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Integration and Packaging

Portable systems must operate on a portable power source. Often this simply means batteries. When heating becomes a part of the operating sequence, batteries can be consumed quickly. A well-defined energy budget is necessary early in the design process. [Pg.18]

Portable systems are often introduced into small spaces in search of the quarry. They also tend to be handled rather roughly by their operators. Current trends in microminiaturization offer relief to the system designer in both these areas. [Pg.18]


Grosser, V., Microfabrication of modular MEMS - assembly and reliability, in Proceedings of the Conference on Design, Test, Integration and Packaging of MEMS/ MOEMS, DTPI 2002 (5-8 May 2002), Cannes Mandelieu, 2002. [Pg.636]

Markunas B. 3D architectures for semiconductor integration and packaging. Presented at the RTI International Technology Venture Forum, Burlingame,... [Pg.459]

Photodiodes are used as detectors in many automated systems either as individual components or in multiples as an array. Photomultiplier tubes are required in many immunoassay systems to provide adequate sensitivity and fast detector response times for fluorescent and chemiluminescent measurements. Several approaches have been used for the electrooptical integration and packaging in different analyzers. A logarithmic amplifier or microprocessor and/or computer software converts transmittance to absorbance. Low-cost analog-to-digital converters with conversion times... [Pg.277]

J. Muchow, A. Kretschmann, R. Henn, K. Skrobanek, S. Finkbeiner, H.-R. Krauss, Influence of process variation on the functionality of a high pressure sensor, Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2002, SPIE Proc 4755, Bellingham WA, USA, 2002, 143-148. [Pg.58]

G. Lorenz, A. Morris, I. Lakkis, A top-down design flow for MOEMS, Proc. Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, Cannes, France, 2001, 126-137. [Pg.72]

Hah D, Toshiyoshi H, Wu MC (2002) Design of electrostatic actuators for MOEMS applications, design, test, integration and packaging of MEMS/ MOEMS. Proc SPIE 4755 200-207... [Pg.1835]

Piehonat, T Gauthier-Manuel, B. In Proceedings of the 5 Symposium on Design, Test, Integration and Packaging ofMEMS/MOEMS (DTIP 06), Stresa, Italy, 2006 pp 354-359. [Pg.245]

Equally important as tape casting in the fabrication of multilayer ceramics is thick film processing. Thick film technology is widely used in microelectronics for resistor networks, hybrid integrated circuitry, and discrete components, such as capacitors and inductors along with metallization of MLC capacitors and packages as mentioned above. [Pg.313]

Specifications and Packaging. Aluminum chloride s catalytic activity depends on its purity and particle size. Moisture contamination is an important concern and exposure to humid air must be prevented to preserve product integrity. Moisture contamination can be deterrnined by a sample s nonvolatile material content. After subliming, the material remaining is principally nonvolatile aluminum oxide. Water contamination leads to a higher content of nonvolatile material. [Pg.148]

Ceramics. Calcined aluminas are used in both electronic and stmctural ceramics (see Advanced ceramics). Electronic appHcations are dominant in the United States and Japan whereas mechanical appHcations are predominant in Europe (1). Specialty electronic integrated circuit packages generally use the low soda and thermally reactive aluminas. [Pg.162]

The 10 volumes in the Series on characterization of particular materials classes include volumes on silicon processir, metals and alloys, catalytic materials, integrated circuit packaging, etc. Characterization is approached from the materials user s point of view. Thus, in general, the format is based on properties, processing steps, materials classification, etc., rather than on a technique. The emphasis of all volumes is on surfaces, interfaces, and thin films, but the emphasis varies depending on the relative importance of these areas for the materials class concerned. Appendixes in each volume reproduce the relevant one-page summaries from the Encyclopedia and provide longer summaries for any techniques referred to that are not covered in the Encyclopedia. [Pg.763]

Opening the packages and testing for package integrity and changes in food color, flavor, odor, or taste. [Pg.85]

Since the photosensitive material and the electronics layer are very thin, the detector is mounted on a mechanical package for structural integrity. This package is thermally matched to the detector so that the detector will not be stretched or compressed during the large transition from room temperature to operating temperature. [Pg.130]

Applications Although Soxtec combines the best qualities of reflux and Soxhlet extractions up to now fairly little evidence has been reported concerning the efficacy of this system for polymer and rubber analysis. Nevertheless, it appears that oligomers and other reaction residues, softeners, antioxidants (e.g. BHT) and several other additives used to modify polymers are easily extracted from PVC, PP, PE, PS, rubber and many other polymeric materials. Also, some leading international plastic, rubber and packaging companies have made Soxtec an integral part of their quality control routines. Some application examples where Soxtec has proved successful are [148] ... [Pg.72]


See other pages where Integration and Packaging is mentioned: [Pg.138]    [Pg.548]    [Pg.18]    [Pg.54]    [Pg.270]    [Pg.330]    [Pg.244]    [Pg.222]    [Pg.138]    [Pg.548]    [Pg.18]    [Pg.54]    [Pg.270]    [Pg.330]    [Pg.244]    [Pg.222]    [Pg.206]    [Pg.297]    [Pg.145]    [Pg.241]    [Pg.118]    [Pg.518]    [Pg.204]    [Pg.172]    [Pg.235]    [Pg.437]    [Pg.162]    [Pg.505]    [Pg.349]    [Pg.445]    [Pg.2532]    [Pg.297]    [Pg.146]    [Pg.52]    [Pg.40]    [Pg.4]    [Pg.411]    [Pg.335]    [Pg.12]    [Pg.1]    [Pg.416]   


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Substrates and Packages for Integrated Circuits

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