Optoelectronic circuits, integrated

Optical devices are preferentially integrated in optoelectronic circuits. State-of-the-art microfabrications, such as with LIGA technology, miniaturised laser diodes, etc., make sophisticated, small and rigid optical sensors and actuators possible. 

The present chapter deals with the CVD of metals and some metal alloys and intermetallics. The metals are listed alphabetically. The range of applications is extensive as many of these materials play an important part in the fabrication of integrated circuits and other semiconductor devices in optoelectronic and optical applications, in corrosion protection, and in the design of structural parts. These applications are reviewed in greater depth in Chs. 13 to 19. 

T. Sugeta and T. Ishibashi, Hetero-Bipolar Transistor and Its LSI Application H. Matsueda, T. Tanaka, and M. Nakamura, Optoelectronic Integrated Circuits... 

Stability for use in optical interconnects. In the near future, optoelectronic integrated circuits and optoelectronic multichip modules will be produced. Materials with high thermal stability will thus become very important in providing compatibility with conventional 1C fabrication processes and in ensuring device reliability. Polyimides have excellent thermal stability so they are often used as electronic materials. Furuya et al. introduced polyimide as an optical interconnect material for the first time. Reuter et al. have applied polyimides to optical interconnects and have evaluated the fluorinated polyimides prepared from 6FDA and three diamines, ODA (3), 2,2-bis(3-aminophenyl) hexafluoropropane (3,3 -6F) (4), and 4,4 -6F (2), as optical waveguide materials. 

Electronic device fabrication requires a substrate, which is typically a highly purified slice of singlecrystal semiconductor. For optoelectronic applications, the substrate could be GaAs, InP, or some other semiconductor but for most integrated circuits and many Si-Ge wireless applications, the wafer is made of Si. 

H. Matsueda, Physics of Optoelectronic Integrated Circuits, Shokabo, Tokyo (1989). 

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