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Mica board

Shellac is used as an alternative to alkyd resins in binding mica splitting to produce mica board. This is pressed into shapes used as insulation in electric motors, generators, and transformers. Mica tape, used as insulators in motors and generator coil slots, is fabricated by bonding mica flakes to glass cloth and tissue paper with shellac or silicones. ... [Pg.100]

Early laminates tended to be small because available presses were small, and their original uses were to replace small parts such as the natural mica insulator boards used in radio chasses. As decorative laminates evolved from industrial laminates and the size grew to serve markets such as tabletops, countertops, and wall paneling, laminate dimensions tended to fall into the typical building module ratio of about two length to one cross, such as 2 x 4s,... [Pg.531]

Selective dissolution of the polymer may be used industrially to separate polymer from additives for recycling purposes. However, separation of PPE from its additives (CB, talc, mica) in integrated circuit board scrap by means of trichloroethylene would not seem to meet industrial requirements (toxicity, cost) [10]. [Pg.692]

Another example that now shows the effects of mineral fillers on oxidation of WPCs (in terms of the OIT, that is, the oxidative induction time) is the durability of GeoDeck experimental deck boards made with talc and mica, in addition to the conventional composition. GeoDeck board without added antioxidants had the OIT of... [Pg.133]

Incorporating fillers or reinforcing agents is another means of improving polymer properties. High particulate loadings improve the dimensional stability of electronic circuit boards so that the thermal expansion is greatly reduced. Particulate fillers (talc, mica, silica, clay, etc.) are used... [Pg.25]

Phenolic plastics. Collective designation for phenolic resin-based plastics. Phenolic resins are produced by condensation of phenol and/or its homologues, such as cresol, with an aldehyde, such as formaldehyde or with an aldehyde-releasing material such as hexamethylenetetramine. Phenol/formaldehyde and/or cresol/formaldehyde resins are used as binding materials in fibre board, laminated paper and fabrics. In phenolic moulding compounds, the proportion of filler (such as wood flour, rock flour, asbestos, stone powder, mica, glass fibre) can be equal to that of the resin. These thermosets can be processed by compression or injection moulding into black or dark-coloured products mainly for the electric industry. [Pg.18]

After this stunning piece of work, Winterton joined the Nuclear Laboratories of the Electricity Generating Board at Berkeley, eventually becoming a lecturer at Birmingham University, while Tabor continued with a new PhD student, Jacob Israelachvili, who continued to develop the mica surface force apparatus as it was soon to become known. His immediate contribution was to push the jump distance from 5 nm down to 1.5 nm and then to measure the effect of stearic acid monolayers on the mica surfaces. " ... [Pg.70]

Polybutyleneterephthalate and polyethyleneterephthalate reinforced with glass fibers and mica are used in exterior automobile panels, such as cowl/vent hoods, rear quarter panels and headhght housings, and in imder-the -hood parts, such as high performance distributor caps and rotor arms and the E coil on the Ford Lynx and Escort, where mica improves electrical characteristics. Similar compounds are used in computer keyboards and key facings, solder-side circuit board covers, glue gun... [Pg.380]

The principal use for ground mica is as a filler and extender in gypsum wall board joint compounds, where it produces a smooth consistency, improves workability, and prevents cracking. It is also used in paints, molded rubber products including tires, and toothpaste. [Pg.209]


See other pages where Mica board is mentioned: [Pg.292]    [Pg.356]    [Pg.226]    [Pg.280]    [Pg.789]    [Pg.458]    [Pg.994]    [Pg.357]    [Pg.280]    [Pg.138]    [Pg.280]    [Pg.356]    [Pg.319]    [Pg.129]    [Pg.314]    [Pg.318]    [Pg.318]    [Pg.345]    [Pg.357]    [Pg.48]   
See also in sourсe #XX -- [ Pg.702 ]




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