Palladium electrical properties

Electrical Properties. Electrical properties are important for the corrosion protection of chip-on-board (COB) encapsulated devices. Accelerated temperature, humidity, and bias (THB) are usually used to test the embedding materials. Conventional accelerating testing is done at 85°C, 85% relative humidity, and d-c bias voltage. Triple-track test devices with tantalum nitride (Ta2N), titanium—palladium—gold (Ti—Pd—Au) metallizations with 76... 

Palladium, polymethylenebis(diphenylphosphine)-bis(thiocyanato)-linkage isomers, 1, 185 Palladium, tetraammine-tetrachloropalladate history, 1, 2 Palladium, tetrachloro-crystal structure, 1, 16 Palladium, tris(dinitrogen)-synthesis, 1,28 Palladium complexes a,(5-dione dioximates electrical properties, 6, 143 acetylacetone hydrolysis, 2,379 alkylperoxo... 

Second order non-linear optical properties have been reported for a variety of TTF donor-acceptor compounds <02T7463> and the palladium complex 84 is a room-temperature semiconductor <02CL936>. Preparation of the zinc and cadmium compounds 85 has been reported <02CC1474> and aromatic fused TTFs such as 86 form thin films with useful electrical properties <02JAP265466>. A ferromagnetic interaction occurs in the salt of a TTF... 

Deposits of 100 percent palladium, 80 percent palladium with 20 percent nickel, and 50 percent palladium with 50 percent nickel find use as suitable deposits for edge connectors. Deposits are hard (200 to 300 Knoop), ductile, and corrosion-resistant. A palladium-nickel undercoat for gold shows good wear and electrical properties. 

Generally, the electrical connection between components and layers are given by the conductor paste such as silver, copper, gold, silver-palladium, silver-platinmn and etc. Compared to the other conductor materials, silver thick film has been used as the main conductive material for LTCC technology due to their excellent electrical properties, thermal... 

Impurities in cmde metal can occur as other metals or nonmetals, either dissolved or in some occluded form. Normally, impurities are detrimental, making the metal less useful and less valuable. Sometimes, as in the case of copper, extremely small impurity concentrations, eg, arsenic, can impart a harmful effect on a given physical property, eg, electrical conductivity. On the other hand, impurities may have commercial value. For example, gold, silver, platinum, and palladium, associated with copper, each has value. In the latter situation, the purity of the metal is usually improved by some refining technique, thereby achieving some value-added and by-product credit. 

Photorefractivity is a property exhibited by some materials in which the redistribution in space of photogenerated charges will induce a nonuniform electric space-charge field which can, in turn, affect the refractive index of the material. In a new material the active species is a highly efficient cyclopalladated molecule97,98 shown in Figure 5. The palladium-bonded azobenzene molecule is conformationally locked, and gratings derived from cis—trans isomerizations can be safely excluded. 

Metal ion modified polyimide films have been prepared to obtain materials having mechanical, electrical, optical, adhesive, and surface chemical properties different from nonmodified polyimide films. For example, the tensile modulus of metal ion modified polyimide films was increased (both at room temperature and 200 0 whereas elongation was reduced compared with the nonmodif ied polyimide (i). Although certain polyimides are )cnown to be excellent adhesives 2) lap shear strength (between titanium adherends) at elevated temperature (275 0 was increased by incorporation of tris(acetylacetonato)aluminum(III) (2). Highly conductive, reflective polyimide films containing a palladium metal surface were prepared and characterized ( ). The thermal stability of these films was reduced about 200 C, but they were useful as novel metal-filled electrodes ( ). 

Trace impurities in noble metal nanoclusters, used for the fabrication of highly oriented arrays on crystalline bacterial surface layers on a substrate for future nanoelectronic applications, can influence the material properties.25 Reliable and sensitive analytical methods are required for fast multi-element determination of trace contaminants in small amounts of high purity platinum or palladium nanoclusters, because the physical, electrical and chemical properties of nanoelectronic arrays (thin layered systems or bulk) can be influenced by impurities due to contamination during device production25 The results of impurities in platinum or palladium nanoclusters measured directly by LA-ICP-MS are compared in Figure 9.5. As a quantification procedure, the isotope dilution technique in solution based calibration was developed as discussed in Chapter 6. 

---