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Electroless Deposition of Gold

The plating bath consisted of 5 mL of a saturated hydroxylamine hydrochloride solution and 5 mL of a 1 wt% Na3Au(S03)2 solution (sodium gold sulfite was prepared according Ref. [67]). Both solutions were freshly mixed, stirred vigorously and the substrate was dipped into the mixture for 10 min at room temperature. [Pg.134]


Saliba, R., Mingotaud, C., Argoul, F. and Ravaine, S. (2001) Electroless deposition of gold films under organized monolayers. [Pg.257]

Electroless Deposition of Gold. Okinaka (21) verified the mixed-potential theory for the case of electroless gold deposition. Eigure 8.6 shows that the partial cathodic... [Pg.146]

The gold nanotube membranes were prepared via the template synthesis [21,22] method by electroless deposition of gold along the pore walls of a polycarbonate template membrane [19,43]. The template was a commercially available filter (Osmonics), 6 p.m thick, with cylindrical 30 nm diameter pores and 6 x 10 pores per square centimeters of membrane surface area. [Pg.699]

The three amplification procedures used with this functionahzed Au-quartz crystal interface consisted of detection first using avidin and biotin-labelled liposomes, secondly using avidin-Au-nanoparticle conjugate and the catalysed electroless deposition of gold, and thirdly avidin-alkaline phosphatase interaction with 5-bromo-4-chloro-3-indolyl phosphate causing the biocatalysed precipitation of the insoluble product on the piezoelectric crystal. The separation of surface treatment outside the QCM cell coupled with... [Pg.392]

To find the conditions in which the electroless deposition of gold at Ni-P surfaces with an acceptable appearance and adhesion would be possible, the activation of Ni-P substrates with 10% HC1 solution or a mixture of 0.1 M NH4F and sodium sulfamate was investigated. The results showed that only low phosphorus alloys (P content less than 5 wt%) pretreated with ammonium fluoride/sodium sulfamate mixture can be used for a successful electroless gold plating from cyanide solution and hydrazine as a reducing agent.31... [Pg.268]

In the electroless deposition of gold from noncyanide solutions onto Ni-B and Ni-P surfaces, solutions containing thiosulfate and sulfite were used. The composition of a noncyanide solution for electroless deposition of gold used by Kato et al.32 is presented in Table 2. [Pg.268]

Composition of noncyanide solution for electroless deposition of gold used by Kato et al.32... [Pg.268]

It seems that the solution for electroless deposition of gold with ascorbic acid as a reducing agent developed by Sullivan and Kohl34 and presented in Table 3 produces very uniform coating with excellent adhesion, low porosity, good solderability, and very small crystallite size (about 25 nm).29... [Pg.269]

FIGURE 13.4 Scanning electron micrographs and representative illustrations of (a) 2D and (b) 3D NEEs grown by electroless deposition of gold within the pores of a nanoporous polymer membrane. (Reprinted with permission from Gasparac, R., Taft, B.J., Lapierre-Devlin, M.A. et al. Ultrasensitive electrocatalytic DNA detection at two- and three-dimensional nanoelectrodes, J. Am. Chem. Soc., 126, 12270-12271, 2004. Copyright 2004 American Chemical Society.)... [Pg.476]

Malel, E. and D. Mandler. 2008. Localized electroless deposition of gold nanoparticles using scanning electrochemical microscopy./. Electrvchem. Soc. 155 D459-D467. [Pg.652]

Okinaka Y, Kato M (2010) Electroless deposition of gold, fii Schlesinger M, Paunovic M (eds) Modem electroplating, 5th edn. John Wiley Sons, Inc., New York, NY, pp 483 98... [Pg.455]

The principles of electroless deposition on nanoporous membranes are exemplified by the Au deposition method developed in Charles Martin s laboratory" " for the template fabrication of NEEs, nanotubes, and other shaped gold materials. The electroless deposition of gold can be divided in three steps ... [Pg.592]

Early studies on the electroless deposition of gold from a sulfite-thiosulfate bath suggested that the active species was either the thiosulfate complex [54] or a mixed sulfite-thiosulfate complex [55]. In another study [53], the influence of sulfite addition on the cathodic reduction of the thiosulfate complex was shown to cause a negative shift of the reduction potential which was tentatively explained as being due to the formation of a mixed complex or to surface inhibition through sulfite adsorption at the electrode. This polarization effect was confirmed in a later study [56]. [Pg.245]

Electroless Deposition of Gold, Y. Okinaka and M. Kato, in Modem Electroplating, 4th Edition, eds. M. Schlesinger and M. Paunovic, John Wiley Sons, New York, 2000, pp. 705—727. [Pg.272]


See other pages where Electroless Deposition of Gold is mentioned: [Pg.147]    [Pg.141]    [Pg.648]    [Pg.267]    [Pg.267]    [Pg.269]    [Pg.134]    [Pg.445]    [Pg.364]    [Pg.54]    [Pg.410]    [Pg.825]   


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