Epoxy resins physical properties

The tertiary amine salts are claimed to provide epoxy formulations with very good adhesion to metal. The cured resins also show a hydrophobic effect when in contact with water or at high humidities. The strength, toughness, and elongation (4.7 percent) of the cured epoxy resin are very good. However, heat distortion temperature is only in the range of 70 to 80°C, and chemical resistance is relatively poor for an epoxy. The physical properties fall off rapidly with any rise in temperature. 

Numerous avenues to produce these materials have been explored (128—138). The synthesis of two new fluorinated bicycHc monomers and the use of these monomers to prepare fluorinated epoxies with improved physical properties and a reduced surface energy have been reported (139,140). The monomers have been polymerized with the diglycidyl ether of bisphenol A, and the thermal and mechanical properties of the resin have been characterized. The resulting polymer was stable up to 380°C (10% weight loss by tga). 

Glycidyl and Vinyl Esters. Glycidyl neodecanoate [26761-45-5] sold commercially as GLYDEXXN-10 (Exxon) or as CarduraElO (Shell), is prepared by the reaction of neodecanoic acid and epichl orohydrin under alkaline conditions, followed by purification. Physical properties of the commercially available material are given in Table 3. The material is a mobile Hquid monomer with a mild odor and is used primarily in coatings. Eor example, it is used as an intermediate for the production of a range of alkyd resins (qv) and acryHcs, and as a reactive diluent for epoxy resins (qv). 

Silicon—Ca.rbon Thermoset. The Sycar resins of Hercules are sihcon—carbon thermosets cured through the hydrosilation of sihcon hydride and sihcon vinyl groups with a trace amount of platinum catalyst. The material is a fast-cure system (<15 min at 180°C) and shows low moisture absorption that outperforms conventional thermosets such as polyimides and epoxies. Furthermore, the Sycar material provides excellent mechanical and physical properties used in printed wiring board (PWB) laminates and encapsulants such as flow coatable or glob-top coating of chip-on-board type apphcations. 

Epoxies. The unique chemical and physical properties such as excellent chemical and corrosion resistances, electrical and physical properties, excellent adhesion, thermal insulation, low shrinkage, and reasonable material cost have made epoxy resins (qv) very attractive in electronic apphcations. 

Unless great care is taken in control of phenol/acetone ratios, reaction conditions and the use of catalysts, a number of undesirable by-products may be obtained such as the o-,p- and o-,o- isomers of bis-phenol A and certain chroman-type structures. Although tolerable when the bis-phenol A is used in epoxy resins, these have adverse effects on both physical properties and the colour of polycarbonate resins. 

Composite Particles, Inc. reported the use of surface-modified rubber particles in formulations of thermoset systems, such as polyurethanes, polysulfides, and epoxies [95], The surface of the mbber was oxidized by a proprietary gas atmosphere, which leads to the formation of polar functional groups like —COOH and —OH, which in turn enhanced the dispersibility and bonding characteristics of mbber particles to other polar polymers. A composite containing 15% treated mbber particles per 85% polyurethane has physical properties similar to those of the pure polyurethane. Inclusion of surface-modified waste mbber in polyurethane matrix increases the coefficient of friction. This finds application in polyurethane tires and shoe soles. The treated mbber particles enhance the flexibility and impact resistance of polyester-based constmction materials [95]. Inclusion of treated waste mbber along with carboxyl terminated nitrile mbber (CTBN) in epoxy formulations increases the fracture toughness of the epoxy resins [96]. 

See also Epoxy coatings Epoxy chalcone, 10 450 12,13-Epoxy-cis-9-octadecenoic (vernolic) acid, physical properties, 5 35t Epoxy coatings, 10 436 450 17 845. See also Epoxy can coatings for corrosion protection, 7 199 markets for, 10 442-449 performance of, 10 423 waterborne, 10 439 Epoxy composites, 10 450, 451 Epoxy compounds, photoinitiated polymerization of, 23 716 Epoxy content analysis, 10 385 Epoxy cresol novolac (ECN) resins, 10 367, 369... 

Thus, the cured epoxy resin is a highly functional material whose final chemical, physical, and electrical properties dictate the ultimate utility of that material. 

A detailed discussion of the chemistry, production and physical properties of epoxy resins in terms of their application to molding compounds has recently been given by Helfand and Villani. 

Table 15.5 Thermal and Physical Properties of Epoxy Resins (Typical Values)...

Kinetic models determine the minimum time required to cure the resin (i.e., guarantee sufficient physical and mechanical properties). They also determine the heat of reaction of the resin for use by heat transfer models and the degree of crosslinking for use in viscosity submodels. The exothermic cure reaction for the transformation of the epoxy resin to the cured matrix polymer can be expressed as ... 

The resin systems used in this process are mainly based on methacrylates and acrylates and epoxies.The selection of the resin system depends on the required physical properties. 

This structure has superior water-resistant properties in comparison to conventional polyols used for PU synthesis. Room temperature cures are easily obtained with typical urethane catalysts. Short chain diols, fillers and plasticizers may also be used in their formulations in order to vary physical properties. Formulations usually with NCO/OH ratio of 1.05 are used for this purpose. Such urethanes are reported to be flexible down to about -70 °C. HTPB is regarded as a work horse binder for composite propellants and PBXs. HTPB also successfully competes with widely used room temperature vulcanizing (RTV) silicones and special epoxy resins for the encapsulation of electronic components. HTPB-based PUs are superior in this respect as epoxy resins change their mechanical properties widely with temperature. 

The analysis of epoxy resins has been a particular challenge for the polymer chemist because of the complexity of the repeating units. The multitude of comonomers, the number and type of initiators, the variety of possible polymerization reactions, the insoluble nature of the product and the susceptibility of the network to hydrolysis and other types of chemical attack. Consequently there has been little knowledge of the structural basis of the physical, chemical and ultimate mechanical properties of the epoxy resins. However, it is essential that knowledge of the structures and curing processes be obtained in order to optimize the performance of the epoxy resins. 

We have already discussed the possibility of changes in fractional free-volume being related to the physical structure of polymers. To show this in greater detail, a special study was made102. Hie viscoelastic properties and relaxation time spectra were studied in a filled system where a powder of hardened epoxy resin was used as the filler and the same epoxy resin as the matrix. Thus the system was identical from the chemical point of view, the only difference being in die method of preparation. 

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