Pattern-Plating Additive

Pattern-plating additive methods can be classified further into three different approaches, as described in the following sections, depending on the base substrates used. 

Additive (or "pattern plating") methods are becoming increasingly popular, for they generate less waste and require lower manufacturing costs (Brush 1983). In additive methods, metal is deposited only in the holes and on the circuit locations, so there is less waste of copper. Also, the copper etching step is eliminated. The additive method does have drawbacks, however. Additive processes require use of solvent processable instead of aqueous processable photoresists. In addition, waste streams contain heavily complexed copper. 

Table 31.1 shows representative high-tech MLBs fabricated by means of additive technology. Innerlayer patterns of all MLBs listed in the table are made by the foil process. The out-erlayer patterns are formed by the panel-plate additive process, which is the subject to be discussed in the following section. 

There are two basic etchant needs to be met. The first is traditional foil etching for print and etch, plate/tent and etch, and pattern plate and etch. Virtually all processes in the United States and Europe use constant-rate systems for alkaline ammonia or cupric chloride etchants for this purpose. The second need is developing technology for specific precision very-fine-line etching—including foil thinning and thin metallization clearout for HDI constructions and fine features. (See Sec. 34.7 for additional discussion and mention of additional chemistries that may be useful for these applications.)... 

This plate cuts the flow into pieces which are better defined than the poorly defined ones obtained by the first-generation caterpillar mini mixer. In addition, the micro structure geometry was improved by means of simulation. As a result, near-ideal multi-lamination flow patterns were yielded (Figure 4.23), which showed excellent correspondence with simulation [50]. 

Tool design will have to be carried out keeping in mind the need to control transport of any additives and dissolved O2 to patterned circuit elements, particularly those not surrounded by other actively plating features. 

PCR and in vitro recombination reactions are quite simple and straightforward for generating multiple expression plasmids in parallel, e.g., in a 96-well plate see Fig. 3a). The first preliminary expression experiment was done to evaluate the production level of each GST-fused protein. In this step, we compared the staining patterns of E. coli proteins harboring expression plasmids with the patterns of proteins harboring empty vectors on sodium dodecyle sulfate-polyacrylamide gel electrophoresis (SDS-PAGE) under the same culture conditions see Fig. 3b). In addition to... 

Finally, the ions (lowing down ihc quadrupole strike the Faraday plate defector. In some cases. Ihc signal is amplified further by an electron multiplier. Thus, there is obtained a spectrum of signal intensity versus m/e value. Each molecule has a unique fragmentation pattern so that a spectrum can he used as a fingerprint lor compound idenlilication. In addition, it is possible lo quantitate the amount of a particular compound by comparing sample signal intensity with the intensity produced hy a known amount of ihe compound. 

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