Polyamide epoxy resin

I high 600 = CTI Ceramics, glass Aluminium oxide Epoxy resins Polyamide Polyethylene Polypropylene Silicone rubber... 

For webs, the substrate electrode is usually a vapor-deposited, semitransparent metal layer (Ritchie and Fenn, 1987 Chen, 1993). Al, Ni, and Cr are commonly used. The use of semi-transparent electrodes permits the use of rear exposures for erase purposes. In the case of drums, the metal cylinder serves as the electrode. Usually, a thin, less than 1 pm, blocking layer is interposed between the electrode and the photoreceptor to prevent charge injection. This layer must not be so thick that a residual potential builds up during cycling. Many insulating polymers have been used acrylic polymers, epoxy resins, polyamides, polyesters, polyphosphazenes, polysiloxanes, polyurethanes, vinyl polymers, etc. 

In addition to FRP and adhesives, a third important use of epoxy resins in aerospace is in surface coatings. Epoxy resin-polyamide combinations are used as primers under urethane top coats. The most... 

BSH is used for foaming rubbers, polystyrene, epoxy resins, polyamides, PVC, polyesters, phenol-formaldehyde resins, and polyolefins. However, the thermal decomposition of BSH yields not only nitrogen but also a nontoxic residue (disulfide and thiosulfone) which may degrade to give thiophenol and thus an unpleasant odor to the foams. 

Chem. Descrip. N-Ethyl o/p toluenesulfonamide CAS 80-39-7 EINECS/ELINCS 201-275-1 Uses Plasticizer for adhesives, paints, printing inks, epoxy resins, polyamide resins, phenolics, melamine resins, nitrocellulose lacquers, PVAc, EVA, cellulose acetate Imparts improved adhesion, increased flexibility at lower temps.. Improved gloss, oil resist., stability at higher temps, to adhesives and coatings... 

Uses Curing agent for epoxy resins polyamide comonomer prod, of polyamide fibers... 

Amides can induce the cure of epoxy resins. Polyamides are used in epoxy adhesives. Other epoxy curing agents are listed in Table 2. 

Ablation is the removal of material caused by melting and evaporating. Contrary to general perception, plastics are subject to very little ablation, because they can absorb, dissipate, and store heat - although that involves changes in the material. This property is decisive for their application in heat shields designed for space craft. Polytetrafluoroethene is used for such heat shields, as well as SiOj-fllled phenolic resins or epoxy resin/polyamide combinations filled with SiOz and polyimides, silicones, phosphonitrilic chlorides, and polyboron phosphorous compounds. 

MAJOR POLYMER APPLICATIONS epoxy resin, polyamide, polypropylene, polyurethanes ... 

MAJOR POLYMER APPLICATIONS ABS, acrylics, butene propylene copolymer, cellulose acetate, cellulose acetate butyrate, cyanoacrylate, ethyl cellulose, epoxy resin, polyamide, polyester, polyimide, polymethylmethacrylate, polypropylene, polysulfone, poly(phenylene sulfide), polyvinylbutyral, polyurethane ... 

The two-part epoxy adhesive, readily available in hardware stores or other consumer outlets, comes in two tubes. One tube contains the epoxy resin, the other contains an amine hardener. Common diamine room temperature epoxy curing agents are materials such as the polyamides, available under the trade name Versamid. These polyamides are the reaction products of dimer acids and aUphatic diamines such as diethylenetriamine [111-40-0] ... 

Nonvinyl polymers cured by TAG include polyamides (120), polyamide—polyurethane blends (121), caprolactone polymers (122), terephthalate polymers (123), epoxy resins (124), and acryflc epoxies (125). 

Alkylated and alkenated toluenediamines are used as antioxidants (qv) in oils and elastomers (10,53,63—65), as chemical intermediates for polyamides, polyimides, and polyesterimides (53,1) and as epoxy curatives (53,58,66) (see Epoxy resins). 

The thermoplastic or thermoset nature of the resin in the colorant—resin matrix is also important. For thermoplastics, the polymerisation reaction is completed, the materials are processed at or close to their melting points, and scrap may be reground and remolded, eg, polyethylene, propjiene, poly(vinyl chloride), acetal resins (qv), acryhcs, ABS, nylons, ceUulosics, and polystyrene (see Olefin polymers Vinyl polymers Acrylic ester polymers Polyamides Cellulose ESTERS Styrene polymers). In the case of thermoset resins, the chemical reaction is only partially complete when the colorants are added and is concluded when the resin is molded. The result is a nonmeltable cross-linked resin that caimot be reworked, eg, epoxy resins (qv), urea—formaldehyde, melamine—formaldehyde, phenoHcs, and thermoset polyesters (qv) (see Amino resins and plastics Phenolic resins). 

The bisphenol A-derived epoxy resins are most frequendy cured with anhydrides, aUphatic amines, or polyamides, depending on desired end properties. Some of the outstanding properties are superior electrical properties, chemical resistance, heat resistance, and adhesion. Conventional epoxy resins range from low viscosity Hquids to soHd resins. 

Ambient-cure systems are often based on lower molecular-weight soHd epoxy resins cured with aUphatic polyamines or polyamides. Curing normally occurs at ambient temperatures with a working life (pot life) of 8—24 h, depending on the formulation. Epoxy—poly amine systems are typically used for maintenance coatings in oil refineries, petrochemical plants, and in many marine appHcations. Such coverings are appHed by spray or bmsh. These are used widely where water immersion is encountered, particularly in marine appHcations (see COATINGS, MARINE). 

Elevated temperatures are necessary for cure and the chemical resistance of the laminates is inferior to those from unmodified resins. Because of problems in handling, the polyamides have found only limited use with epoxy resins, mainly for coating and adhesive applications. 

Fig. 5. Examples of ihe correlation between measured adhesive strength and (l+cos6). (a) Plot of data from Raraty and Tabor [171J for adhesion of ice to various solids, (b) Plot of data of Barbaris [172] for adhesion of a mixture of epoxy and polyamide resin to low density poly(ethylene) treated in various ways. Both figures from ref. [31], by permission.

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