Bonding glass

Cyanoacrylates are not recommended for permanent bonding of rubber to glass or glazed ceramics as the cyanoacrylate will de-bond from the glass after a relatively short time (typically 1-6 weeks). 

After channel etching and access-hole forming, the channel plate and cover plate are bonded. Thermal bonding is the major method used, though alternative schemes exist. All glass bonding methods are summarized in Table 2.5. 

Normally, the glass plates are cleaned and dried before thermal bonding. In one report, a special microchip washer was designed which allows simultaneous cleaning of the channel and cover plates [138]. In another report, the two glass plates were brought into contact while wet, then the plates were bonded thermally with pressure (50 g/cm2) [105,747]. 

The glass plates were sandwiched between two polished alumina flats so that weights could be applied on top, and the glass surfaces would remain smooth after thermal bonding [105]. To ensure even heat distribution, the two bonding plates were sandwiched between two Macor ceramic plates [139]. 

To achieve thermal bonding of a glass chip to thin glass (0.17 mm thick), which is not very planar, a matrix of underpinning posts was employed [111]. 

Bonding of glass plates consisting of metal electrodes can be achieved in two ways (i) between an etched glass plate (containing patterned electrodes) and a drilled cover plate or (ii) between an etched glass plate and a drilled cover plate (containing patterned electrodes) [745]. 

---

NL Li O. Thick film resistors are also made from transition-metal oxide soHd solutions. Glass-bonded Bi... 

In addition to the nature of resin and fibre, the laminate properties also depend on the degree of bonding between the two main components and the presence of other additives including air bubbles. Because of this some parts, fabricated by simple hand building techniques, may exhibit strengths no better or even worse than unreinforced materials. This problem is often worst with glass fibres which are therefore normally treated with special finishes to improve the resin-glass bond. 

Moisture Deteriorating effects of moisture are well known as reviewed early in this chapter (OTHER BEHAVIOR, Drying Plastic). Examples for high moisture applications include polyphenylene oxide, polysulfone, acrylic, butyrate, diallyl phthalate, glass-bonded mica, mineral-filled phenolic, chlorotrifluoroethylene, vinylidene, chlorinated polyether chloride, vinylidene fluoride, and fluorocarbon. Diallyl phthalate, polysulfone, and polyphenylene oxide have performed well with moisture/steam on one side and air on the other (a troublesome... 

Mini Femte Slider Maonirwd R iis Wire Wound Coils Glass Bonded Core LXWKH 4X9.2X0.86 mm 55 mg rnass... 

Figure 7.8 (a) Piloted ignition of glass-bonded MPVF and ripping times for unbonded MPVF... 

Mooney, R.D. and McGarry, F.J. (1965). Resin-glass bond study. In Nth Annual Tech. Conf. Reinforced Plast. Composites Inst. SPI, Paper 12E. 

Frank, S. M., Barber, T. L. et al. 2002. Alpha-decay radiation damage study of a glass-bonded sodalite ceramic waste form. Materials Research Society Symposium Proceedings, 713, 487-494. 

Jeong, S. Y., Morss, L. R. Ebert, W. L. 2002. Corrosion of glass-bonded sodalite and its components as a function of pH and temperature. Materials Research Society Symposium Proceedings, 713, 413-420. 

Sinkler, W., O Holleran, T. P., Frank, S. M., Richmann, M. K. Johnson, S. G. 2000. Characterization of glass-bonded ceramic waste form loaded with U and Pu. Materials Research Society Symposium Proceedings, 608, 423-430. 

Zhao, D., Li, L., Davis, L. L., Weber, W. J. Ewing, R. C. 2001. Gadolinium borosilicate glass-bonded Gd-silicate apatite A glass-ceramic nuclear waste form for actinides. Materials Research Society Symposium Proceedings, 663, 199-206. 

Channel etching using HF was usually performed before bonding, but etching could also be achieved after glass bonding (for enlarging some channels) [120,121,671,1065]. 

Microfluidic Lab-on-a-chip for Chemical/Biological Analysis and Discovery 2.2.3 Glass Bonding... 

After glass bonding, solution reservoirs were created over access holes to hold reagents. The reservoirs were formed by various methods. Most commonly, short plastic or glass tubings were glued to the access holes using epoxy resin. Septa... 

Ito, T., Sobue, K., Ohya, S., Water glass bonding for micro-total analysis system. Sensors Actuators B 2002, 81, 187-195. 

Glass-to-metal and glass-to-glass bonding, and jewelry assembly... 

Several kinds of conduction mechanisms are operative in ceramic thermistors, resistors, varistors, and chemical sensors. Negative temperature coefficient (NTC) thermistors make use of the semiconducting properties of heavily doped transition metal oxides such as tf-type Fe2 Ty03 and type Ni1 LyO. Thick film resistors are also made from transition-metal oxide solid solutions. Glass-bonded By 2 Pb2yRu207 having the pyrochlore [12174-36-6] structure is typical. 

In this work, we show that small amounts of water vapor dramatically lower the lateral force required to fiacture the salt-glass bond as the SFM tip is drawn across the particle. We model this decrease in terms of the effect of water vapor on tiie interfticial surfiice energy. Particle size also affects the interfticial shear strength, presumably due to variations in the size of interfacial flaws relative to the total interftice area. 

Composite materials are mechanical dispersions of radioactive solids, for instance ciystalline or vitreous radioactive phases in metal matrix [24], glass-encapsulated Ca-phosphate based ceramics [30] glass-bonded sodalite [31,32] glass-ceramics for plutonium waste immobilization [33] and so on. 

With the development of cermets (ceramic-metallic composites materials) and glassy ceramics, the borderlines between ceramics and metals and ceramics and glasses have become somewhat blurred. Modern ceramics include both materials and products, which range from single crystals and dense polycrystalline materials by way of glass-bonded composites to foams and glassy substances. 

---