Electrodeposition nanometer scale

Copper electrodeposition on Au(111) Copper is an interesting metal and has been widely investigated in electrodeposition studies from aqueous solutions. There are numerous publications in the literature on this topic. Furthermore, technical processes to produce Cu interconnects on microchips have been established in aqueous solutions. In general, the quality of the deposits is strongly influenced by the bath composition. On the nanometer scale, one finds different superstmctures in the underpotential deposition regime if different counter-ions are used in the solutions. A co-adsorption between the metal atoms and the anions has been reported. In the underpotential regime, before the bulk deposition begins, one Cu mono-layer forms on Au(lll) [66]. 

As has been shown above, oscillatory electrodeposition is interesting from the point of view of the production of micro- and nanostructured materials. However, in situ observation of the dynamic change of the deposits had been limited to the micrometer scale by use of an optical microscope. Inspections on the nanometer scale were achieved only by ex situ experiments. Thus, information vdth regard to dynamic nanostructural changes of deposits in the course of the oscillatory growth was insufHcient, although it is very important to understand how the macroscopic ordered structures are formed with their molecular- or nano-components in a self-organized manner. 

The third example of new technology with increasing interest is electrodeposition of multilayers. For example, Schlesinger et al. (29) have shown that this technology can be applied to produce systems with nanometer-scale structural and compositional variations. Giant magnetoresistance (GMR) in electrodeposited Ni/Cu and Co/Cu multilayers was reported by Schlesinger et al. (28). Those constructs have a number of immediate applications in the areas of sensors as well as nanometer-scale electronic circuitry. For a more complete reference fist as well as apphcations to date, see the review article by Schwartzacher and Lashmore (30). 

Electrodeposition on the Nanometer Scale In Situ Scanning Tunneling Microscopy... 

Electrodeposition on the Nanometer Scale In Situ Scanning Tunneling Microscopy E / V vs. reduction of the organic cation... 

Firstly, electrodeposition makes it possible to fill lithographically defined cavities with nanometer-scale fidelity. This pattern replication capability has been vividly demonstrated in numerous cases [6], even where the cavity depth significantly exceeds its width. Secondly, higher rates of metal deposition can typically be achieved... 

In the AIREs, the nanometer thin film supported on glassy carbon or other conductive substrates was prepared by convenient electrodeposition method of cyclic voltammetery that led to form nanometer-scale thin film of layered structure. The film of island structure is nevertheless fabricated by evaporation method and employed in the SEIRA. 

Figure 6.2-23(a) shows the STM picture of an about 100 nm thick silicon layer that was electrodeposited at —1600 mV vs. Fc/Fc, probed under potential control with the in situ STM. Its surface is smooth on the nanometer scale and its topography is similar to that of a germanium layer of comparable thickness [79]. Figure 6.2-23(b)... 

Electrodeposition is generally performed near room temperature, avoiding problems with interdiffusion and mismatched thermal expansion coefficients. This makes EC-ALE a good candidate to form superlattices, where the compound deposited is modulated on the nanometer scale. 

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