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Metal defects

All the work is mechanised with an assigned scanning density, this allowing comparison of the UT results in repeated diagnostics of the constructions. Mechanical scanning practically eliminates overlooking of metal defects. Interpretation of the... [Pg.790]

Bxoised area of substrate metal. In the case of passive metals defects in the passive film result in an active-passive cell with intense localised attack on the active area... [Pg.153]

Next let us discuss the electronic defects associated with point defects in semiconductive or insulating compounds, which lead to non-stoichiometry. Consider a NiO crystal, which has a NaCl-type structure, as NiO can be regarded as an ionic crystal, the valence states of Ni and O are Ni and O , respectively. We assume that the non-stoichiometry originates only from metal vacancies. Generation of metal defects in NiO may be expressed by a chemical reaction similar to eqn (1.119), i.e. [Pg.42]

The EAM and MEAM potentials once determined from electronics principles calculations [178] have been used to reproduce physical properties of many metals, defects, and impurities. For example, EAM molecular statics, molecular dynamics, and Monte Carlo simulations were performed on hydrogen embrittlement effects on dislocation motion and plasticity [46,179-181]. These potentials have been used to analyze plasticity [74,144,145,148-150,182,183], cracks and fracture [117,184], and fatigue [119, 120, 185, 186]. [Pg.102]

Among special cases we shall first examine the case involving only one type of charged (metallic) defect and one electronic type. For the special case here considered we find ... [Pg.449]

For each vacancy two metal defects are created, hence... [Pg.1079]

The fluorescence pattern that grew from one metallization line to the next under low frequency excitation is believed to represent an aqueous pathway. Although the formation mechanism has not been identified, in light of the AC experiment, a chemical attack of the polymer leading to delamination at the interface may create an area for water to aggregate. The observed growth from one metallization line to another of opposite bias is consistent with chemical attack related to a local extreme in pH arising from an electrochemical reaction at a metallization defect. [Pg.329]

Apart from those mentioned above, there are other contaminations known for diamond films, too. Oxygen and silicon are frequently observed with the latter being incorporated into the lattice in a substitutional way as well. Oxygen and further impurities like sulfur or metallic defects have not yet been studied in sufficient detail to give a final statement on their arrangement in the lattice and on their influence on the diamond properties. Calculations indicate that boron, nitrogen, phosphorous, and silicon are the only dopants suitable for a stable incorporation into the lattice. [Pg.402]

Key Words Training Material, Metal Imperfections, Metal Defects, Properties of Metals, Thermal Stress, Thermal Shock, Brittle Fracture, Heat-Up, Cool-Down, Characteristics of... [Pg.3]

X-ray microscopy n. This instrument and technique is similar to an optical microscope except that X-rays are utilized to magnify and study an object instead of visual light. Images beneath a surface can be studied because X-rays penetrate materials including metals. Defects located within the interior of an object (plastic pipe) can be observed without disturbing the structure or cutting a cross-section. The technique is useful for studying the... [Pg.1076]

Failures dependent on environment (wire bond or metallization defects, see Fig. 7.156 and Fig. 7.157). [Pg.688]

Failure mechanisms dependent on the application environment (bond or metallization defects) can be accelerated by temperature or mechanical stresses (vibration). [Pg.700]

We have until now written the formation of metal defects by exchange with oxygen in the surrounding atmosphere. We may in principle choose to write the same in terms of exchange with the metal component in the surroundings. For... [Pg.40]

Estimates of the metallic vacancy formation energy ( ) in the systems under discussion show that > EP-. This gives a qualitative explanation for the known difficulties in the synthesis of metal-defect carbides and nitrides and confirms the conclusions on this question drawn from cluster calculations. [Pg.120]

Fig. 4.27 Total DOS for metal-defect nitrides (a) Ti3N4, (b) Zr N., and (c) Hf3N4. Fig. 4.27 Total DOS for metal-defect nitrides (a) Ti3N4, (b) Zr N., and (c) Hf3N4.
Metal sulfides normally show a much larger deviation from stoichiometry than metal oxides. This is very clearly reflected in a high metal defect concentration of the strlfide lattice, resirlting in high values for the self-diffusion coefficient of the metal species. There are exceptions such as MnS, M0S2, and WS2, where the deviation from stoichiometry is srrraller or in the same order as for oxides. [Pg.569]

Corrosion can attack iron, copper, or nickel. General corrosion or pitting may occur for conventional reasons, e.g. dissolved oxygen, low pH, presence of deposits, stagnant areas, stress in the metals, defects in metal composition, or surface conditions. Dissolved oxygen often will cause pitting attack when coupled with certain other conditions, such as deposits on the metal surfaces or... [Pg.220]

The existence of a continuous series of solid solutions Lai tEUjB6, CaB -type, Pm3m, was confirmed by Aivazov et al. (1979), who used various physico-chemical methods. Samples were synthesized by borothermal reduction of the corresponding oxides (1900-2000°C). On the basis of the electrophysical properties a supposition is made on an increase of the ionic component in the Me-B bond when Eu is substituted for La. Boron and metal defects were determined from density and lattice parameter measurements (small negative deviation from Vegard s rule). Their X-ray results essentially agree with the data by Mercurio et al. (1974). [Pg.378]


See other pages where Metal defects is mentioned: [Pg.94]    [Pg.239]    [Pg.21]    [Pg.26]    [Pg.116]    [Pg.64]    [Pg.22]    [Pg.412]    [Pg.238]    [Pg.438]    [Pg.2134]    [Pg.64]    [Pg.276]    [Pg.59]    [Pg.966]    [Pg.839]    [Pg.101]    [Pg.544]    [Pg.120]    [Pg.175]    [Pg.818]    [Pg.163]    [Pg.253]    [Pg.220]    [Pg.255]    [Pg.265]    [Pg.239]    [Pg.178]   
See also in sourсe #XX -- [ Pg.64 ]




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