Optoelectronic packaging

Hodgin MJ. Epoxies for optoelectronic packaging applications and material properties. J. Microelectronics and Electronic Packaging. Second Quarter 2004 1(2). IMAPS. Abletherm 2600BT, Technical Data Sheet. Ablestik Laboratories. Sep. 2003. 

FIGURE 8 Three-dimensional parameter space characterizing smart pixel arrays. [Courtesy of Ravi Athale. Reprinted by permission of Wiley—Liss, a subsidiary of John Wiley Sons, Inc., Neff, J. (1997). In Optoelectronic Packaging (A. R. Mickelson, N. R. Basavanhally, and Y. C. Lee, eds.), John Wiley Sons, New York.]... 

Djurfos B, Ivey DG (2001) Pulsed electrodeposition of the eutectic Au/Sn solder for optoelectronic packaging. J Electron Mater 30 1249-1254... 

Hung, T. V., and G. S. Frank. Towards model-based engineering of optoelectronic packaging materials dielectric constant modeling. Microelectron. J. 33,409-415 (2002). 

Erben, Christoph, New Materials in Optoelectronics Advantages and Challenges for Polymers, Second Optoelectronics Packaging Workshop, Austin,TX, August 21 22,2001, pp. Bl- B22. 

Watsun, Jim, Chip-to-Chip Optical Interconnec—Optical Pipedream First Optoelectronics Packaging Workshop, February 21-22,2001, Austin,TX, pp.Bl-B22. 

These and other complementary thermomechanical tests have been carried out on injection-molded GFPPS components in order to set processing conditions and, thereby, maximize the plastic s mechanical stabihty. These GFPPS components are part of a telecommunication system s optoelectronic package (Bair and Osenbach 2004). 

As the materials mature, it is expected that practical fabrication problems will be solved, and that eventually various grades of E-0 polymers will be available, like photoresist is today, for a variety of different applications and needs. For this reason, polymers represent a unique, potentially powerful addition to the library of materials comprising optoelectronic components, and polymer devices provide new and novel approaches to optical interconnection, electronic packaging, and integrated optics. 

Nitto Denko Corporation primarily manufactures industrial adhesive tapes for the electronics, automotive, health care, packaging and construction industries. The company produces industrial, electronic and functional products. Industrial products include double-coated adhesive tapes, masking tapes surface protective materials, sealing materials and label printing systems. Electronics products include LCD-related items general and advanced device resins printed circuit boards and semiconductor package adhesive sheets. Functional products include medical items such as transdermal therapeutic patches polymer separation membranes used for water purification and treatment and plastic engineering products such as information equipment and porous film materials used in cars, electronics, and home appliances. Nitto Denko America, Inc., an optoelectronics subsidiary, manufactures semiconductor... 

Adhesives for optoelectronics, fiber packaging, LCDs, LEDs, and general electrical assembly... 

The Hartree-Fock method for periodic systems nowadays represents a routine approach coded in several ab initio computer packages. We may analyze the total energy, its dependence on molecular conformation, the density of states, the atomic charges, etc. Also, calculations of first-order responses to the electric field (poljmiers are of interest for optoelectronics) have been successful in the past. However, nonlinear problems (like the second harmonic generation see Chapter 12) stiU represent a challenge. 

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