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Immersion gold

Dressier and Mastai studied the enantioselective crystallization of glutamic acid on self assembled monolayers of cysteine (Dressier and Mastai, 2007). The chiral SAMs were prepared by immersing gold covered glass slides in aqueous solutions of cysteine (lOmM) for 2 hours. These SAMs were then characterized by X-ray diffraction, micro-Raman measurements. X-ray photoelectron spectroscopy, contact angle and ellipsometry. [Pg.52]

Nishina T, Uchida I, Selman JR (1994) Gas electrode reactions in molten carbonate media V. Electrochemical analysis of the oxygen reduction mechanism at a fully immersed gold electrode. J Electrochem Soc 141 1191-1198... [Pg.247]

Electrolytic nickel/electrolytic gold Electroless gold Direct immersion gold Solid solder deposit... [Pg.753]

Other surface finishes include reflowed tin-lead, electrolytic nickel/electrolytic gold, antitarnish and reflux, electroless palladium, electroless gold, direct immersion gold, and solid solder deposit. [Pg.763]

IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, October 2002. [Pg.773]

FIGURE 42.14 A gradual reduction of wetting forces as a function of copper migration through the Direct Immersion Gold (DIG) deposit after 877 days in storage. [Pg.1009]

The substrate surfaces of choice are usually one of the following electroless nickel/immersion gold (ENIG), immersion silver (ImAg), and organic solderability preservative (OSP). Two other finishes, hot air solder leveling (HASL) and immersion tin, are also in use, but HASL has declined in volume and immersion tin has not reached significant volumes due to concerns over reliability. [Pg.1016]

Other surface finish-delated defects Immersion silver (Imm-Ag) sometimes exhibits hn-ear arrays of microvoids at the intermetalhc interface which detracts from solder joint strength. Electroless nickel/immersion gold (ENIG) sometimes results in brittle fracture if the plating chemistries are not maintained properly. [Pg.1047]

There are a number of other surface finishes used in the industry, such as Electroless Nickel Electroless Palladium Immersion Gold (NiPdAu), Immersion Silver, Immersion Gold, Immersion Tin, OSP and Electrolytic Nickel Gold. There are reliability and process trade offs with each surface finish. That is why it is recommended that strain/strain rate characterization and thermal cycling be performed for each set of surface finish before it is selected for the specific end-use conditions in which it will be used. The industry test methods used to evaluate different surface finishes are outlined in detail in the next chapter. [Pg.1386]

Deepak Goyal.Tim Lane, Patrick Kinzie, Chris Panichas,Kam Meng Chong, Oscar Villalobos, Failure Mechanisms of Brittle Solder Joint Fracture in the Presence of Electroless Nickel Immersion Gold (ENIG) Interface, Electronic Components and Technology Conference, 2004, pp. 732-139. [Pg.1395]

This chapter reviews Uteratme on the microstructure of solder joints and the interactions of solders with substrates and related solder joint reliability issues. The substrates here are limited to Cu, Ni-coated Cu, electroless nickel/ immersion gold (ENIG), and hot air solder leveled (HASL) Sn-Pb. The solders are mainly Sn, eutectic or near eutectic Sn-Ag, and Sn-Ag-Cu alloys. Specific reliability issues discussed here include black pads of ENIG, gold embrittlement, compatibility of Pb-free solders with Pb-containing surface finish, and Kirkendall voids. [Pg.29]

Failure mechanisms include phosphorus segregation, corrosion in immersion gold bath, brittle Ni-Sn intermetallics, and Kirkendall voids. [Pg.55]

N. Biunno, A Root Cause Failure Mechanism for Solder Joint Integrity of Electroless Nickel/Immersion Gold Surface Finishes, Proceedings of the IPC Printed Circuit Expo, Paper S18-5, March 14-18, 1999... [Pg.65]

ENIG electroless nickel and immersion gold (Ni/Au) QA quality assurance... [Pg.282]

See other pages where Immersion gold is mentioned: [Pg.134]    [Pg.276]    [Pg.339]    [Pg.295]    [Pg.983]    [Pg.214]    [Pg.218]    [Pg.276]    [Pg.276]    [Pg.224]    [Pg.111]    [Pg.378]    [Pg.276]    [Pg.159]    [Pg.752]    [Pg.754]    [Pg.756]    [Pg.756]    [Pg.764]    [Pg.764]    [Pg.1003]    [Pg.1005]    [Pg.1006]    [Pg.1048]    [Pg.1381]    [Pg.1395]    [Pg.108]    [Pg.276]    [Pg.5]    [Pg.5]    [Pg.449]   
See also in sourсe #XX -- [ Pg.75 ]



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