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Polished Copper Surfaces

The reflection characteristics for the copper surface polished mechanically and the copper surface polished both mechanically and electrochemically12 are shown in Fig. 9a. [Pg.432]

It can also be seen from Fig. 10b that the topography of the copper surface, polished both mechanically and electrochemically, consists of small and mutually parallel parts of the surface. [Pg.433]

The line sections analysis of the flat parts of the copper surfaces is shown in Fig. 12. The roughness of the flat parts of the copper surface, polished both mechanically and electrochemically, is very small and less than the atomic diameter of copper. For this reason, it can be said that these flat parts of the surface are smooth on the atomic level. The roughness of the flat parts of the copper surface, only polished mechanically, is less than 2 atomic diameters of copper.12 [Pg.436]

X-ray diffraction (XRD) analysis of the copper surface, polished both mechanically and electrochemically, is shown in Fig. 14. As can be seen from Fig. 14, a relatively disordered structure of this copper surface arises, with an increased ratio of copper crystallites oriented in (200), (220) and (311) planes. [Pg.437]


The surface quality of the polished Cu substrate is shown in Fig. 7.22. The polished copper surface has an average surface roughness of 6 A without any signs of corrosion or pitting. This is consistent with the fact that the slurry is well balanced between the chemical and mechanical strengths. This is... [Pg.238]

Surface Uniformity A Sloan Dektak IIA profilometer and a Burleigh (Metris 2000) Atomic Force Microscope (AFM) was used to examine the polished copper surfaces of the wafers. The Dektek Profilometer is capable of a vertical resolution of 5 A°. The stylus radius is 12.5 A . The scanning rate was medium and a length of 250 micron was scanned in each run. The values of... [Pg.137]

You [10] used a high emissivity (0.96) paint to maximize the amount of radiant heat absorbed by the target. Three interrelated studies [105-107] used polished copper surfaces to reduce the effects of flame radiation. In some studies the heat flux gauge surface was coated or treated. [Pg.233]

Following the 50-hour polyacrylic acid run, the evaporator tube was opened for examination while still wet, and showed an apparently clean bright surface over practically the whole length of the tube. Almost immediately, thin flakes or whiskers of a translucent blue film appeared, detaching from the tube to leave a highly polished copper surface. The flakes appeared to be formed by air drying of a plastic film coating the surface. [Pg.65]

Polished copper sheet or copper coin if a drop of mercury(I) nitrate is placed on a polished copper surface, a deposit of mercury metal is formed ... [Pg.70]

Fig. 5 AFM-images of a diamond polished copper surface before exposure (left) and after 24-h exposure to humidified air at 80% relative humidity (right). The formation of many small and equally sized islands (of cuprous oxide) form evidence that the growth rate, rather than the nucleation rate, in this case is the limiting step in the formation process of reaction products. (Reproduced with permission from Ref [11].)... Fig. 5 AFM-images of a diamond polished copper surface before exposure (left) and after 24-h exposure to humidified air at 80% relative humidity (right). The formation of many small and equally sized islands (of cuprous oxide) form evidence that the growth rate, rather than the nucleation rate, in this case is the limiting step in the formation process of reaction products. (Reproduced with permission from Ref [11].)...
TTie rate of heat generation in a conductor is proportional to the square of the current. Both radiation and convection dissipate the heat. Compact arrangements of busbars restrict the opportunities for radiation, and convection usually is more important. Polished copper may be more attractive visually, but keeping the surface free of oxide is counterproductive. The emissivity of a polished copper surface is about 0.05 the emissivity of an oxidized surface is 10 times higher. Aluminum tends to have lower emissivities ( 0.02), but again, heavy oxidation produces a 10-fold increase. Outside surfaces of conductors sometimes are painted to increase the emissivity even more. [Pg.729]

Apart from the question of scale, the nature of the clean surface has a pronounced influence on the rate of boiling. Thus Bonilla and PERRY(79) boiled ethanol at atmospheric pressure and a temperature difference of 23 deg K, and found that the heat flux at atmospheric pressure was 850 kW/m2 for polished copper, 450 for gold plate, and 370 for fresh chromium plate, and only 140 for old chromium plate. This wide fluctuation means that caTe must be taken in anticipating the heat flux, since the high values that may be obtained initially may not persist in practice because of tarnishing of the surface. [Pg.487]

The smoothing down the sharp edges, and polishing the surface of the copper, or other metal, to be silvered. [Pg.861]

Figure 2 is a sketch of the target set-up the effective target is represented by a multipass optical cavity [7] (the mirror surfaces are polished copper), where a C02 laser burst is stored (for about... [Pg.993]

A channel for Th-FFF is relatively simple. It is usually composed of two metallic blocks (with high heat conductivity, preferably copper) with highly polished even surfaces between which a spacer is clamped. The actual dimensions of the metal block are usually 40-60 cm length, 3-6 cm width and a thickness of 2-3 cm. Electrolytic nickel and chromium plating increases the mechanical and corrosion resistance. In both blocks side holes are drilled into which thermistors, which serve for control and regulation of the temperature of both blocks and thus also of the temperature gradient between the two main channel walls, can be inserted. [Pg.109]

Figure 9. The dependence of the degrees of reflection on the wavelength of visible light for a) the ideal reflectance of copper ( ) and the total reflections of the copper surface polished mechanically (o), the copper surface polished both mechanically and electrochemically (A), b) mirror (+) and diffuse (x) reflections of the copper surface polished mechanically mirror ( ) and diffuse (-) reflections of the copper surface polished both mechanically and electrochemically. (Reprinted from Ref. Figure 9. The dependence of the degrees of reflection on the wavelength of visible light for a) the ideal reflectance of copper ( ) and the total reflections of the copper surface polished mechanically (o), the copper surface polished both mechanically and electrochemically (A), b) mirror (+) and diffuse (x) reflections of the copper surface polished mechanically mirror ( ) and diffuse (-) reflections of the copper surface polished both mechanically and electrochemically. (Reprinted from Ref.
Figure 10. 3D STM images of a) the copper surface polished mechanically, b) the copper surface polished both mechanically and electrochemically. Scan size (880 x 880) nm. (Reprinted from Ref.12 with permission from Elsevier.)... Figure 10. 3D STM images of a) the copper surface polished mechanically, b) the copper surface polished both mechanically and electrochemically. Scan size (880 x 880) nm. (Reprinted from Ref.12 with permission from Elsevier.)...

See other pages where Polished Copper Surfaces is mentioned: [Pg.432]    [Pg.433]    [Pg.255]    [Pg.497]    [Pg.497]    [Pg.499]    [Pg.161]    [Pg.108]    [Pg.258]    [Pg.1839]    [Pg.37]    [Pg.432]    [Pg.433]    [Pg.255]    [Pg.497]    [Pg.497]    [Pg.499]    [Pg.161]    [Pg.108]    [Pg.258]    [Pg.1839]    [Pg.37]    [Pg.11]    [Pg.244]    [Pg.252]    [Pg.233]    [Pg.269]    [Pg.65]    [Pg.269]    [Pg.25]    [Pg.70]    [Pg.433]    [Pg.436]    [Pg.439]    [Pg.464]   


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