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Organic solderability preservative

Organic solderability preservative N/A - Not Available NA - Not Applicable. Source Compiled from suppliers technical data sheets. [Pg.237]

TABLE 32.5 Process Flow for Organic Solderability Preservative... [Pg.759]

Organic solderability preservative (OSP) This is another process and chemistry that has... [Pg.783]

The substrate surfaces of choice are usually one of the following electroless nickel/immersion gold (ENIG), immersion silver (ImAg), and organic solderability preservative (OSP). Two other finishes, hot air solder leveling (HASL) and immersion tin, are also in use, but HASL has declined in volume and immersion tin has not reached significant volumes due to concerns over reliability. [Pg.1016]

OSP Organic solder preservatives are inexpensive and also provide a flat surface for surface-mount technology (SMT) placement. Storage life for OSP is less than for the metallized finishes, and multiple thermal cycles cause it to degrade. [Pg.1016]

C-SAM C mode scanning acoustic microscopy OSP organic solderability preservative... [Pg.282]

FIG. 9 Degradation of solder wetting of organic solderability preservative (OSP) with repeated temperature/time cycles. (From Ref. 5.)... [Pg.443]

Several thin-film finishes have received considerable attention Ni/Au, Ni/Pd, Ni/Pd/Au, pure Sn, and pure Ag, to name a few. There are also planar, nonmetallic finishes referred to as organic solderability preservatives (OSPs). [Pg.574]

See other pages where Organic solderability preservative is mentioned: [Pg.241]    [Pg.383]    [Pg.302]    [Pg.303]    [Pg.437]    [Pg.304]    [Pg.758]    [Pg.1048]    [Pg.1048]    [Pg.1247]    [Pg.5]    [Pg.83]    [Pg.108]    [Pg.75]    [Pg.88]    [Pg.435]    [Pg.437]    [Pg.442]    [Pg.442]    [Pg.469]    [Pg.510]    [Pg.593]    [Pg.700]    [Pg.782]   


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