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Substrate conductive

Figure 13 Interaction between a wide band-gap metal oxide such as Ti02, and an anchored dye molecule such as N3. The dye orbitals are labeled according to dominant components A for Anchor, L for Ligand, and M for metal. The metal oxide valence band (VB), and conduction band (CB) are shown. Sensitizer orbitals are shifted in energy relative to their normal positions, especially those involving the anchor group. Sensitizer orbitals are also broadened if they interact significantly with the substrate conduction band. Figure 13 Interaction between a wide band-gap metal oxide such as Ti02, and an anchored dye molecule such as N3. The dye orbitals are labeled according to dominant components A for Anchor, L for Ligand, and M for metal. The metal oxide valence band (VB), and conduction band (CB) are shown. Sensitizer orbitals are shifted in energy relative to their normal positions, especially those involving the anchor group. Sensitizer orbitals are also broadened if they interact significantly with the substrate conduction band.
On heavy materials (Au. Pt, etc.), the limiting resolution of the microscope can be reached. On a test sample of gold particles on a carbon substrate (conducting sample) a resolution of 7 nm at 35 kV is obtained with a tungsten filament gun and 1.2 nm at 15 kV (see Fig. 7.14) with a field emission gun. The resolution at a voltage of 1 kV is multiplied by a factor equal to the square root of Eq (the resolution reaches 40 nm on a traditional microscope, whilst it is about 5 nm on a field-effect microscope). [Pg.145]

To reduce the thermal stress for components as well as for thermoplastic base substrates, conductive adhesives and selective soldering can be used. In working with adhesives, good interconnections with a maximum temperature of only about lOCfC can be established. This temperature is necessary to harden the epoxy material. In the selective soldering technique, the heat is transferred only to places where interconnections have to be made between the component s termination and the pad on the substrate. This reduces the overall thermal stress situation for the whole 3D MID. [Pg.438]

A method used to prevent charging of the sample during scanning electron microscopic inspection is to coat the sample with a conducting metal such as gold, which is a destructive process as the metal caimot be removed from the surface of the substrate. Conducting polymers that can be spin-appKed onto the sample and subsequently removed cleanly are ideal. Polyanfline has been demonstrated to provide such a solution. [Pg.583]

Flexible electrochromic devices (ECDs) are becoming increasing important for their promising applications in many areas, such as the portable and wearable electronic devices, including smart windows, functional supercapacitors, and flexible displays. Typically, an ECD consists of four parts of substrate, conductive electrode, electrochromic material, and electrolyte. Enormous efforts have been made to improve the flexibility of ECDs including utilizing flexible polymer substrates and conductive materials. [Pg.340]

FIGURE 3.29 Photographs of gray-scale OLEDs that were patterned on PEDOT-PSS surface by inkjet printer on plastic substrates. Conductivities were modified to exhibit the contrasts. [Pg.1213]

Choi, C.Y., Kim, S.J., and Ortega, A. 1994. Effects of substrate conductivity on convective coohng of electronic components. Journal of Electronic Packaging ll6 3) l9S-205. [Pg.1315]

Ristenpart et al. [19] investigated the influence of the substrate conductivity on reversal of Marangoni circulation within evaporating sessile droplet. Despite of plenty assumptions made by the authors, their quantitative criteria for the circulation direction is confirmed by experiments. [Pg.116]

On fully-hydroxylated surfaces, the local density of states is more strongly perturbed, because all the atoms of the substrate top layer take part in the interfacial bonds. The proton and hydroxyl group levels are spread into bands. The surface anion and cation levels are lowered and raised, respectively, due to the electrostatic potential exerted by the hy-droxylation layer, so that the gap width in the LDOS of these atoms is larger than on the free surface. In most cases, it is even wider than in the bulk. Bulk states, thus, constitute the bottom of the substrate conduction band. Depending upon the compounds and the surfaces under consideration, the filled states of the adsorbed 0H , or more precisely the bonding states of the substrate-OH molecule, may be located at various positions relative to the bottom of the conduction band. It is this energy difference which determines the gap width of the hydroxylated... [Pg.192]

Fig. 27 Electrostatic paint transfer efficiency versus substrate conductivity for plaques painted in a test laboratory. Fig. 27 Electrostatic paint transfer efficiency versus substrate conductivity for plaques painted in a test laboratory.
Figure 27 plots the transfer efficiency versus part conductivity for plaques of polymers having various conductivities. For these experiments, transfer efficiencies were evaluated by paint thickness (theoretical yield is calculated based on percent solids in the paint and time of plaque exposure to the paint which is sprayed at a particular delivery rate). A plateau of transfer efficiency versus substrate conductivity occurs in the region of approximately 10 S/cm, which shows that paint transfer efficiency equivalent to that of metal can be observed at levels of polymer conductivity significantly below metallic (35). [Pg.39]


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See also in sourсe #XX -- [ Pg.82 ]

See also in sourсe #XX -- [ Pg.82 ]




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