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Capacitance oxide film

Figure 13. Schematic presentation of a small segment of polyheteromicrophase SEI (a) and its equivalent circuit (b) A, native oxide film B, LiF or LiCl C, non conducting polymer D, Li2CO, or LiCO, R GB, grain boundary. RA,/ B,RD, ionic resistance of microphase A, B, D. Rc >Rqb charge-transfer resistances at the grain boundary of A to B or A to D, respectively. CA, CB, CD SEI capacitance for each of the particles A to D. Figure 13. Schematic presentation of a small segment of polyheteromicrophase SEI (a) and its equivalent circuit (b) A, native oxide film B, LiF or LiCl C, non conducting polymer D, Li2CO, or LiCO, R GB, grain boundary. RA,/ B,RD, ionic resistance of microphase A, B, D. Rc >Rqb charge-transfer resistances at the grain boundary of A to B or A to D, respectively. CA, CB, CD SEI capacitance for each of the particles A to D.
The origin of the observed correlation was not established, and the relation was not interpreted as causal. It could be argued that a sustained elevated potential due to as-yet unknown microbial processes altered the passive film characteristics, as is known to occur for metals polarized at anodic potentials. If these conditions thickened the oxide film or decreased the dielectric constant to the point where passive film capacitance was on the order of double-layer capacitance (Cji), the series equivalent oxide would have begun to reflect the contribution from the oxide. In this scenario, decreased C would have appeared as a consequence of sustained elevated potential. [Pg.220]

Electric Breakdown in Anodic Oxide Films Physics and Applications of Semiconductor Electrodes Covered with Metal Clusters Analysis of the Capacitance of the Metal-Solution Interface. Role of the Metal and the Metal-Solvent Coupling Automated Methods of Corrosion Measurement... [Pg.247]

The capacitance determined from the initial slopes of the charging curve is about 10/a F/cm2. Taking the dielectric permittivity as 9.0, one could calculate that initially (at the OCP) an oxide layer of the barrier type existed, which was about 0.6 nm thick. A Tafelian dependence of the extrapolated initial potential on current density, with slopes of the order of 700-1000 mV/decade, indicates transport control in the oxide film. The subsequent rise of potential resembles that of barrier-layer formation. Indeed, the inverse field, calculated as the ratio between the change of oxide film thickness (calculated from Faraday s law) and the change of potential, was found to be about 1.3 nm/V, which is in the usual range. The maximum and the subsequent decay to a steady state resemble the behavior associated with pore nucleation and growth. Hence, one could conclude that the same inhomogeneity which leads to pore formation results in the localized attack in halide solutions. [Pg.437]

Figure 7.28 is the EIS of the galena electrode at different potential in the lime medium. The relationship between polarization resistance and potential is presented in Fig. 7.9. The EIS of the galena electrode can be divided into three stages according to the different characters of the surface oxidation film. When the potential is between -70 and 300 mV, capacitive reactance loop radius and polarization resistance increases slowly due to the formation of surface oxidation products, and the growth of surface oxidation film is the controlled step of the... Figure 7.28 is the EIS of the galena electrode at different potential in the lime medium. The relationship between polarization resistance and potential is presented in Fig. 7.9. The EIS of the galena electrode can be divided into three stages according to the different characters of the surface oxidation film. When the potential is between -70 and 300 mV, capacitive reactance loop radius and polarization resistance increases slowly due to the formation of surface oxidation products, and the growth of surface oxidation film is the controlled step of the...
A more complicated model situation is demanded if one thinks of the equivalent circuit for an electrode covered with an oxide film. One might think of A1 and the protective oxide film that grows upon it during anodic polarization. One has to allow for the resistance of the solution, as before. Then there is an equivalent circuit element to model the metal oxide/solution interface, a capacitance and interfacial resistance in parallel. The electrons that enter the oxide by passing across the interfacial region can be shown to go to certain surface states (Section 6.10.1.8) on the oxide surface, and they must be represented. Finally, on the way to the underlying metal, the electron... [Pg.419]

The admittance response at 1 kHz has also been interpreted in terms of the behavior at residual defects in anodic films. This interpretation is based on electron optical characterization, which shows that anodic films contain a distribution of preexisting defects associated with substrate inclusions and mechanical flaws (96,102). In aggressive environments, pits nucleate from these defects and propagate into the metal substrate. In this model, pits are distinct from anodic film flaws, and both can contribute to the measured admittance. Measurements of anodic films exposed to chloride solutions showed that the dissipation factor increased with time, but the capacitance remained nearly constant. Under these conditions, pit propagation at a flaw led to a pit area increase, which increased the resistive component of the admittance, resulting in an increased dissipation factor, but no increase in the capacitance. Measurements at 100 kHz were reflective of the electric double layer and not the components of the oxide film. [Pg.306]

It is all but impossible to prepare any semiconductor electrode without some surface film being present. The III/V semiconductors, for example, will normally possess oxide films whose thickness will vary from less than 10 A to more than 40 A after exposure to air and similar observations have been reported for silicon [77], Although the capacitance of these films will normally be considerably larger than that of the depletion layer, the film may affect the a.c. response both by virtue of the analysis leading to eqn. (72) and, if Css becomes sufficiently large, that the impedance of the depletion layer falls to a value comparable with that of the film. If the film has a finite resistivity, which may be ionic in character, then the equivalent circuit takes the form... [Pg.116]

Applications that have received attention, and the material properties that enable them, are shown in Figure 27.1. These applications are reviewed in detail in Waser and Ramesh. Decoupling capacitors and filters on semiconductor chips, packages, and polymer substrates (e.g., embedded passives ) utilize planar or low aspect ratio oxide films. These films, with thicknesses of 0.1 to 1 J,m, are readily prepared by CSD. Because capacitance density is a key consideration, high-permittivity materials are of interest. These needs may be met by morpho-tropic phase boundary PZT materials, BST, and BTZ (BaTi03-BaZr03) solid solutions. Phase shifters (for phase array antennas) and tunable resonator and filter applications are also enabled by these materials because their effective permittivity exhibits a dependence on the direct current (DC) bias voltage, an effect called tunability. [Pg.530]

This equation holds for the case of small applied voltages when the extension of the scl is smaller than the oxide thickness. Evaluation of the slope of the 1 /C2cl (Arp, ) curve allows for the determination of the product erND. Once the sd reaches completely through the oxide film, the capacitance is determined by df, again yielding the conventional potential independent capacitance C/A = r o/df- A schematic representation of the relevant potential drops as well as the band structure is shown in Figure 1.3 for the case of the Ti/Ti02 system. An example of an illuminated surface (induced photocurrent) is also shown here, which is required later. [Pg.8]

It should be noted, however, that different mechanisms of anodic oxide film formation are operative in acidic and alkaline media. This is clearly suggested by the variation with the film formation potential of the resistance and the inverse of capacitance for anodic oxide films on pure aluminum rod specimens reported by Moon and Pyun (1998) and depicted in Figures 6.14 and 6.15. It should be noted that the... [Pg.132]

FIGURE 6.14 Variation of the reciprocal capacitance and resistance of anodic oxide film on pure aluminum rod specimen with film formation potential in contact with 0.5 M H2SO4 solution. (From Moon and Pyun, 1998. J. Solid State Electrochem. 2, 156-161, with permission.)... [Pg.133]

In these equations, A, , represents the exposed area of the specimen, p,. is the Him resistivity, e is the vacuum permittivity, and Eq/ is the relative permittivity of the metal oxide. Consistently, with such equations, the reciprocal capacitance of anodic aluminum oxide films increases on increasing the formation potential in both alkaline (Figure 6.15) and acidic media (Figure 6.14). This behavior reflects the increase in the film thickness on increasing the formation potential. [Pg.134]

Srinivasan, V., and Weinder, J.W. 2000. Studies on the capacitance of nickel oxide films Effect of heating temperature and electrolyte concentration. Journal of the Electrochemical Society 147, 800-885. [Pg.299]

The anodisation of aluminium is a well-established process [6-10]. For the formation of barrier aluminium oxide films, commonly used electrolytes are citric acid, tartaric acid and ammonium adipate [11]. Barrier films with high capacitance values and breakdown field strength were obtained in tartaric acid ofpH7[8, 12]. [Pg.499]

The capacitance values of the aluminium oxide films formed at various formation current densities are shown in Figure 23.5. The capacitance CPE ) decreases from 0.19 pF/cm, for the film formed at 0.3 mA/cm, to 0.13 pF/cm, for the film formed at 2.5 mA/cm. At higher current densities, the capacitance of the films increases. The capacitance of the aluminium oxide films is much... [Pg.503]

The significant reduction of the resistance i 2 of the aluminium oxide film fi om 166 MQ/cm at 30 V to 8.2 MQ/cm at 100 V could be explained by increasing crystallinity inside the amorphous phase. The resistance of the film decreases from 2.8 MQ/cm at 30 V to 1.6M 2/cm at 100 V. Figure 23.9 shows the effect of the formation voltage on the capacitance and the barrier layer thickness. The capacitance decreases with increasing formation voltage, while the barrier layer thickness approaches a constant value around 40% of total thickness. [Pg.506]

The average capacitance and specific resistivity of the barrier aluminium oxide films are determined to be 430. .. 470nF/cm and 1.3. .. 2.4 10 " Qcm, respectively. By using the anodisation factor of 1.2 nm/V for the films formed at low formation voltage, dielectric constants of 5.8. .. 6.4 are calculated from the measured capacitance values. The comparatively low dielectric constant is in agreement with the formation of an amorphous anodic aluminium oxide film as discussed above rather than a crystalline structure for which a higher dielec-... [Pg.509]

The breakdown field strength was approximately 8 MV/cm. The high capacitance (430. .. 470nF/cm ) and resistivity (1.3. .. 2.4 lO ficm) of the barrier aluminium oxide film were determined. The leakage current density... [Pg.510]

Semiconducting polymer arrays on a chemiresist (capacitance) transducer Metal oxide film arrays on a chemiresist transducer... [Pg.553]


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See also in sourсe #XX -- [ Pg.123 , Pg.128 , Pg.189 ]




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