Glue metals

Chrom-kali, n. (rotes) potassium dichromate (gelbes) potassium chromate, -karbid, n. chromium carbide, -lack, m. chrome lake, -leder, n. chrome leather, -leim, m. chrome gelatin chrome glue, -metall, n. chromium metal, -natron, n. (rotss) sodium dichromate (gelbes) sodium chromate, -nickel-stahl, m. chrome-nickel steel. 

Figure 4.13. Dependence of adhesive strength A of the glue-metal joint on the isocyanate/diol ratio B ( B is the mole ratio of 2,4-toluylene isocyanate to polyester) of a glue. Molecular weights of polyester are 500 (7) ...

Regarding the ability of species to glue metal aggregates together, compounds such as (NH4)2PdS, 21120 (with Pd atoms linked via chains in a three dimensional array) and (NH4)CuS4 (with solid state ( 084) chelate rings linked via additional Cu—S bonds to form one-dimensional polymeric anions) are similar to those discussed in the last section. 

The severe diminution, with respect to Au/mica, the hde injection dfidency fiom the Au/Cr substrates an>ear to be assodated with die known ccmtamination of the Au surface by migration of the glue metal Cr to die pdymer/metal interface. While this has been discussed I eviously,ii) we have obtained independent qiectroscopic evidence that this occurs in our particular Au/Cr/Si substrates. Comparison of the surface composititm and demental depth profile analyses of the Au/mica and AWCr substrates were obtained by the TOFSIMS technique and the salient results are presented in Figs. 4 and S, respectively. The prindple result expressed in Fig. 4 is that rdatively few contaminants are present at the Au/mica surface and that surface texture of Au/mka is nearly entirdy Au(l 11). ... 

It is thought that the function of the glue or gelatin is to combine with very slight traces of heavy metal cations, for example Cu, which are known to catalyse the nitrogen-forming reaction. 

The BLM layer uses a glue layer of chromium or titanium. These metals stick well to other metals and most dielectrics, but they are not solderable. Copper, nickel, and silver have been used as the solder-wetting layer for BLM in appHcations involving 95% lead—5% tin solders. Gold is commonly used as the oxidation layer on account of its resistance to oxidation and its excellent solderabiUty. 

Extmded engineering thermoplastic stock can be treated like other building material ia that it can be machined, cut, and fastened. However, none of the engineering plastics can be considered a one-for-one substitute for metals or wood. For example, impact resistance must be considered, and glues, paints, etc, must be screened for chemical aggressiveness and adhesion capabiUty. 

Fatty-acid soaps Alkali, alkaline earth, and other metal soaps sodium stearate aluminum stearate Gear oils paper stock paper sizing glue solutions... 

Lumber and wood products Sawmills, millwork plants, wooden containers, miscellaneous wood products, manufacturing Scrap wood, shavings, sawdust in some instances, metals, plastics, fibers, glues, sealers, paints, solvents... 

As polymer chemistry advanced in the 1930s and 1940s, stronger and more durable synthetic adhesives such as early phenol, resorcinol and urea formaldehydes began to supplant natural glues in wood aircraft manufacture. Around this time however, metal began to replace wood as the dominant material for aircraft manufacture. Aerospace adhesives research and development moved on to focus on metals, primarily aluminum, as the substrates of interest. 

Vorwachs, n. bee glue, propolis, vor-walken, v.t. scour (cloth), -walten, v.i. prevail, prMominate. -walzen, v.t. Metal.) rough down (blooms). 

Ductility and malleability. Most metals are ductile (capable of being drawn out into a wire) and malleable (capable of being hammered into thin sheets). In a metal, the electrons act like a flexible glue holding the atomic nuclei together. As a result, metal crystals can be deformed without shattering. 

The main handicap of MD is the knowledge of the function [/( ). There are some systems where reliable approximations to the true (7( r, ) are available. This is, for example, the case of ionic oxides. (7( rJ) is in such a case made of coulombic (pairwise) interactions and short-range terms. A second example is a closed-shell molecular system. In this case the interaction potentials are separated into intraatomic and interatomic parts. A third type of physical system for which suitable approaches to [/( r, ) exist are the transition metals and their alloys. To this class of models belong the glue model and the embedded atom method. Systems where chemical bonds of molecules are broken or created are much more difficult to describe, since the only way to get a proper description of a reaction all the way between reactant and products would be to solve the quantum-mechanical problem at each step of the reaction. 

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