Development wafer fabrication process

In the commercial technology of 2004, the copper wires in Intel s Pentium 4 logic chip are produced in their newest 300 mm wafer fabrication facility in Ireland, and are 90 nm wide [3]. The use of strained silicon [4] is one of several approaches tested to modify present silicon-based processes to meet the demands of the development roadmap. Now, considering a typical molecular wire, investigated in our lab with a width of 0.4 nm and a length of 2.5 nm, see Fig. 2.1. Compared to the Pentium 4 chip 300 of such molecules, side-by-side, would span the 90 nm metal line. 

Microfabrication processes have been used successfully to form micro-fuel cells on silicon wafers. Aspects of the design, materials, and forming of a micro-fabricated methanol fuel cell have been presented. The processes yielded reproducible, controlled structures that performed well for liquid feed, direct methanol/Oj saturated solution (1.4 mW cm ) and direct methanol/H O systems (8 mA cm" ). In addition to optimizing micro-fuel cell operating performance, there are many system-level issues to be considered when developing a complete micro power system. These issues include electro-deposition procedure, catalyst loading, channel depth, oxidants supply, and system integration. The micro-fabrication processes that have... 

Concurrently design test structures and develop test models dedicated solely to extracting critical model parameters from electrical precision measurements on the wafer level. Improve fabrication processes using test structures early in the sensor development phase and well in advance of starting production. Eventually, reduce the number of test structures and the wafer space they occupy, optimize testing time and equipment, and then commit a test setup to production. 

The electronics industry has a variety of work processes. Processes in the high end or upstream sectors include semiconductor wafer fabrication, manufacture of printed circuit boards and the assembly of semiconductor devices and printed circuit boards. Relatively few workers work in these operations, which are generally located in the more well-developed countries. 

While the roughness of the polished surface is of very high importance for More Moore because of the further decreasing layer and stracture dimensions, optically flat, that is, mirror-like, surfaces are especially required for MOEMS devices. For mirror stmctures using poly-Si surface micromachining, processes based on those developed for atomically flat surfaces for Si wafer fabrication can be employed successfully. 

Microanalysis systems which are built up in a modular way can be adapted to various applications by exchanging individual modules. Thus, a bigger number of units can be sold and prices reduced. At the Karlsruhe Nuclear Research Center a microfluidic handling module is being developed which will be used in two different microanalysis systems joined with sensor modules. A batch fabrication process has been developed which was used to manufacture micropumps and microvalve systems by assembly of two molded thermoplastic parts and transfer of a polyimide diaphragm from a silicon wafer. 

A batch fabrication process combining the assembly of two molded parts witii die transfer of a diaphragm from a wafer to one of these parts was developed to fabricate micro-pumps [10]. Then it was shown that a similar process can be applied in the manufacture of microvalve systems [11]. This process allows microfluidic components and microfluidic handling modules to be made from a variety of materials with rather conq>lex geo-metries. SkMWifer orim... 

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