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Etching agent

Acids, in particular, and etching agents, in general, may be mixed with a gelling agent and encapsulated with oils and polymers [713,714]. [Pg.272]

For good aspect ratio and device geometry, anisotropic etching agents have to exhibit a strong difference in etch rate between crystal directions. In a typical KOH solution for single crystal Si, about a two orders of magnitude smaller etch rate in... [Pg.202]

Phosphoric acid is used as an intermediate in the production of animal feed supplements, water treatment chemicals, metal surface treatments, etching agent, and personal care products such as toothpaste. It is used as a catalyst in the petroleum and polymer industry. Phosphoric acid is used in food as a preservative, an acidulant, and flavor enhancer it acidifies carbonated drinks such as Coca Cola and Pepsi, giving them a tangy flavor. Phosphoric acid is used as a rust remover and metal cleaner. Naval Jelly is approximately 25% phosphoric acid. Other uses for phosphoric acid include opacity control in glass production, textile dyeing, rubber latex coagulation, and dental cements. [Pg.220]

A variation of the wire saw that can cut some specimens without deformation or mechanical damage is the acid string saw [13]. This is a wire saw where the abrasive is replaced by an etching agent and the cut occurs from a chemical reaction rather than mechanical abrasion. This is suitable for metals or other reactive solids that have effective etching solutions. Of... [Pg.384]

It is also important to recognize that HFE plasma is a good etching agent for silicon, and the substrate (plasma polymerized TMS) contains silicon. Consequently, the deposition of HFE plasma polymers on the surface might partially etch the loose... [Pg.101]

At the n-GaP anode, the reverse dark current increases upon addition of Br2 to indifferent H2SO4 solution [72], analogously to the increase of the reverse current in the presence of an electroless etching agent, i.e., a hole injector (see Sec. 2.3). Since... [Pg.38]

Figure 4.4 Comparison of the anisotropic etching process with liquid and gaseous (plasma) etching agents. Figure 4.4 Comparison of the anisotropic etching process with liquid and gaseous (plasma) etching agents.

See other pages where Etching agent is mentioned: [Pg.372]    [Pg.148]    [Pg.540]    [Pg.38]    [Pg.881]    [Pg.80]    [Pg.132]    [Pg.267]    [Pg.202]    [Pg.107]    [Pg.113]    [Pg.1504]    [Pg.216]    [Pg.105]    [Pg.372]    [Pg.316]    [Pg.230]    [Pg.266]    [Pg.20]    [Pg.29]    [Pg.203]    [Pg.2]    [Pg.135]    [Pg.145]    [Pg.276]    [Pg.478]    [Pg.503]    [Pg.540]    [Pg.198]    [Pg.555]    [Pg.890]    [Pg.213]    [Pg.207]    [Pg.138]    [Pg.152]    [Pg.214]    [Pg.79]    [Pg.287]    [Pg.540]    [Pg.78]    [Pg.749]    [Pg.267]   
See also in sourсe #XX -- [ Pg.513 ]

See also in sourсe #XX -- [ Pg.226 ]




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