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Heat diffusion process

The original problem. The heat diffusion process on a straight line is described by the heat conduction equation... [Pg.300]

The relationship between heat density q and heat current jq in the heat-diffusion process is ijr + V = 0 and = —kVT (where k is the thermal con-... [Pg.242]

Equation (9.4) describes the thermal expansion and electrostrictive effects on the density change, whereas Equation (9.5) describes the photoabsorption and the resulting temperature rise and heat diffusion process. [Pg.229]

Dj IE, ratio of a crack is held constant but the dimensions approach molecular dimensions, the crack becomes more retentive. At room temperature, gaseous molecules can enter such a crack direcdy and by two-dimensional diffusion processes. The amount of work necessary to remove completely the water from the pores of an artificial 2eohte can be as high as 400 kj/mol (95.6 kcal/mol). The reason is that the water molecule can make up to six H-bond attachments to the walls of a pore when the pore size is only slightly larger. In comparison, the heat of vaporization of bulk water is 42 kJ /mol (10 kcal/mol), and the heat of desorption of submonolayer water molecules on a plane, soHd substrate is up to 59 kJ/mol (14.1 kcal/mol). The heat of desorption appears as a exponential in the equation correlating desorption rate and temperature (see Molecularsieves). [Pg.369]

All these results generalize to homogeneous linear differential equations with constant coefficients of order higher than 2. These equations (especially of order 2) have been much used because of the ease of solution. Oscillations, electric circuits, diffusion processes, and heat-flow problems are a few examples for which such equations are useful. [Pg.454]

Chlorinated rubber is also used to promote the adhesion of solvent-borne CR adhesives to metals and plasticized PVC. Addition of a low molecular weight chlorinated rubber (containing about 65 wt% chlorine) improves the shear strength and creep resistance of polychloroprene adhesives [75] but a reduction in open time is also produced. A heat reactivation (process in which the surface of the adhesive film is raised to 90-100°C to destroy the crystallinity of the film and allowing diffusion to produce polymer chain interlocking more rapidly) restores tack to the polychloroprene adhesives. [Pg.664]

We have so far assumed that the atoms deposited from the vapor phase or from dilute solution strike randomly and balHstically on the crystal surface. However, the material to be crystallized would normally be transported through another medium. Even if this is achieved by hydrodynamic convection, it must nevertheless overcome the last displacement for incorporation by a random diffusion process. Therefore, diffusion of material (as well as of heat) is the most important transport mechanism during crystal growth. An exception, to some extent, is molecular beam epitaxy (MBE) (see [3,12-14] and [15-19]) where the atoms may arrive non-thermalized at supersonic speeds on the crystal surface. But again, after their deposition, surface diffusion then comes into play. [Pg.880]

In this section we discuss the basic mechanisms of pattern formation in growth processes under the influence of a diffusion field. For simphcity we consider the sohdification of a pure material from the undercooled melt, where the latent heat L is emitted from the solidification front. Since heat diffusion is a slow and rate-limiting process, we may assume that the interface kinetics is fast enough to achieve local equihbrium at the phase boundary. Strictly speaking, we assume an infinitely fast kinetic coefficient. [Pg.888]

Sublimation. During sublimation, the lattice constituents of the solid are directly transferred to the gas phase without the intervention of liquefaction, though there may be mobile intermediates at the surface of the heated solid. Various features of the sublimation process have been reviewed by Somorjai [18] and by Rosenblatt [19] who included consideration of kinetic aspects. Rhead [ 20] has discussed diffusion processes at surfaces. [Pg.3]

In a discussion of these results, Bertrand et al. [596,1258] point out that S—T behaviour is not a specific feature of any restricted group of hydrates and is not determined by the nature of the residual phase, since it occurs in dehydrations which yield products that are amorphous or crystalline and anhydrous or lower hydrates. Reactions may be controlled by interface or diffusion processes. The magnitudes of S—T effects observed in different systems are not markedly different, which indicates that the controlling factor is relatively insensitive to the chemical properties of the reactant. From these observations, it is concluded that S—T behaviour is determined by heat and gas diffusion at the microdomain level, the highly localized departures from equilibrium are not, however, readily investigated experimentally. [Pg.129]

Sintering of particles occurs when one heats a system of particles to an elevated temperature. It Is caused by an interaction of particle surfaces whereby the surfaces fuse together and form a solid mass. It Is related to a solid state reaction In that sintering is governed by diffusion processes, but no solid state reaction, or change of composition or state, takes place. The best way to illustrate this phenomenon is to use pore growth as an example. [Pg.193]

Obviously, the other side must be protected during the process to form one or the other active layer. Clearly, the silicon disc needs to be heated as well during the process to aid the diffusion process. Note that the surface will be rich in diffusing species and that the density of species declines within the mterior, forming a diffuse layer which is dense near the top and thinner in the interior of the silicon. What happens is that... [Pg.348]

The reduction diffusion process has also been used for the production of powders of the magnetic neodymium-iron-boron alloy (Nd15Fe77B8). The reaction involves use of a powder mix of neodymium oxide, iron, ferroboron and calcium. The reaction is conducted by heating the powder charge mixture at 1200 °C for 4 h under vacuum. Neodymium-iron-boron alloys are much more prone to oxidation than samarium-cobalt alloys and a proprietary leaching procedure is used for the separation of the alloy and calcium oxide. [Pg.384]

The lack of hydrodynamic definition was recognized by Eucken (E7), who considered convective diffusion transverse to a parallel flow, and obtained an expression analogous to the Leveque equation of heat transfer (L5b, B4c, p. 404). Experiments with Couette flow between a rotating inner cylinder and a stationary outer cylinder did not confirm his predictions (see also Section VI,D). At very low rotation rates laminar flow is stable, and does not contribute to the diffusion process since there is no velocity component in the radial direction. At higher rotation rates, secondary flow patterns form (Taylor vortices), and finally the flow becomes turbulent. Neither of the two flow regimes satisfies the conditions of the Leveque equation. [Pg.217]

Durable changes of the catalytic properties of supported platinum induced by microwave irradiation have been also recorded [29]. A drastic reduction of the time of activation (from 9 h to 10 min) was observed in the activation of NaY zeolite catalyst by microwave dehydration in comparison with conventional thermal activation [30]. The very efficient activation and regeneration of zeolites by microwave heating can be explained by the direct desorption of water molecules from zeolite by the electromagnetic field this process is independent of the temperature of the solid [31]. Interaction between the adsorbed molecules and the microwave field does not result simply in heating of the system. Desorption is much faster than in the conventional thermal process, because transport of water molecules from the inside of the zeolite pores is much faster than the usual diffusion process. [Pg.350]

Here F is the Faraday constant C = concentration of dissolved O2, in air-saturated water C = 2.7 x 10-7 mol cm 3 (C will be appreciably less in relatively concentrated heated solutions) the diffusion coefficient D = 2 x 10-5 cm2/s t is the time (s) r is the radius (cm). Figure 16 shows various plots of zm(02) vs. log t for various values of the microdisk electrode radius r. For large values of r, the transport of O2 to the surface follows a linear type of profile for finite times in the absence of stirring. In the case of small values of r, however, steady-state type diffusion conditions apply at shorter times due to the nonplanar nature of the diffusion process involved. Thus, the partial current density for O2 reduction in electroless deposition will tend to be more governed by kinetic factors at small features, while it will tend to be determined by the diffusion layer thickness in the case of large features. [Pg.267]

These carriers of heat do not move balistically from the hotter part of the material to the colder one. They are scattered by other electrons, phonons, defects of the lattice and impurities. The result is a diffusive process which, in the simplest form, can be described as a gas diffusing through the material. Hence, the thermal conductivity k can be written as ... [Pg.89]

In this paper, we have given a brief summary of our recent work on heat conduction in one dimensional systems. We have shown that strong chaos is sufficient but not strictly necessary for the validity of the Fourier heat law. Indeed linear mixing can be sufficient to induce a diffusive process which ensures normal heat conductivity. [Pg.24]

Characteristics and implementation of the treatments depend on the expected results and on the properties of the material considered a variety of processes are employed. In ferrous alloys, in steels, a eutectoid transformation plays a prominent role, and aspects described by time-temperature-transformation diagrams and martensite formation are of relevant interest. See a short presentation of these points in 5.10.4.5. Titanium alloys are an example of the formation of structures in which two phases may be present in comparable quantities. A few remarks about a and (3 Ti alloys and the relevant heat treatments have been made in 5.6.4.1.1. More generally, for the various metals, the existence of different crystal forms, their transformation temperatures, and the extension of solid-solution ranges with other metals are preliminary points in the definition of convenient heat treatments and of their effects. In the evaluation and planning of the treatments, due consideration must be given to the heating and/or cooling rate and to the diffusion processes (in pure metals and in alloys). [Pg.543]


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