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Electronic Devices chips

Recently commercially available X-ray systems for laminography have a spatial resolution limited to hundred microns, which is not enough for modem multilayer electronic devices and assembles. Modem PCBs, flip-chips, BGA-connections etc. can contain contacts and soldering points of 10 to 20 microns. The classical approach for industrial laminography in electronic applications is shown in Fig.2. [Pg.569]

The purpose of the work by Haddow, Tuf te, and Van Remortel3 is to artificially evolve a design satisfying a predetermined functionality for implementation in a configurable electronic device (or chip), such as a field programmable gate array (or FPGA). [Pg.293]

Flakes, chips, sheets, blocks used for impact protection and damping in the packaging of various products such as cameras, electronic devices. .. [Pg.56]

Silicon is the most technologically important material utilized today owing to its imique role in the fabrication of semiconductor devices and microprocessor chips. The understanding and control of silicon surfaces is of great importance in the production of silicon-based electronic devices, since the fraction of atoms... [Pg.202]

A small amount of boron is added as a dope to silicon transistor chips to facilitate or impede the flow of current over the chip. Boron has just three valence electrons sihcon atoms have four. This dearth of one electron in boron s outer shell allows it to act as a positive hole in the silicon chip that can be filled or left vacant, thus acting as a type of switch in transistors. Many of today s electronic devices depend on these types of doped-sihcon semiconductors and transistors. [Pg.177]

Electronic devices that operate using the spin of the electron and not just its electric charge are on the way to becoming a multibillion-dollar industry—and may lead to quantum microchips (4). As progress in the miniaturization of semiconductor electronic devices leads toward chip features smaller than lOOnm in size, device engineers and physicists are inevitably faced with the fast-approaching presence of quantum mechanics—that counterintuitive, and to some mysterious, realm of physics wherein wavelike properties control the behavior of electrons. [Pg.341]

If we place n- and p-type semiconducting crystals in contact (a p-n junction), we create a device that conducts electricity preferentially in one direction this is the basis of action of the semiconductor diodes used in the electronics industry, although specially refined silicon (Section 17.8.2) is usually employed rather than Ge. Transistors and electronic chips are designed using similar basic principles—typically with n-p-n or p-n-p junctions. We consider chemical aspects of electronic devices in more detail in Chapter 19. [Pg.100]

FIGURE 19.4 (a) Purifica- tion of silicon by zone refining. The heater coil sweeps the molten zone and the impurities to the lower end of the rod. After the rod has cooled, the impurities are removed by cutting off the rod s lower end. (b) A rod of ultrapure silicon and silicon wafers cut from the rod. Silicon wafers are used to produce the integrated-circuit chips found in solid-state electronic devices. [Pg.828]

Doped semiconductors are essential components in the modern solid-state electronic devices found in radios, television sets, pocket calculators, and computers. Devices such as transistors, which control electrical signals in these products, are made from M-type and p-type semiconductors. In modern integrated circuits, an amazing number of extremely small devices can be packed into a small space, thus decreasing the size and increasing the speed of electrical equipment. For example, computer microprocessors now contain up to 42 million transistors on a silicon chip with a surface area of about 2 cm2 and are able to execute as many as 1.5 billion instructions per second. [Pg.929]

One advantage of physical vapor deposition is its preciseness. Extremely thin layers, sometimes only a few atoms thick, can be applied to a surface. This deposition process is widely used in the manufacturing of semiconductors, the chip-like circuits used in many electronic devices. [Pg.93]

Semiconductor A generic term for a device that controls electrical signals. It specifically refers to a material (such as silicon, germanium or gallium arsenide) that can be altered either to conduct electrical current or to block its passage. Carbon nanotubes may eventually be used as semiconductors. Semiconductors are partly responsible for the miniaturization of modem electronic devices, as they are vital components in computer memory and processor chips. The manufacture of semiconductors is carried out by small firms, and by industry giants such as Intel and Advanced Micro Devices. [Pg.26]

Over the past three decades, enormous progress has been made in materials and materials processing used to fabricate electronic devices. This progress has made possible an astonishing increase in device complexity and decrease in the dimensions of features used to fabricate the circuit, which, in turn, has led to improved performance and reduced cost per function. Figure 1 illustrates these trends for dynamic random access memory (DRAM), historically the most complex chip produced in terms of feature size and components per chip. [Pg.375]

An integrated circuit (IC), or chip, represents the brains behind all electronic devices. An IC is a compilation of billions of complex subunits such as transistors, resistors, capacitors, and diodes that are all interconnected in a specific manner depending on the desired application. Incredibly, this minute world of microcircuitry is fitted onto the surface of a thin silicon substrate about the size of a fingernail Though ICs have only been used since the early 1970s, consider some of the ways our lives have been changed ... [Pg.162]

There has also been an increased interest in SOI chips,comprising transistors in which a thin insulating layer lies between a thin layer of Si (in the channel region) and the bulk Si substrate (revisit Figure 4.18). This technology is not new in fact, SOI ICs have been used since the 1960s for military and space applications. As the relatively high cost of production continues to decrease, SOI substrates will undoubtedly be important for CMOS ICs within future commercial electronic devices. The insulation... [Pg.176]


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