Epoxy resin Halogen containing

The cyclic diether, 1,3-dioxolane, is recommended by Ferro Corporation as a more benign solvent substitute for chlorinated organic solvents, such as methylene chloride, 1,2-dichloroethane, and 1,1,1-trichloroethane, and for ketones, such as methyl ethyl ketone (MEK). This ethylene glycol-based ether is a suitable solvent under neutral and basic conditions in several major-use areas. It is a powerful solvent for softening and dissolving polymers made from polar monomers, for example, polycarbonates, acrylates, cellulosics urethanes, phenoUcs, nitriles, urea-formaldehydes, and alkyds, as well as polyesters, vinyl epoxys, and halogen-containing polymers. As a reaction solvent it is added as a component to a special quaternary ammonium or phosphonium salt solution for preparation of a vesicular phenoxy resin. Other beneficial uses for the solvent dioxolane, include ... 

As in polyester resins, reactive halogens containing fire-retardant chemicals are most often used in epoxy materials. Tetrabromobisphenol A is perhaps the most widely used component for flame-retarding epoxy resins. Nara and Matsuyama (24) and Nara et al. (25) described the thermal degradation and flame retardance of tetrabrominated bisphenol A diglycidyl ether compared to the nonbrorainated structure. Their results indicate that bromine acts by vapor-phase as well as condensed-phase mechanisms of flame inhibition. 

The major brominated flame retardant used with epoxy resins is TBBA. This is a reactive halogenated intermediate incorporated during resin preparation. However, other bromine containing species plus phosphorus containing monomers or curing agents may be reacted with the main epoxy resin eomponents during polymerisation. The latter may be alkyl or aryl phosphates. The best appear to be phenyl phosphate derivatives. 

Flame Retardants. Flame retardance can be built into the epoxy resin by use of tetrabromobisphenol A or anhydride curing agents containing phosphorus or halogen. It can also be helped by nonreactive additives such as alumina trihydrate or organo-halogens + antimony oxide. 

Significant effort has recently been put in for the elimination of polymer wastes from electric and electronic equipment (WEEE) by pyrolysis. WEEE includes mainly epoxy resins and styrene polymers. They often contain brominated aromatics, which are highly contaminant. However, their elimination by simple thermal treatments is no longer possible as one of the most important drawbacks in dealing with thermal treatment of WEEE is the likely production of supertoxic halogenated dibenzodiox-ins and dibenzofurans. A pyrolysis method at low temperature range was developed, which limited the formation of such toxic by-products and reduced pyrolysis costs, even at relatively long residence times in the reactor. 

Zinc borate can be used as a fire retardant in PVC, polyolefins, elastomers, polyamides, and epoxy resins. In hal( en-containing systems, it is used in conjunction with antimony oxide, while in halogen-free systems it is normally used in conjunction with other FRs such as aluminum trihydrate, magnesium hydroxide, or red phosphorus. In a small number of specific applications, zinc borate can be used alone. 

Packaging of the chip portion of the chip/lead combined unit into a plastic or ceramic container is a semi-automated process involving the use of epoxy resins, usually epoxy novolak resin formations [15]. These should be fully cured prior to use, but unreacted monomers may be present, which can sensitise, as may other diluent and flame retardant materials, such as halogenated derivatives of bisphenol A, which are added to the resin prior to use. The completed devices are then laser marked in an enclosed system and tested, again in an automated process, prior to delivery for sale. 

Other flame-retardant adhesives contain vi-nylidene chloride latexes, halogenated epoxies, or additives such as diammonium phosphate or ammonium sulfamate. The epoxy resin derived from tetrabromo- or tetrachlorobisphenol A is used in special aircraft adhesives. 

Uses Solvent in coil, container, and automotive coatings, printing inks, acrylic lacquers, enamels, surf, primers for epoxies and polyesters, paint strippers, foundry core binders, resin cleanup, intermediates, industrial cleaners, wire enamel resins Features Offers VOC compliance, noncorrosive Regulatory DOT nonregulated SARA 302, 313 nonreportable Properties APHA 50 max. sweet odor sol. in alcohols, esters, glycol ethers, halogenated soivs., ketones, hydrocarbons sol. 5.5% in water m.w. 160 sp.gr. 1.086 dens. 9.06 Ib/gal vise. 3.88 cps f.p. -40.2 C b.p. 200-220 C acid no. 0.1 flash pt. (PMCC) 102 C surf. tens. 35.4 dynes/ cm 0.1% max. water content... 

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