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Oligomer thermosetting, based

Liquid-Injection Molding. In Hquid-injection mol ding (LIM), monomers and oligomers are injected into a mold cavity where a rapid polymerization takes place to produce a thermoset article. Advantages of these processes are low cost, low pressure requirement, and flexibiHty in mold configuration. Conventional systems, such as isocyanate with polyol, release Htfle or no volatiles. The generation of substantial volatiles in the mold is obviously undesirable and has represented a significant obstacle to the development of a phenoHc-based LIM system. A phenoHc LIM system based on an... [Pg.307]

In the narrow sense, bis-maleimide resin means the thermosetting resin eom-posed of the bis-maleimide of methylene dianiline (BMI, bis(4-maleimidophenyl)-methane) and methylene dianiline (MDA, bis(4-aminophenyl)methane) (Fig. 1). Beeause of the addition meehanism, the resin is eured without elimination, whieh is a eharacteristic of this resin. Bis-maleimide resin is used as a thermally stable matrix up to 204°C (400 F) whieh typical epoxy resins may not normally be used. However, in spite of having an imide structure, bis-maleimides are classified as being moderately thermally stable resins. The aliphatic structure of the resin is not stable for long periods above 232°C (450°F.) If a highly aromatic thermally stable thermosetting resin is necessary, acetylene end-capped aromatic imide-based oligomers should be used. [Pg.813]

The study relates to new classes of thermosetting oligomers based on N-cyanourea-terminated resins, which are useful as a monomer, a thermosetting resin, and a cross-linking agent for epoxy resins. [Pg.105]

N-Cyanourea Oligomers as Coating Materials. Previously, the difunctional N-cyanourea-terminated oligomers were used to prepare thermoset plastics at a temperature higher than 100°C.Q) It was reported that the oligomers, upon heating, underwent the same major polymerization as equations (5) and (6) in linear polymer preparation. Some side reactions, based on IR, NMR and mass spectroscopic studies were proposed to illustrate the formation of cross-links, as shown in Figure 4. [Pg.112]

Adhesive applications, thermosetting epoxy resin based on N-cyanourea-terminated oligomer, 107... [Pg.250]

In Table 1, the moisture uptake of cured and uncured Navy P3-2300-PE resin after 24 hours of immersion is compared to a number of other high-temperature polymer resins. The moisture uptake of the Navy P3 oligomer is nearly identical to that of the commercial P3 thermoplastic. Other commercial thermoplastics, such as poly(ether ether ketone), with very similar chemical compositions, exhibit similarly low levels of moisture uptake. On the other hand, the Navy P3 resins absorbs about 85% less water than the commercial polyimide Kapton HN. Since thermosetting phenyl ethynyl end-capped polyimides have moisture uptake characteristics that are similar to Kapton HN, with around 3% weight gain on exposure to 95% relative humidity (77), void-free composites based on Navy P3 resins should exhibit greatly reduced moisture uptake compared to those based on thermosetting polyimides. [Pg.228]

Norbornenyl functionalised linseed oil and cyclopentadiene oligomer-based thermosetting resins have been successfully synthesised using dicy-clopentadiene or other polycyclic norbornene-based comonomers as cross-linkers. New biorenewable-based thermosets have been successfully synthesised by the ring opening metathesis polymerisation of norbornenyl functionalised fatty alcohols of soybean and castor oils. The castor oil-based thermoset exhibits lower soluble fractions and higher thermal stability and mechanical properties compared with the soybean oil-based thermoset. This is due to more effective cross-linking. ... [Pg.218]

Adhesive Processes. Most commercially available adhesive systems consist of either thermoplastic hot melt or reactive thermosetting resins. Typical thermoset adhesive formulations contain base resin monomers and oligomers, curing agents (hardeners), catalysts, adhesion promoters, and various fillers. Adhesive properties depend on the complete mixing and adequate dispersion of the... [Pg.8535]

A series of acetylene-terminated, aryl-ether thermoset systems were prepared by an Ullmann ether synthesis involving the condensation of various salts of aromatic bis—diols with m—dibromobenzene. The bromo end-capped oligomers were converted to the acetylene-terminated systems by the catalytically-induced, bromo-displacement reaction with 2-methyl-3-but3m-2-ol, followed by base hydrolysis. [Pg.40]


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