Electron Microscopy Auger

This technique is most powerful and analyzes the first few atom layers (10 A or less) on the surface of the sample. Many applications include detecting very low concentrations of impurity segregation, which critically affects mechanical properties of some body-centered cubic metals and alloys. 

Auger electron analysis (AES) with the SEM requires appropriate energyanalyzing equipment but more importantly, a much better vacuum system than is currently available in most instruments. Since AES analyzes only the first 

Specimens examined in the SEM mode must be coated with a conductive layer similar to the process in conventional SEM instruments to avoid specimen charging see MacDonald (1971) and Chang (1971) for excellent review articles on AES. 

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A new measurement technique, in-situ atomic force microscopy combined with XPS and scanning Auger electron microscopy and continuous argon sputtering, recently revealed that the films are not uni-... 

Figure 7.4 Schematic comparison of Auger peak intensity with other electrons escaped from a solid surface. E0 indicates energy of incident electrons. The kinetic energy of electrons can be divided into three regions I, II and III from low to high. (Reproduced with permission from M. Prutton and M.M. El Gomati, Scanning Auger Electron Microscopy, John Wiley Sons Ltd, Chichester. 2006 John Wiley Sons.)...

Prutton, M. and El Gomati, M.M. (2006) Scanning Auger Electron Microscopy, John Wiley Sz Sons, Chichester. 

Richard et al. studied a model Pt/Al203 catalyst by transmission electron microscopy and Auger electron microscopy. Oxygen treatments under industrial catalyst regeneration conditions transform a monomodal distribution of platinum particles (mean diameter 1.8 nm) into a bimodal distribution consisting of a phase of particles 10 to 40 nm in diameter and a phase of very small clusters (diameter <1 nm). This observation of stable small clusters is direct evidence for platinum catalyst support interaction. An exchange of water between particles that operate on a molecular scale and might include platinum oxide is postulated. 

Prutton M, El Gomati M (eds) (2006) Scanning auger electron microscopy. Wiley, New York Radiogenic age and isotopic studies Report 1. Edi-tied by Geologic Survey of Canada Staff, National Research Council of Canada NRC Research, 1987 Ready RG (1996) Thermodynamics. Plenum Publishing Company, New York... 

Particle identification Stickle [264, 265] used XPS, ToF-SIMS, and Auger electron microscopy to carry out particle analysis. It is conclnded that XPS has limited utility in this application, but that it can be used as a complementary characterisation tool to ToF-SIMS and AES for particle identification. 

In recent development of the semiconductor industries, thermal oxide film thickness of less than 5 nm has been used in semiconductor devices such as metal-oxide-semiconductor (MOS) structures. Thickness of less than 5 nm is almost near the thickness of a native oxide film on the surface of silicon wafer. Therefore the characterization of ultra thin native oxide film is important in the semiconductor process technology. The secondary electron microscopy (SEM), the scanning Auger electron microscopy (SAM), the atomic force microscopy (AFM) and the X-ray photoelectron spectroscopy (XPS) might be the useful characterization method for the surface of the silicon wafers. 

Prutton M, El Gomati M (eds) (2006) Scanning Auger electron microscopy. Wiley, New York... 

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