermally activated breakages of secondary and primary bonds in the material. The chain scission leads to crack and void formation and ultimate failure. To model and predict these events typically requires an investigation on a larger length scale where a continuum mechanics approach can be used. 

Physics of failure for plastic-encapsulated microcircuits (PEMs) 292... 

The physics of failure (PoF) approach to determine the mode and mechanism of failure of an electronic part or assembly has been used successfully for many years. PoF is a step-by-step approach that assures that information is not irretrievably lost. Thus, in performing a failure analysis, it is important to perform all the tests that are nondestructive first. These tests may or may not give a clue about the cause of failure but, if omitted, either can no longer be performed or are compromised by the subsequent destructive tests. 

McLeish JG, Hillman C. Enhancing MIL-HDBK-reliability predictions with physics of failure models. Adv Microelectron Mar./Apr. 2010 28-32. 

This second edition has been updated to reflect the business, technology, and environmental changes that have occurred for example, all the tables have been reviewed and updated, new sections have been added to cover formulation additives, LED and OLED applications, market trends, physics of failure, and refiability prediction. However, most of the basic chemistry and processes remain current. 

The damage thresholds for equipment containing semiconductor devices and other semiconductor components vary for device types and, due to physics-of-failure parameter differences, for otherwise identical parts (Corbin et al. 1982). Several equipment items are often needed to support an operational function (control system devices, measurement devices, etc.). In this case, the probabilities of equipment failure must... 

Kulkarni, C., Biswas, G., Koutsoukos, X., Goebel, K., Celaya, J. (2010). Physics of failure models for capacitor degradation in DC-DC converters. In The Maintenance and Reliability Conference, MARCON. Knoxville, TN. 

Microprocessor physics of failure (the aging failure modes problem). 

Some recent developments in understanding the physics of failure mechanisms in elastomers, with particular reference to severe mechanical and environmental conditions relevant to offshore engineering applications, are presented. NBR, chlorinated PE, polychloroprene and NR are subjected to high mechanical stresses and severe hydrocarbon fluid environments at elevated temperatures in an attempt to determine component service life. 14 refs. UK EUROPEAN COMMUNITY... 

Chookah, M., Nuhi, M. Modarres, M. 2011. A probabilistic physics-of-failure model for prognostic health management of structures subject to pitting and corrosion-fatigue. Reliability Engineering System Safety, 96, 1601-1610. 

Fan, I, Yung, K. Pecht, M. 2011. Physics-of-failure-based prognostics and health management for high-power white light-emitting diode lighting. Device and Materials Reliability, IEEE Transactions on, 11, 407-416. 

Keedy, E. Feng, Q. 2012. A physics-of-failure based reliability and maintenance modeling framework for stent deployment and operation. Reliability Engineering System Safety, 103, 94-101. 

A Physics-of-Failure-based approach for failure behavior modeling With a focus on failure collaborations... 

Pecht, M. Dasgupta, A. 1995. Physics-of-failure An approach to reliable product development. In Proc. Integrated Reliability Workshop, Lake Tahoe, US, 1995, IEEE. 

Modern chips are composed of tens or hundreds of millions and even billions of transistors. Hence, chip level reliability prediction methods are mostly statistical allowing a constant-rate assumption to be applied. Chip level reliability prediction tools, today, model the failure probability of the chips at the end of life, when the known wear-out mechanisms are expected to dominate. However, modern reliability tools do not predict the random, post burn-in, constant failure rate that would be seen in the field. All the current physics of failure solutions try to determine an average effect that can be represented by a single relation that gives an average value for the Mean Time Between Failures (MTBF), however this single relation can never reflect the true physics of multiple mechanisms. 

We present here for the first time a simple and accurate way to combine the physics of failure equations for reliability prediction from accelerated life testing. We show that a matrix approach allows the reliability physics equations to be fit proportionally to the results of monitored accelerated life testing in order to extrapolate failure rate one would expect given actual operating parameters. This methodology can be extended to include radiation effects, frequency and even packaging and solder joint effects to give a complete system reliability evaluation framework. 

According to IEEE (2003) component reliability is determined from field or test data, from physical failure modelling (physics of failure), or using so-called handbooks. 

The physics of failure is related to the time-dependent evaporation of the electrolyte. This evaporation process depends on several parameters hke voltage, current and temperature (Perisse et al. 2004). 

The physics of failure of both exemplary electronic components showed that the dominant failure mode had a significantly increasing failure rate. The root cause of such a failure mode can be either caused by cyclic thermal load or by forces based on electromagnetic or electrostatic phenomena. The root cause leads to cyclic stresses in the material or to micro movements e.g. micro bending. A cyclic bending leads to stresses in the material as well. 

This demonstrates that the general assumption of constant failure rate for electronic components is not permissible. Moreover, beside the failure modes based on electronic physics of failure the failure modes based on mechanical physics of failure needs to be considered. 

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