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DRAM operation

Fig. 6 shows the relationship between dissolved solids in boiler water and solids in steam at various dram operating pressures. This correlation agrees reasonably well with both laboratory and field data. If a boiler-water total-solids concentration of 15 ppm is assumed, Fig. 6 indicates that 15 ppb solids would be expected in the steam at 2400 psi (163 atm) drum pressure, while al 2800 psi (190 aim) drum pressure about 75 ppb would be expected in the steam. Fig. 7 indicates the great reduction in silica concentration in boiler water that must occur as pressures increase if silica in the steam is to be limited to 20 ppb. Experience has demonstrated that a concentration of 20 ppb will pass through the superheater and turbine without deposition. This curve is valid tor a boiler water pH of 9.5. At the higher pressures, boiler water additives must be reduced to low levels in order to avoid deposits on turbine parts. [Pg.1742]

The MOSEET has three regions of operation. The cutoff region occurs for V g < Up. In this region, the drain-to-source current is the reverse saturation current of the back-to-back source and drain junctions. This leakage current is small but nonzero and allows charge to leak off capacitors which are isolated by cutoff MOSFETs. Because this is how bits are stored in dynamic memory (DRAM) ceUs, DRAMs must be regularly refreshed to retain their memory. [Pg.352]

Today, dynamic random-access memories (DRAMs) are transistor/capacitor-based semiconductor devices, with access times measured in nanoseconds and very low costs. Core memories were made of magnetic rings not less than a millimetre in diameter, so that a megabyte of memory would have occupied square metres, while a corresponding DRAM would occupy a few square millimetres. Another version of a DRAM is the read-only memory (ROM), essential for the operation of any computer, and unalterable from the day it is manufactured. We see that developments in magnetic memories involved dramatic reductions in cost and... [Pg.286]

A slurry containing 40 per cent by mass solid is to be filtered on a rotary dram filter 2 m diameter and 2 m long which normally operates with 40 per cent of its surface immersed in the slurry and under a pressure of 17 kN/m2. A laboratory test on a sample of the slurry using a leaf filter of area 200 cm2 and covered with a similar cloth to that on the drum produced 300 cm3 of filtrate in the first 60 s and 140 cm3 in the next 60 s, when the leaf was under an absolute pressure of 17 kN/m2. The bulk density of the dry cake was 1500 kg/m3 and the density of the filtrate was 1000 kg/m3. The minimum thickness of cake which could be readily removed from the cloth was 5 mm. [Pg.423]

Toluene and olefinic stock from storage are pumped (at 80°F) separately through individual driers and filters into the alkylation reactor. The streams combine just before they enter the reactor. The reactor is batch operated 4 hr/cycle it is equipped with a single impeller agitator and a feed hopper for solid aluminum chloride which is charged manually from small drams. The alkylation... [Pg.35]

For non-volatile random access memories (NV-RAMs in which the stored information is retained even if power to the chip is interrupted), ferroelectrics serve not just as capacitors (as in the case of the DRAM, described below), but as the memory element itself. Their principal advantages in this application are low-voltage (1.0 V) operation, small size (about 20% of a conventional EEPROM cell - and cost is proportional to size once high-yield production is achieved), radiation hardness (not just for military applications but also for satellite communications systems) and very high speed (60 ns access time in commercial devices, sub-nanosecond in laboratory tests on single cells). [Pg.330]

Figures 2 and 3 show that the DRAM chip perforMance has been iMproved even though the chip functionality has increased for the accelerated tests used by the seMiconductor industry. The 85 C/85X RH results are better because of a coMbination of iMproveMents in the chip design, the Manufacturing procedures and the epoxy encapsu-lent. The teMperature cycle test results, however, were priMarily improved by converting to a "low stress" epoxy encapsulant. The im-proveMent in the pressure cooker and the 125 C operating life (Figure 3) was also due to a coMbination of iMproveMents, including those in the epoxy encapsulant. These iMproveMents in device reliability are especially reMarkable when it is realized that the chip susceptibility to contaminants and stress has increased tremendously due to the 60-fold increase to functionality. Figures 2 and 3 show that the DRAM chip perforMance has been iMproved even though the chip functionality has increased for the accelerated tests used by the seMiconductor industry. The 85 C/85X RH results are better because of a coMbination of iMproveMents in the chip design, the Manufacturing procedures and the epoxy encapsu-lent. The teMperature cycle test results, however, were priMarily improved by converting to a "low stress" epoxy encapsulant. The im-proveMent in the pressure cooker and the 125 C operating life (Figure 3) was also due to a coMbination of iMproveMents, including those in the epoxy encapsulant. These iMproveMents in device reliability are especially reMarkable when it is realized that the chip susceptibility to contaminants and stress has increased tremendously due to the 60-fold increase to functionality.
The electrical characteristics of the films should produce stable operation of DRAM devices. The most important electrical properties are a small t, all dielectric loss and low leakage... [Pg.207]

Each cell in a DRAM circuit consists of a transistor and a capacitor. In the operation of a DRAM, information is stored in each memory cell as either the presence or absence of charge on the capacitor. As with most ICs advancements in DRAM memory density and cost are made by scaling the dimensions. However, as capacitor dimensions are scaled, the amount of charge that may be placed on the capacitor is reduced. In order to maintain the integrity of the stored data, it is necessary to mountain the amount of charge that may be stored on the capacitor and hence maintain the capacitance through each successive generation of smaller circuits. [Pg.270]

Figure 1.62 DRAM folded bit-line layout and illustration of its operation. Figure 1.62 DRAM folded bit-line layout and illustration of its operation.
Installing extra off-chip main memory The stacked DRAM and off-chip DRAM have different access delays and thus this approach implies a Non-Uniform Memory Architecture (NIJMA)1231. The operating system has to take charge of the resultant memory management issues. [Pg.62]

Care must be exercised in operating rotary drams so that the hot gas velocity is not too high relative to the size and weight of the granules, as that may cause carry-over into the exhaust (particulate emissions). [Pg.124]

Fig. 10.4-2 Belt and rotating dram dryer operated in co- and countercrrrtent mode. Development of temperatrrre and humidity in the apparatns... Fig. 10.4-2 Belt and rotating dram dryer operated in co- and countercrrrtent mode. Development of temperatrrre and humidity in the apparatns...
If the column is designed with a vapor distillate product, the column operates with a reflux drum pressure of 210psia, which gives a reflux dram temperature of 110°F and permits the use of cooling water in the condenser. If a total condenser were used, the column pressure would have to be 230 psia to give a reflux dram temperature of 110 °F. Of course, higher ethane concentrations in the feed would increase the difference between the operating pressures of total and partial condenser columns. [Pg.192]

A variation of the rotaiy dmm filter is the continuous precoat filter. This type is used for clarification of dilute slurries containing 50-5000 ppm of solids where only very thin unacceptable cakes are foimed on other filters. Design is similar to the standard rotaiy dram with a blade dischatge. Prior to feeding sluny, a precoat layer of filter aid or other solids are applied 75-125 mm diick. Slurry is then fed and solids are trapped in the outer layer of the precoat. A progressively advancing blade cuts the solids plus some of the precoat on each pass. When the blade advances to the imniinum point, the operation must be suspended and the precoat re-established. [Pg.174]

Wisconsin plasnc Dram Tile buys/sells regnnd and someiimes obsolete or surplus virgin resins They operate a cleaning or processing syslem ihat handles post-consumer scrap and make recycled plastic corrugated plastic tubing. They nave been in operaiion lor 15 years. [Pg.183]


See other pages where DRAM operation is mentioned: [Pg.81]    [Pg.81]    [Pg.355]    [Pg.188]    [Pg.286]    [Pg.314]    [Pg.295]    [Pg.355]    [Pg.623]    [Pg.654]    [Pg.52]    [Pg.188]    [Pg.29]    [Pg.700]    [Pg.793]    [Pg.356]    [Pg.831]    [Pg.222]    [Pg.370]    [Pg.316]    [Pg.232]    [Pg.233]    [Pg.628]    [Pg.827]    [Pg.81]    [Pg.17]    [Pg.760]    [Pg.47]    [Pg.174]    [Pg.174]    [Pg.188]    [Pg.234]    [Pg.579]    [Pg.350]   
See also in sourсe #XX -- [ Pg.81 ]




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