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Thin film multilayer packaging approach

Figure 1. Proposed approach for multichip packaging using thin film multilayer Cu/polyimide interconnections. Figure 1. Proposed approach for multichip packaging using thin film multilayer Cu/polyimide interconnections.
See other pages where Thin film multilayer packaging approach is mentioned: [Pg.468]    [Pg.468]    [Pg.449]    [Pg.343]    [Pg.1345]    [Pg.3]    [Pg.304]    [Pg.8615]    [Pg.1308]   


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