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Parasitic inductance

Figure 2-4 Effects of Parasitic Inductance in the Source at Turn-off... [Pg.56]

Vq Parasitic inductances can prevent Schottky from conducting during td... [Pg.92]

The DLC is a physical component which has not only a requested capacitance, but also an unavoidable parasitic inductance due to its geometry, a series resistance caused by the electronic and ionic conductor ohmic resistances and a parallel resistance due to the leakage current between the electrodes. [Pg.443]

To separate the contribution of the anode from that of the cathode, Wagner et al. provided a more general equivalent circuit, as shown in Figure 6.33. The anode, the cathode, and the membrane resistance were in series. A parasitic inductance due to the mutual induction effect was also included. The cathode impedance was given by charge-transfer resistance (Rct0i) and constant phase element (CPE) in... [Pg.297]

Figure 1.5 Schematic example of a simplified equivalent circuit fora mixed conducting ceramic membrane or sample under investigation of its electrical properties. L is a parasitic inductive element arising from various sources (sample, wires, instrumentation). Figure 1.5 Schematic example of a simplified equivalent circuit fora mixed conducting ceramic membrane or sample under investigation of its electrical properties. L is a parasitic inductive element arising from various sources (sample, wires, instrumentation).
Applications for nanocomposites include thin-film capacitors for computer chips. Thin film capacitors are electrical capacitors with an insulating film as the dielectric, combined with paper as carrier of the electrodes. The dielectric thin films are provided with electrodes. The electrodes of film capacitors may be metalized with aluminium or zinc applied directly to the surface of the plastic film. Two of these conductive layers are wound into a cylinder-shaped winding, layered as multiple single layers stacked together, to form a capacitor body. Film capacitor has very low ohmic losses and a very low parasitic inductance, which makes it suitable for AC power applications. [Pg.457]

Differential mode noise caused by the di/dt during the IGBT s turn-off and the parasitic inductance of busbar and filter capacitor is shown as curve 1 in Figure 6. [Pg.209]

The current decrease generates a high dijdt and causes the voltage overshot, whose magnitude depends on the parasitic inductance value and forward recovery voltage value of diode. Then the voltage drops and this period is marked as t. The change ratio is... [Pg.212]

There is no parasitic inductance or capacitance associated with the circuit, which there is. [Pg.599]

The electrical parasitics of a solder bump are far better than for a wire-bond or TAB lead. The latter generally introduce about 1 nH of inductance and 1 pF of capacitance into a circuit. In contrast, a solder bump introduces about 10 pH and 10 nF. The lower parasitic inductance and capacitance make solder bumps attractive for high-frequency radio applications, for example, in the 5.6-GHz communications band and in high clock rate digital applications. [Pg.839]

Parasitic inductances are mainly caused by design. Figure 9.55 shows an example of a shunt high-K capacitor with two different via connections. By using parallel vias, the via-related inductance can be reduced and the resonance frequency can be increased [28]. [Pg.406]

Eased on tiie system specification, a filter schematic is developed. A first sensitivity analysis (influence of component tolerances on the function) should be made to verify the manufacturability in general. Another technology-independent method uses typical parasitics, which are added to tiie schematic (e.g., capacitor with parasitic inductance or quality factor of an inductor). Eoth methods help to decide which filter type will perform best if several schematic structures are available. [Pg.415]

Paclmge Type Parasitic Capacitance, pF Parasitic Inductance> nH... [Pg.116]

If the many passive components currently mounted on substrates can be built into the board, the length of the wiring used to connect these passive components can be shortened, so that improved characteristics can be achieved such as making the board itself smaller, and reducing the parasitic inductance. Additionally, as the space freed up on the newly formed substrate can be used to mount other components and the like, the board can be given more functions. [Pg.10]


See other pages where Parasitic inductance is mentioned: [Pg.63]    [Pg.91]    [Pg.149]    [Pg.81]    [Pg.95]    [Pg.266]    [Pg.48]    [Pg.76]    [Pg.134]    [Pg.17]    [Pg.83]    [Pg.138]    [Pg.198]    [Pg.198]    [Pg.216]    [Pg.240]    [Pg.399]    [Pg.48]    [Pg.76]    [Pg.134]    [Pg.156]    [Pg.216]    [Pg.280]    [Pg.53]    [Pg.599]    [Pg.747]    [Pg.843]    [Pg.406]    [Pg.262]    [Pg.96]    [Pg.21]    [Pg.212]   


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