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Ceramics high-temperature, joining

High-temperature joining of ceramics and of ceramics to metals... [Pg.561]

Therefore, a team, led by the University of Alaska-Fairbanks, was formed to study these practical issues (75), including the composition of the ceramic membrane, seals that would join the ceramic and metal materials, membrane performance, and development of a ceramic that would resist warping and fracturing at the high temperatures of the conversion process. [Pg.333]

Epoxy-phenolic adhesives were developed primarily for bonding metal joints in high-temperature applications. Their first major application was to join major aircraft components. They are also commonly used for bonding glass, ceramics, and phenolic composites. Because of their relatively good flow properties, epoxy phenolics are also used for bonding honeycomb sandwich composites. [Pg.126]

C. A. Lewinsohn, M. Singh, and C. H. Henager, Jr., Brazeless Approaches to Joining of Silicon Carbide-based Ceramics for High Temperature Applications, Ceram. Trans., 138,201 -12 (2003). [Pg.464]

C.A. Lewinsohn, R.H. Jones, T. Nozawa, M. Kotani, Y. Katoh, A. Kohyama, and M. Singh, Silicon Carbide Based Joining Materials for Fusion Energy and Other High-temperature Structural Applications, Ceram. Eng. Sci. Proc., 22, 621-25 (2001). [Pg.465]

M. Singh and R. Asthana, Joining of advanced ultra-high-temperature ZrB2-based ceramic composites using metallic glass interlayers, Mater. Sci. Eng. A. 460-461, 153-162 (2007). [Pg.514]

For high-temperature gas separation applications, leak-free sealing of the ITM module components and parts is essential and requires chemically resistant ceramic-metal and ceramic-ceramic seals with similar mechanical, chemical, and expansion characteristics as the membrane material. Little prior art exists for sealing and joining designs for tonnage-quantity ITM modules. ITM ceramics are susceptible to breakage and will have to be joined preferably without any joint interface property difference, possibly as a routine plant maintenance procedure. [Pg.10]

C except for small area bonding. In addition, flexible bagging material and sealants to operate at these temperatures are a problem. Those companies that have a special need for a high temperature adhesive often develop a material for that particular application and do not rely upon a commercial source. These special needs vary from the joining of electronic elements to the bonding of ceramic components in a missile. It is unlikely that a single... [Pg.462]


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See also in sourсe #XX -- [ Pg.1692 ]




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