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Integrated surface micromachining

CO Resistive sensors pellistors, metal-oxide sensors Optical sensors micro-spectrometer, IR-sources, IR-detectors, IR-filters Hybrid or integrated, surface micromachining Sn02 sintered thick film (Figaro, FIS,. ..), Sn02 thin and thick film on silicon (MiCS, Microsens) IR spectroscopy (Vaisala, Honeywell,. ..)... [Pg.223]

VOC (volatile organic compound Work-function sensors, micro-spectrometer, IR-sources, IR-detectors, I R-filters Hybrid or integrated, surface micromachining... [Pg.223]

J. Xie, J. Shih, Y.C. Tai, Integrated surface-micromachined mass flow controller, Proceedings of the 16th IEEE International Conference on MicroElectro Mechanical Systems (MEMS 2003), Kyoto, Japan, 20 (2003). [Pg.52]

Figure 5.2.1 shows a photograph of an integrated surface-micromachined accelerometer, and Figure 5.2.2 is a close-up of the surface-micromachined polysilicon MEMS structure near the center of Figure 5.2.1. The structural material is 3 pm thick polysilicon and the IC process is bipolar and CMOS (BiCMOS) with thin film resistors. This structure thus combines bipolar transistors, CMOS, precision laser-trimmed resistors, and mechanical polysilicon [4],... Figure 5.2.1 shows a photograph of an integrated surface-micromachined accelerometer, and Figure 5.2.2 is a close-up of the surface-micromachined polysilicon MEMS structure near the center of Figure 5.2.1. The structural material is 3 pm thick polysilicon and the IC process is bipolar and CMOS (BiCMOS) with thin film resistors. This structure thus combines bipolar transistors, CMOS, precision laser-trimmed resistors, and mechanical polysilicon [4],...
Fig. 5.2.3 Cross-section of integrated surface micromachined device... Fig. 5.2.3 Cross-section of integrated surface micromachined device...
Processing Integrated Surface Micromachined Polysilicon Structures... [Pg.96]

Oxygen plasma cleaning. The integrated surface-micromachined wafer is exposed to an oxygen plasma to remove the photoresist and thus create free 3D structures as shown in Figure 5.2.9. [Pg.99]

T.A. Core, W. K. Tsang, S.J. Sherman, Fabrication technology for an integrated surface-micromachined sensor, Solid State Technology, 1993, 39-44. [Pg.102]

The anisotropic wet etching of silicon is a unique fabrication process in the MEMS field. The need to develop new processes to fabricate functional 3D microstructures in various materials is urgent for progress in microfluidic systems, microsensors, micro-actuators, and microinstrumentation. At present, to integrate surface micromachined devices and standard IC devices with bulk micromachined structures to demonstrate a new functional MEMS application is still a challenge for researchers who work in this field. The cooperation of multidisciplinary researchers will be required to develop miniature systems with the most appropriate building philosophy and the best operation performance. [Pg.248]


See other pages where Integrated surface micromachining is mentioned: [Pg.223]    [Pg.92]    [Pg.93]    [Pg.94]    [Pg.95]    [Pg.96]    [Pg.97]    [Pg.98]    [Pg.99]    [Pg.99]    [Pg.100]    [Pg.101]    [Pg.101]    [Pg.270]    [Pg.221]   
See also in sourсe #XX -- [ Pg.92 , Pg.93 , Pg.94 , Pg.95 , Pg.96 , Pg.97 , Pg.98 , Pg.99 , Pg.100 , Pg.101 , Pg.102 , Pg.103 , Pg.104 , Pg.105 ]




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