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Laminated ceramic matrix composites

Wang, Y.R., Chou, T.-W. (1991), Thermal shock resistance of laminated ceramic matrix composites , J. Mater. Sci., 26, 2961-2966. [Pg.433]

II. Mei, Y. D. Xu, L. F. Cheng et al. Nondestructive evaluation and mechanical characterization of a defect-embedded ceramic matrix composite laminate, Int. J. Appl. Ceram. Technol, 4 (4),378-386(2007). [Pg.255]

Recent experiments by Dr. Bar-Cohen el al. ha e shown that ultrasonic oblique insonification can be used to characterize thermal damage to composites [156]. Using an inversion technique based on a micromechanical model, the reflected ultrasonic signals arc analyzed to determine the overall laminate stiffness constant before and after loading. Another technique developed by the NASA to encompass the limitation of pulse-echo ultrasonic and photomicroscopic methods is diffuse-field acoustoultrasonic coupled vibration damping [157]. Both NASA techniques are complementary and arc used to assess microstructural damage accumulation in ceramic matrix composites. [Pg.823]

A. R. Boccaccini, C. Kaya, Glass and Glass-Ceramic Matrix Composites From Model Systems to Useful Materials, In MRS Proceedings, Vol. 702, Advanced Fibers, Plastics, Laminates and Composites, F. T. Wallenberger, N. Weston, K. K. Chawla, R. Ford, R. P. Wool, eds., Materials Research Society, Wartendale (2002), p. 277-288. [Pg.483]

Laminate composites have also been developed [55-57] in which some of the layers themselves are fibre-reinforced glass or glass-ceramic matrix composites. For example composite laminates alternating dense ceramic sheets (either SiC or SisN4) and Nicalon ... [Pg.521]

W. A. Cutler, F. W. ZokandF. F. Lange, Mechanical BehaviourofSeveral Hybrid Ceramic-Matrix-Composite Laminates, 7. Am. Ceram. Soc. 79, 1825-1833 (1996). [Pg.531]

Yasmin, A., and Bowen, P., 2002, Fracture behaviour of cross ply Nicalon/CAS II glass ceramic matrix composite laminate at room and elevated temperatures. Composites Part A Applied Science and Manufacturing 33 1209. [Pg.388]

Composites. See also Composite materials Composites. See also Laminates aluminum-filled, 10 15-28 carbon fiber, 26 745 ceramic-filled polymer, 10 15-16 ceramic-matrix, 5 551-581 conducting, 7 524 from cotton, 8 31 ferroelectric ceramic-polymer,... [Pg.205]

The range of potential components that could be fabricated from porous matrix ceramic composites may be limited because of the poor mechanical properties of the porous matrix. Porous matrices generally yield composites with low compressive and interlaminar properties, making it difficult to design structures capable of carrying out-of-plane loads. Furthermore, it is difficult to attach porous matrix composites to neighboring structures. Three-dimensional fiber arehiteetures rather than two-dimensional laminate structures will probably be required for the components made from a porous matrix eeramie composite. [Pg.80]

Reinforced Plastic n (RP) A plastic composition in which are embedded fibers that are much stronger and typically much stifier than the matrix resin. The reinforcements are usually fibers, rovings, fabrics, or mats, or mixed forms of glass, carbon, asbestos, metals, ceramics, paper, sisal, cotton, or nylon. Resins most commonly used are polyesters, phenolics, aminos, siH-cones, epoxies, and various thermoplastics. The term reinforced plastic includes some forms of Laminate and molded parts in which the reinforcements are not in layered form. When the resin is thermoplastic, the term reinforced thermoplastic is often used. Methods of forming reinforced-plastics articles from thermosetting resins are defined under the entries Ksted below. [Pg.621]

Organic-ceramic composites may use an epoxy as the matrix and glass or ceramic powder as the filler. A common example is the fiberglass-reinforced epoxy used as a printed circuit laminate. An epoxy substrate filled with alumina and carbon black has also been developed. By weight, the composition is 10.8 percent epoxy resin, 89 percent alumina, and 0.2 percent carbon black. This material has a thermal conductivity of 3.0 to 4.0 W/(m K), compared to both glass-epoxy printed circuit material [0.2 W/(m K)] and glass-alumina low temperature cofired substrates [2.5 W/(m K)]. The TCE (17 ppm/°C) is substantially below that... [Pg.280]

Some of the composites have also been in the consumer market for some time. In addition to plywood, homebuilders and furniture makers are making extensive use of particle board (woodchips in a polymer matrix) because of its superior dimensional stability. Often it is laminated to a wood veneer for use as furniture. Decorative vinyl-clad steel or aluminum panels are used in office buildings. Generally, the more advanced composites such fiber-reinforced metals and ceramics have been too expensive for... [Pg.196]


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