Electron beam lithography process

Application to image reversal process a)Electron beam lithography... 

Conventional patterning techniques, for example, photolithography and electron beam lithography, are frequently used for fabrication of patterned substrates owing to their capability to produce nanometer features with remarkable perfection. However, the slow process of electron beam lithography has limited most of its application fabricating high-end devices.69,70... 

Ferromagnetic rings are also fabricated by using electron-beam lithography with a lift-off process for pattern transfer [76]. These nanoscale ferromagnetic rings have a smallest outer diameter of 90 nm, inner diameter of 30 nm and thickness of 10 nm. 

Microstructured patterns of PMMA on gold films were generated by electron beam lithography (LEO Gemini DSM 982, and electron beam lithographic system ELPHY, Zeiss Germany). The development process was carried out according to standard procedures. In a first step, the quality of microstructure was probed by SEM. 

Thick organic polymer resist films are used for the conventional lithography. Their thicknesses are dozens to hundreds of nanometers. When a processing size becomes small and enters nanometer order in electron beam lithography, scattering of electrons in a resist causes various problems, such as the proximity effect. The variation in molecular mass of each molecule which forms the resist also reduces the resolution. If the ultrathin resist film of several nanometers thickness will be realized, the lithography of higher resolution will become possible. 

Nanostracturing processes for silicon Photolithographic fabrication X-ray lithography [130] Electron beam lithography [139] Chemical etching [140] Physical and chemical vapor deposition [141]... 

In the model catalysts described so far, the interparticle distances were more or less random, governed by the separation of substrate defects which control the nucleation and growth process of the metal particles (74,101). The position and separation of metal particles can be controlled accurately by electron beam lithography (EBL) (which has also been used to fabricate model catalysts), but the minimum size of the metal aggregates is currently still approximately lOnm. Figure 3g shows an example of a platinum nanoparticle array on Si02 (mean size 28 nm interparticle separation 200 nm) (53,106,107). 

One of the attractive ways to make such model structures is based on lithographic techniques. We devote the next section to two important lithographic fabrication model catalyst methods, namely, electron-beam lithography (EBL) and colloidal lithography (CL). Lithography can be defined as a patterning process whereby an initial pattern is designed as some type of dataset which is subsequently written on the surface of a substrate as an array or ordered... 

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