Electroplating of copper

Consider the electroplating of copper, an established industrial process. It is well known to the expert in the field that fast plating of thick layers can be achieved in a so-called acid bath, which consists of CuSO in H SO (with some additives, which need not concern us at this point). If, on the other hand, one wishes to obtain a smooth and uniform deposit on an intricately shaped body, an alkaline cyanide bath is better. The alkaline bath consists of copper ions in an excess of KCN (kept at high pH, to prevent the formation of volatile and highly poisonous HCN). In this bath copper exists as the negatively charged complex ion [Cu(CN) ]. Now, we recall that to achieve uniform current... 

Cyanide is no longer needed in the electroplating of copper. There are commercially available alternatives. The formaldehyde used in the electroless deposition of copper coatings is carcinogenic. A nonhazardous reductant is... 

Copper is rapidly emerging as the interconnect metal of choice for the next generation of sub-0.25pm devices. It has superior mechanical properties, lower resistivity and higher electromigration resistance when compared to aluminum. Electrochemical deposition (electroless/electroplating) of copper is a versatile, inexpensive and reliable way of filling... 

The electrochemical deposition is carried out through the pores on the metallic layer that coated the back side of the template and is used as a cathode for the electroplating. The micro- and nanomaterials that are produced in this way take the form of wires and tubules. After finishing of the deposition process, the polymer membrane is dissolved in the corresponding solvent, for example, in alkali solution at temperature 70°C-80°C for PET film or in dichloromethane for the PC membrane. The scheme of the ion-track membrane production in thin polymer film and electroplating of copper nanowires within the pores is given in Figure 18.1. 

The polypyrrole layer is then used as an electrode for further electroplating of copper [189] thus it is necessary to deposit highly conducting polypyrroles in order to minimize the resistivity of further electrochemical metallization. It is also important to maintain the conductivity in drastic work limits. 

The German companies Sobering and Blasberg have independently developed and introduced into the market a new technology for electroplating of copper and printed circuit boards based on PP with an Mn02 adhesion promoter. 

El-Sayed H, Greiner MT, Kruse P. (2007) Selective electroplating of copper lines on pre-patterned tantalum oxide thin films. Appl SurfSci 253 8962-8968. 

A British penny is manufactured by electroplating of copper onto mild steel. Figure 2.1 shows data for the deposition of Cu on a steel surface. The current, I, passed at the electrode is measured amperometrically and plotted against experiment time. 

Sulfuric acid (H2SO4) Fertilizer and explosives manufacturing dye and glue production automobile batteries electroplating of copper... 

The deposited films can be used as the substrate for other deposition techniques. For example, electroplating copper directly on titanium is difficult, but PVD-deposited copper on titanium allows subsequent electroplating of copper to the desired thickness. When used in this manner, the PVD film must be stable to the chemical bath used for electroplating. 

The data for silver deposition agree with the calculated line within 0.25%. For deposition of copper the data also follow a straight line, but the slope in this and similar experiments was found to be consistently lower than the calculated slope, by about 6-8%. This deviation from theory was not attributed to the properties of the EQCM. The electroplating of copper is commonly believed to occur in two consecutive charge-transfer steps... 

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