Microelectronic components

The rotating-disk CVD reactor (Fig. 1) can be used to deposit thin films in the fabrication of microelectronic components. The susceptor on which the deposition occurs is heated (typically around lOOOK) and rotated (speeds around 1000 rpm). A boundary layer is formed as the gas is drawn in a swirling motion across the spinning, heated susceptor. In spite of its three-dimensional nature, a peculiar property of this flow is that, in the absence of buoyant forces and geometrical constraints, the species and temperature gradients normal to the disk are the same everywhere on the disk. Consequently, the deposition is highly uniform - an especially desirable property when the deposition is on a microelectronic substrate. 

MICRO- AND DISTRIBUTION ANALYSIS Microelectronic components, computers... 

Components and systems that exploit engineered structures, surface features or dimensions that are typically measured in terms of microns (one millionth of a meter) to hundreds or thousands of microns, and that may include microelectronic components as an integral part of the system . 

Another factor that contributes to much of this miniaturization is smaller and smaller microelectronic components, allowing huge increases in the number of devices on one chip. As we mentioned in Chapter 4, today s computer chips contain more than 30 million transistors. Similar science and technology are being applied to make other materials and useful devices containing extremely small components. 

The use of radiation to modify the physical properties of polymers has become a very important industry with products such as electrical cables with insulation capable of withstanding high temperatures and heat-shrinkable polyethylene. However, of direct relevance to this symposium was the recognition in the early 1970 s that electron beam irradiation of pol3mier films could provide an important lithographic tool for the manufacture of microelectronic components. For consideration of the general principles of these processes see, for example, references (66) and (67). The products required In this field are complex requiring both microscopic... 

Our technologically advanced way of life would not be possible without the semiconductor industry. The first semiconductor device known as a transistor was discovered at Bell Labs in the late 1940s, and was widely used shortly thereafter for radio electronics. Today, transistors are still pervasive in every microelectronic component such as CD/DVD players, cellular phones, modes of transportation (e.g., planes, automobiles, etc.), and computers. In fact, the dual-core chips released by Intel in early 2006 feature over 1.7 billion transistors - all on a surface that is smaller than a postage stamp ... 

Nakayama, W., Nakajima, T., and Hirasawa, S., 1984, Heta Sink Studs Having Enhanced Boiling Surfaces for Cooling Microelectronic Components , ASME Paper No. 84-WA/HT-89... 

Trace and ultratrace determinations are now very important for chemicals. For solid chemicals dissolution again may put limitations on the power of detection achievable due to contamination during the dissolution procedure. Graphite furnace atomic absorption together with plasma mass spectrometry are now of great importance for the analyzing acids used e.g. in the treatment of surfaces in microelectronic components. 

Recent developments of some new high-performance composite materials, cosmetics, paints, and microelectronic components require a better understanding and manipulation of the colloidal interactions in nonpolar media. However, unlike in the previous cases, pyrene cannot be used... 

The chemical, electrochemical, and photoelectrochemical etching processes by which microelectronic components are made are controlled by electrochemical potentials of surfaces in contact with electrolytes. They are therefore dependent on the specific crystal face exposed to the solution, on the doping levels, on the solution s redox potential, on the specific interfacial chemistry, on ion adsorption, and on transport to and from the interface. Better understanding of these processes will make it possible to manufacture more precisely defined microelectronic devices. It is important to realize that in dry (plasma) processes many of the controlling elements are identical to those in wet processes. 

Areas of fundamental electrochemistry that are particularly relevant to the manufacture of microelectronic components include the sciences of semiconductor electrochemistry, ion transport, corrosion, plating, microcells (of 1 to 20 pm dimension), photoetching, and photoelectroplating. 

Electrochemistry is a central theme in the interconnection of chips and other microelectronic components. The manufacture of printed wiring boards, such as single-layer, multilayer, or flexible boards, involves electroplating of the conductor that forms the electrical paths. The corrosion of these paths and the interfacial stability of the conductor-polymer composites that determine the reliability of these interconnections are electrochemical problems. 

ADAM HELLER heads the Electronic Materials Research Department at AT T Bell Laboratories. He holds a Ph.D. from the Hebrew University, Jerusalem. He authored 102 papers and holds 30 patents in semiconductor electro-chemistry, lithium batteries, liquid lasers, and electronic materials. His current research interests include transparent metals, interconnection of microelectronic components, materials for microelectronic devices and their processing, and hydrogen-evolving solar cells. 

Bergles, A.E. and Bar-Cohen, A., Direct Liquid Cooling of Microelectronic Components, Advances in Thermal Modeling of Electronic Components and Systems, Eds., Bar-Cohen, A. and Kraus, A.D., Vol. 2, pp. 233-250, ASME Press, New York, 1990. 

The number of applications in microtechnology which are laser based will increase in the coming years and special polymers may be the key for many applications. The applications range from parts in micromechanical, microfluidic, and microelectronic components to microoptical elements and... 

Packaging of electrochemical sensors is an essential and critical issue in the overall fabrication of electrochemical sensors. The nature of any sensor requires the sensing element to be exposed to the sensing environment. This requirement differs from that of common microelectronic components which... 

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