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Metal plater

Electronic parts makers, platers and other metal finishers require clean water rinses to remove plating chemicals from parts prior to the next process. The rinse water is sometimes expensive or in short supply. Furthermore, if the water is of poor quality, it must be pre-treated prior to use. The water is discarded after one use with conventional waste treatment, precipitation and clarification and a hazardous mixed metal sludge is generated which must be shipped to a hazardous waste landfill. [Pg.252]

The U.S. EPA regards meialhzcrs such as platers, surface finishers, and printed circuit board producers as among the mosi impurtani source polluters for metals Much production of electroplated items lias, however, shifted from the United States to less environmentally stringent countries. [Pg.984]

Plater M. J., Foreman M. R. St J., Howie R. A., Skakle J. M. S. and Slawin A. M. Z., Hydrothermal synthesis of polymeric metal carboxylates from benzene-1,2,4,5-tetracarboxylic acid and benzene-1,2,4-tricarboxylic acid, Inorg. Chim. Acta 315 (2001) pp. 126-132... [Pg.316]

Cooper, S. )., Leonard, C. A., MeSweeney, S. M, Phompson, A. W., Naismith, J. 11., Qamar, S., Plater, A., Berry, A., and Hunter, W, N. 1996. Phe crystal structure ol a class II fructose-1,6-bisphos-phate aldolase show.s a novel binuclear metal binding active site embedded in a iamiliar fold.. Structure 4 1303 1315. [Pg.472]

Metals Grinders, platers, pohshers, refiners, solderers, turners. [Pg.159]

In this paper we describe a model of a cup plater with a peripheral continuous contact and passive elements that shape the potential field. The model takes into account the ohmic drop in the electrolyte, the charge-transfer overpotential at the electrode surface, the ohmic drop within the seed layer, and the transient effect of the growing metal film as it plates up (treated as a series of pseudo-steady time steps). Comparison of experimental plated thickness profiles with thickness profile evolution predicted by the model is shown. Tool scale-up for 300 mm wafers was also simulated and compared with results from a dimensionless analysis. [Pg.84]

Langard S, Norseth T (1986) Chromium. In Friberg L, Nordberg GF, Vouk V (eds) Handbook on the toxicology of metals, 2nd edn, vol 2. Elsevier, Amsterdam, pp 185-210 Lee HS, Goh CL (1988) Occupational dermatosis among chrome platers. Contact Dermatitis 18 89-93 Mathias CGT (1982) Contact dermatitis from cyanide plating solutions. Arch Dermatol 118 420-422 Neverland P (1976) Health hazards associated with chemical and electrolytic surface treatment (in Swedish). IVF-Resultat, vol... [Pg.918]

To increase the efficiency for the electrochemical treatment of effluents rotating three-dimensional electrodes were also tested. Thus, a rotating packed bed electrode [44] and a vertically moving particle bed electrode were proposed [45, 46]. Plater barrels were also adapted for the removal of metals [47,48]. Likewise, rotating cylinder electrodes made of reticulated vitreous carbon [49], expanded metal sheets [50], woven wire meshes [51] and wedge wire screens [52] were also examined. [Pg.2135]

If soldering to a surface finish, plated over a non-solderable basis metal, the reliability of the solder joint wUl be a function of the adhesion capabUity of the plating to the basis metal. Even if a good solder joint is formed between the assembly aUoy and the component surface finish, the rehabihty will be poor if the plating peels from the surface. The reliability of the component wUl be placed firmly back into the plating process and the surface preparation by the plater. You should ask yourself if you trust your plater and the consistency of the process. [Pg.1010]


See other pages where Metal plater is mentioned: [Pg.275]    [Pg.596]    [Pg.908]    [Pg.275]    [Pg.596]    [Pg.908]    [Pg.138]    [Pg.57]    [Pg.153]    [Pg.321]    [Pg.1169]    [Pg.96]    [Pg.153]    [Pg.358]    [Pg.520]    [Pg.529]    [Pg.57]    [Pg.57]    [Pg.153]    [Pg.210]    [Pg.350]    [Pg.531]    [Pg.539]    [Pg.844]    [Pg.128]    [Pg.548]   
See also in sourсe #XX -- [ Pg.596 ]




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