Electrodeless plating

Uses Buffer in electrodeless plating and textile finishing... 

Sodium acetate anhydrous Sodium diacetate buffer, electrodeless plating Sodium glycolate buffer, electroplating baths Sodium phosphate buffer, emulsions Sodium citrate buffer, explosives Acetamide buffer, eye drops Boric acid... 

A further example is electrodeless plating, where metals such as nickel and copper are plated from solutions containing their ions and a reducing agent (e.g. formaldehyde, hypophosphate, hydrazine) again, the reduction of the cupric or nickel ion and the oxidation of the reducing agent occur at different sites on the metals. 

Hydrazine is a useful reductant for electrodeless plating baths for copper, nickel, cobalt, and silver. 

FIG. 12 SEM pictures of LB monolayers of particles 2 on a glass support, deposited from an aqueous solution containing disodium tetrachloropalladate (cone. 10 mol L and subsequently immersed in a plating bath for electrodeless nickel deposition for (a) 15 and (b) 40 sec. Typical SEM pictures of particle monolayers not subjected to nickel coating are shown in Figure 9. (From Ref. 156.)... 

Gold complexes of alkyl phosphonates and ammonia are additives for high pressure organic lubricants. Their precise structure does not seem to be known.119 Solutions of Na[AuCl4] 2HzO are used in electrodeless gold plating.120... 

Use Pharmaceuticals, reducing agent in electrodeless nickel plating of plastics and metals, lab reagent, substitute for sodium nitrite in smoked meats. 

Fosfornan sodny Phosphinic acid, sodium salt, monohydrate Sodium phosphinate hydrate Sofibex. Used for surface treatment, electrodeless nickel plating. Crystals mp = 90" soluble in H2O (1 g/ml), alcohols, glycerol, insoluble in other organic solvents. Elf Atochem N. Am. 

Storage Keep container tightly closed Uses Corrosion inhibitor reducing agent for electrodeless nickel plating calcium source in animal feed... 

It is clearly essential to separate the formed product from the mandrel without damage to the product and, if possible, to the mandrel since it can then be re-used. This is generally accomplished by using a cathode which is covered by a natural or chemically induced thick oxide layer. Suitable materials include titanium, chromium and steel. For some products, their shape predetermines that a permanent mandrel cannot be used. Non-permanent mandrels have to be constructed of a material which can be removed from the inside of the product and several techniques have been used. The non-permanent mandrel may be made from a low-melting-point metal (e.g. Zn, A1 or their alloys), a metal which may be removed by chemically etching or a non-metallic material (e.g. perspex, PVC or epoxy resins) soluble in organic solvents and plated by electrodeless deposition with a layer of silver or copper to make it conducting. 

Thompson and Mayhan [190] and Liepins and Sakaoku [191]. Polymerization in an electrodeless glow discharge is discussed in Yasuda and Lamaze [192], and the effect of electric field voltage between two metal plates on the polymerization of vinyl chloride is discussed in Volkov et aL [193]. 

Fig. 32.22 Metallization schemes for PCBs. (a) Initial conducting strike layer deposited followed by electrolytic pattern plate-up. (b) All-electrodeless process. In each scheme, the pattern is defined by a photoresist. (A/E/D = apply, expose, develop.) (Courtesy of A. Viehbeck, IBM T. J. Watson Research Center.)...

---