Curing electrical properties

Sihcones (qv) have an advantage over organic resias ia their superior thermal stabiUty and low dielectric constants. Polyurethanes, when cured, are tough and possess outstanding abrasion and thermal shock resistance. They also have favorable electrical properties and good adhesion to most surfaces. However, polyurethanes are extremely sensitive to and can degrade after prolonged contact with moisture as a result, they are not as commonly used as epoxies and sihcones (see Urethane polymers). 

Some properties are not significantly dependent on cross-linking and remain nearly iavariant as cure progresses. These iaclude thermal conductivity, electrical properties, and low temperature britdeness. 

The compression set of sihcone mbber is similar to organic types of mbber at low (0—50°C) temperatures, ranging from 5 to 15% (380). Above 50°C, sihcone mbber is superior, but compression set increases with time and temperature. Sihcone mbber is more tear-sensitive than butyl mbber, and the degree of sensitivity is a function of filler size and dispersion, cross-link density, and curing conditions. The electrical properties of sihcone mbber are generally superior to organic mbbers and are retained over a temperature range from —50 to 250°C (51). Typical electrical values for a heat-cured sihcone mbber are shown in Table 9. 

The bisphenol A-derived epoxy resins are most frequendy cured with anhydrides, aUphatic amines, or polyamides, depending on desired end properties. Some of the outstanding properties are superior electrical properties, chemical resistance, heat resistance, and adhesion. Conventional epoxy resins range from low viscosity Hquids to soHd resins. 

The polyester alkyd resins are lower in cost than the DAP resins but are weaker mechanically, have a lower resistance to cracking round inserts and do not maintain their electrical properties so well under severe humid conditions. Fast-curing grades are available which will cure in as little as 20 seconds. 

The number of hardening agents used commercially is very large and the final choice will depend on the relative importance of economics, ease of handling, pot life, cure rates, dermatitic effects and the mechanical, chemical, thermal and electrical properties of the cured products. Since these will differ from application to application it is understandable that such a wide range of material is employed. 

A number of different resins are available and the ultimate choice will depend on the end use and proposed method of fabrication. For example, one resin will be recommended for maximum strength and fastest cures whilst another will have the best electrical properties. Some may be suitable for low-pressure laminating whilst others will require a moulding pressure of lOOOlbf/in (7 MPa). 

Epoxy resins have outstanding mechanical and electrical properties, dimensional stability, resistance to heat and chemicals, and adhesion to other materials. They are used for casting, potting, encapsulation, protective coatings, and adhesives. Epoxy glues separate the resin from the curing. igciU to be mixed just prior to use. 

Table II. Electrical Properties of Dry Air Cured Cobalt Chloride Modified Condensation Polyimide Filins...

On the other hand, the alkoxide system presented several problems in formulation. The system first chosen as a model consisted of a trimethoxymethyl silane crosslinker, 8000 centistoke HEB siloxane, and a catalyst. A number of catalysts were used and each exhibited different cure rates and electrical properties. DuPont tetraalkoxytitante-Tyzor appears to he one of the better catalysts used in this type of curing system. Fillers are usually incorporated into the silicone formulation to improve mechanical properties, promote adhesion, and to serve as light screening and pigment agents. Cab-o-sil, a form of fumed silica, carbon-black, titanium dioxide and calcium carbonate are then used as RTV fillers. 

Thus, the cured epoxy resin is a highly functional material whose final chemical, physical, and electrical properties dictate the ultimate utility of that material. 

Hinrichs and Thuen [28] used ultrasonic attenuation to determine the proper time for pressure application during an otherwise traditional pre-established cure cycle. Because dielectric is an electrical property, it is influenced by moisture content and temperature as well as viscosity, so it may vary quantitatively. Ultrasonic measurements are also affected by other parameters (i.e., void content), but they are a mechanical measurement rather than an electric one. The ultrasonic sensors used by Hinrichs unfortunately were less reliable than the dielectric sensors. 

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