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Metal densities

During the temperature ramp period, pressure is applied. How much pressure is applied depends on the adhesive and the type of assembly. Honeycomb assemblies are limited by the compression strength of the honeycomb core, so cure pressure is typically limited to 50 psi for aluminum core of standard density. Metal to metal assemblies can withstand higher pressures and usually have fewer bondline voids when cured at higher pressures. Metal-to-metal assemblies bonded with standard modified epoxies are cured at 90 psi. [Pg.1164]

Tungsten i s a highly refractory, high-density metal. It has excellent chemical resistance except that it oxidizes readily. It is brittle mostly because of impurities and is difficult to form by standard metallurgical processes. It can be produced easily by CVD as a very pure and relatively ductile metal. CVD tungsten is used in many applications and is an important semiconductor metal. Its properties are summarized in Table 6.13. [Pg.171]

C20-0113. On Earth, two posttransition metals, A1 and Pb, are used when low- and high-density metals are desired. Suppose you are transported to a planet elsewhere in our galaxy, where all transition metals are readily available but posttransition metals are rare. Where among the transition metals would you seek a replacement for A1 for low-density uses, and where would you seek a replacement for Pb for high-density uses Explain your reasoning. [Pg.1496]

Li — alkali metal. Metallic bonds present (cations, mobile electrons). Low-density metal. [Pg.109]

At very low adsorption densities, metal ion adsorption exhibits Langmuiriaij behavior. However, above some critical adsorption density, r (i.e., when approximately 0.01% of surface sites are occupied), the intensity of metal lon/interactions decreases with increasing surface-site occupancy. A corollary of this model is that K has a unique value at adsorption densities below r for a specific adsorbate and adsorbent. By extension, 0a[Pg.181]

General dilution ventilation has the advantage of being relatively cheap to install and operate, but it is most effective only in the control of small quantities of mild to moderately toxic gases, mists, and fumes. It does not eliminate exposure, however, and it does not specifically control the exposure of the worker at the source. Furthermore, because of their relative density, it does not control heavy particulates or high density metal fumes, nor can it compensate for local changes in the generation of contaminants. [Pg.132]

Screening in metals is very effident even the low-density metal sodium with rs — 4 au has a Thomas-Fermi screening length as small as 1.3 au. [Pg.139]

Heat Transfer The movement and dispersion of heat by conduction, convection, or radiation. Heavy Metals High-density metallic elements generally toxic to plant and animal life in low concentrations (e.g. mercury, chromium, cadmium, arsenic, and lead). [Pg.239]

Mechanical Properties. One interesting example is electroless Ni(P). Electroless Ni(P) is harder and has better corrosion resistance than does electrodeposited Ni(P). Nonmagnetic electroless Ni(P), or NiCu(P), is used as underlayer in high-density metallic memory disk fabrication to improve the mechanical nish of the surface. [Pg.157]

The van der Waals scheme is the simplest scheme to describe the spinodal phase separation that has been used to describe the co-existence of a polaronic gas (low density insulating phase) and a polaronic liquid (high density metallic phase) by Emin [1], or for more complex phase separation models including magnetic interactions [2-3],... [Pg.148]

Whether we are referring to music or high-density metals, heavy metal brings to mind a material that plays an essential role in almost every phase of our daily lives. We use metals not only for jewelry but as the structural material for transportation vehicles and most buildings and bridges, and as conductors of electricity and heat. Our entire infrastructure depends on metals. [Pg.274]

An important new application for MOCVD is the deposition of pure metal films for semiconductor integrated circuit applications. Important metals deposited by MOCVD include Al, Cu, CuAl alloys, and W films using precursors listed in Table I. It is expected that this application area for MOCVD will expand rapidly in the next few years as the demand increases for high-density metal interconnects for Si integrated circuit technology. High-purity Al metal films have also been grown by MOCVD. [Pg.424]

In Fig. 5 the correlation-kinetic potential component Wt (z) is plotted. For these densities, the potential is entirely positive, possesses the correct asymptotic structure of Eq. (45) in the vacuum, and exhibits the Bardeen-Friedel oscillations. Once again, thepotential w[ z) is an order of magnitude smaller than the Pauli component Wx (z). For higher density metals (rs < 2), the correlation-kinetic contribution to vx(z) will be less significant. It will vanish entirely for the very slowly varying density case for which33,34 vx(z) = Wx (z). [Pg.259]

The physical interpretation of the functional derivative vx(r) shows that it is comprised of a term Wx (r) representative of Pauli correlations, and a term wj (r) that constitutes part of the total correlation-kinetic contribution Wt (r). cThe exact asymptotic structure of these components in the vacuum has been determined and shown to also be image-potential-like. Although the structure of vx(r) about the surface and asymptotically in the vacuum and metal-bulk regions is comprised primarily of its Pauli component, the correlation-kinetic contribution is not insignificant for medium and low density metals. It is only for high density systems (rs < 2) that vx(r) is represented essentially by its Pauli component Wx (r). Thus, we see that the uniform electron gas result of -kF/ir for the functional derivative vx(r), which is the asymptotic metal-bulk value, is not a consequence of Pauli correlations alone as is thought to be the case. There is also a small correlation-kinetic contribution. The Pauli and correlation-kinetic contributions have now been quantified. [Pg.268]

The above authors have established that the procedure with the polymeric membrane is not satisfactory. At high current densities, metallic nickel nucleates on the polymeric membrane. Although a reasonable loading of a suspended silica carrier could be achieved, a considerable fraction of the nickel was deposited on the polymeric membrane. The chromia layer method was observed to yield much better results. [Pg.219]

High density. Metals are usually much denser than nonmetals. Sodium, for instance, has a density of 0.97... [Pg.73]

A/cmf Mercury is often referred to in the literature, rather loosely, as a "high-overpotential metal." This is a poorly chosen term, since the overpotential clearly depends on the current density and cannot be said to have a specific value for a particular metal. It would be better to describe the situation by saying that mercury is "a low-exchange-current-density metal." Of course, if the overpotential is compared at a given current density, then it is higher for mercury and similar "high-overpotential metals" than for platinum and other "low-overpotential metals."... [Pg.406]

Materials analyzed by FFF range from high-density metals and low-density latex microspheres to deformable particles such as emulsions and biological cells. The particles need not be spherical since separation is based on effective particle mass. [Pg.277]


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See also in sourсe #XX -- [ Pg.12 ]




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