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Electroless nickel/immersion gold

IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, October 2002. [Pg.773]

The substrate surfaces of choice are usually one of the following electroless nickel/immersion gold (ENIG), immersion silver (ImAg), and organic solderability preservative (OSP). Two other finishes, hot air solder leveling (HASL) and immersion tin, are also in use, but HASL has declined in volume and immersion tin has not reached significant volumes due to concerns over reliability. [Pg.1016]

Other surface finish-delated defects Immersion silver (Imm-Ag) sometimes exhibits hn-ear arrays of microvoids at the intermetalhc interface which detracts from solder joint strength. Electroless nickel/immersion gold (ENIG) sometimes results in brittle fracture if the plating chemistries are not maintained properly. [Pg.1047]

Deepak Goyal.Tim Lane, Patrick Kinzie, Chris Panichas,Kam Meng Chong, Oscar Villalobos, Failure Mechanisms of Brittle Solder Joint Fracture in the Presence of Electroless Nickel Immersion Gold (ENIG) Interface, Electronic Components and Technology Conference, 2004, pp. 732-139. [Pg.1395]

This chapter reviews Uteratme on the microstructure of solder joints and the interactions of solders with substrates and related solder joint reliability issues. The substrates here are limited to Cu, Ni-coated Cu, electroless nickel/ immersion gold (ENIG), and hot air solder leveled (HASL) Sn-Pb. The solders are mainly Sn, eutectic or near eutectic Sn-Ag, and Sn-Ag-Cu alloys. Specific reliability issues discussed here include black pads of ENIG, gold embrittlement, compatibility of Pb-free solders with Pb-containing surface finish, and Kirkendall voids. [Pg.29]

N. Biunno, A Root Cause Failure Mechanism for Solder Joint Integrity of Electroless Nickel/Immersion Gold Surface Finishes, Proceedings of the IPC Printed Circuit Expo, Paper S18-5, March 14-18, 1999... [Pg.65]

O Brien, G. Milad, G. Standard Development Efforts of Electroless Nickel Immersion Gold IPC-1552, Proceedings of IPC Annual Meeting Orlando, FL, Oct. 2001 S05-2-6. [Pg.463]

Mei, Z. Kaufmann, M. Eslambolchi, A. Johnson, P. Brittle interfadal fracture of PBGA packages soldered on electroless nickel/immersion gold. Proceedings 48th Electronic Components and Technology Conference, 1998 952-961. [Pg.493]

Complementary lead-free board finishes, including solderability preservative layer (Cu-OSP), immersion-silver (Alpha level ) and electroless nickel/immersion gold, were assessed and... [Pg.714]

See other pages where Electroless nickel/immersion gold is mentioned: [Pg.752]    [Pg.754]    [Pg.756]    [Pg.1048]    [Pg.1381]    [Pg.1395]    [Pg.75]    [Pg.37]    [Pg.435]    [Pg.439]    [Pg.491]   
See also in sourсe #XX -- [ Pg.75 ]

See also in sourсe #XX -- [ Pg.435 , Pg.439 , Pg.440 , Pg.802 ]



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