Interfacial stresses mechanical properties

A reasonably close match of thermal expansion of the coating and substrate over a wide temperature range to limit failure caused by residual stresses is desired for coatings. Because temperature gradients cause stress even in a weU-matched system, the mechanical properties, strength, and ductUity of the coating as well as the interfacial strength must be considered. 

Film Adhesion. The adhesion of an inorganic thin film to a surface depends on the deformation and fracture modes associated with the failure (4). The strength of the adhesion depends on the mechanical properties of the substrate surface, fracture toughness of the interfacial material, and the appHed stress. Adhesion failure can occur owiag to mechanical stressing, corrosion, or diffusion of interfacial species away from the interface. The failure can be exacerbated by residual stresses in the film, a low fracture toughness of the interfacial material, or the chemical and thermal environment or species in the substrate, such as gases, that can diffuse to the interface. 

An important consideration is the effect of filler and its degree of interaction with the polymer matrix. Under strain, a weak bond at the binder-filler interface often leads to dewetting of the binder from the solid particles to formation of voids and deterioration of mechanical properties. The primary objective is, therefore, to enhance the particle-matrix interaction or increase debond fracture energy. A most desirable property is a narrow gap between the maximum (e ) and ultimate elongation ch) on the stress-strain curve. The ratio, e , eh, may be considered as the interface efficiency, a ratio of unity implying perfect efficiency at the interfacial Junction. 

Materials used in body implants must meet several essential requirements such as tissue compatibility, enzymatic and hydrolytic stability. They must also be chemically resistant and have good mechanical properties. They must not be toxic, or the surrounding tissue will die. They must be resistant to the body fluids which usually have a high percentage of chloride ions. They must be biologically active if an interfacial bond is to be achieved. In some cases, they must be able to withstand continued high mechanical stresses for many years. 

Additional drawbacks to the use of polyimide insulators for the fabrication of multilevel structures include self- or auto-adhesion. It has been demonstrated that the interfacial strength of polyimide layers sequentially cast and cured depends on the interdiffusion between layers, which in turn depends on the cure time and temperature for both the first layer (Tj) and the combined first and second layers (T2) [3]. In this work, it was shown that unusually high diffusion distances ( 200 nm) were required to achieve bulk strength [3]. For T2 > Tj, the adhesion decreased with increasing T. However, for T2 < Tj and Tj 400 °C, the adhesion between the layers was poor irrespective of T2. Consequently, it is of interest to combine the desirable characteristics of polyimide with other materials in such a way as to produce a low stress, low dielectric constant, self-adhering material with the desirable processabiHty and mechanical properties of polyimide. 

In particulate-filled thermoplastics, the matrix is the load-bearing component and all deformation processes take place in the matrix. Particulate fillers are, in most cases, not capable of carrying any substantial portion of the load due to the absence of interfacial friction as the means of stress transfer. This is evidenced by the lack of broken particles on the surfaces of fractured filled thermoplastics. Hence, it seems appropriate to start this volume with a brief overview of the basic structural levels and manifestation of these levels in governing the mechanical properties of semicrystaUine thermoplastics used in compounding. 

Z3. PMDA-ODA on MgO. PMDA-ODA peel force data shown in Fig. 7 exhibit a very interesting phenomenon as a function of T H exposure. The peel force is significantly increased as the time in T H is increased. This is somewhat unusual, but apparently repeatable. The exposure to APS has not made much difference in the results, which is understandable from the initial surface analyses after IPA cleaning and APS exposure. The XPS data show no detectable amount of APS on the thus exposed MgO surface. The reasons for the peel force increase as a function of T H exposure are not clear at this time. This is, however, due to increased interfacial strength, and not due to the polyimide mechanical properties (Young s modulus and yield stress) changes. If the latter were the case, then we should see similar effects also in the first two cases, which is not seen. However, more detailed analysis is essential to clarify the exact mechanism and this observation merits further study. 

Broadly speaking, the mechanical properties can be divided into two classes bulk and interfacial . Within the bulk properties are included the shear and extensional viscosities, moduli and yield stresses (material constants that relate stress to strain or strain rate), and within interfacial rheology are included the wall-slip and friction effects. The interfacial properties are independent of bulk mechanical properties and governed by the frictional or surface forces which are thought to operate at relatively... 

The interphase provided by the adhesion promoter may be hard or soft and could affect the mechanical properties. A soft interphase, for example, can significantly improve fatigue and other properties. A soft interphase will reduce stress concentrations. A rigid interphase improves stress transfer of resin to the filler or adherend and improves interfacial shear strength. Adhesion promoters generally increase adhesion between the resin matrix and substrate, thus raising the fracture energy required to initiate a crack. 

The gap between the predictions and experimental results arises from imperfect dispersion of carbon nanotubes and poor load transfer from the matrix to the nanotubes. Even modest nanotube agglomeration impacts the diameter and length distributions of the nanofillers and overall is likely to decrease the aspect ratio. In addition, nanotube agglomeration reduces the modulus of the nanofillers relative to that of isolated nanotubes because there are only weak dispersive forces between the nanotubes. Schadler et al. (71) and Ajayan et al. (72) concluded from Raman spectra that slippage occurs between the shells of MWNTs and within SWNT ropes and may limit stress transfer in nanotube/polymer composites. Thus, good dispersion of CNTs and strong interfacial interactions between CNTs and PU chains contribute to the dramatic improvement of the mechanical properties of the... 

Residual stress resulting from the thermal expansion mismatch between the fiber and matrix is another factor which will affect the interfacial properties, matrix cracking stress and the mechanical properties of ceramic... 

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